頁 186 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FFG1760	Xilinx Inc.	FFG1760 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,184
XCMECH-FFG1738	Xilinx Inc.	FFG1738 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,680
XCMECH-FF1513	Xilinx Inc.	FF1513 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,256
XC17S30AVO8I	Xilinx Inc.	IC PROM SER 300K 8-SOIC Programmable Type: OTP Memory Size: 300kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存69,324
XCZU7CG-2FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存6,320
XCZU7EV-1FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存4,336
XC7Z030-2FBG484E	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 484FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存6,768
XQV600-4BG432N	Xilinx Inc.	IC FPGA 2.5V 600K GATES 432-BGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 316 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存4,800
XQV300-4BG352NES	Xilinx Inc.	IC FPGA 2.5V 300K GATES 352-BGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 260 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存5,808
XC2V6000-4FFG1152I	Xilinx Inc.	IC FPGA 824 I/O 1152FCBGA Number of LABs/CLBs: 8448 Number of Logic Elements/Cells: - Total RAM Bits: 2654208 Number of I/O: 824 Number of Gates: 6000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,704
XCV800-4FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存2,080
XCV600-5FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 512 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存4,784
XCV200-4BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 260 Number of Gates: 236666 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存21,600
XC4028XL-3HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 193 Number of Gates: 28000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存4,096
XC3030A-7PQ100C	Xilinx Inc.	IC FPGA 80 I/O 100QFP Number of LABs/CLBs: 100 Number of Logic Elements/Cells: - Total RAM Bits: 22176 Number of I/O: 80 Number of Gates: 2000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存5,488
XCVU9P-1FSGD2104I	Xilinx Inc.	XCVU9P-1FSGD2104I Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Total RAM Bits: 354201600 Number of I/O: 676 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存4,688
XC5VTX150T-2FF1759C	Xilinx Inc.	IC FPGA 680 I/O 1759FCBGA Number of LABs/CLBs: 11600 Number of Logic Elements/Cells: 148480 Total RAM Bits: 8404992 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存6,176
XC5VLX85T-3FFG1136C	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3981312 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存6,000
XC5VLX85T-1FF1136I	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3981312 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存6,608
XC5VFX30T-2FF665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 2560 Number of Logic Elements/Cells: 32768 Total RAM Bits: 2506752 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存5,504
XC2VP20-5FFG1152I	Xilinx Inc.	IC FPGA 564 I/O 1152FCBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 564 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,504
XC3S1400A-4FG676C	Xilinx Inc.	IC FPGA 502 I/O 676FBGA Number of LABs/CLBs: 2816 Number of Logic Elements/Cells: 25344 Total RAM Bits: 589824 Number of I/O: 502 Number of Gates: 1400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,000
XA3S100E-4TQG144Q	Xilinx Inc.	IC FPGA 108 I/O 144TQFP Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 108 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存4,080
XC3S1200E-4FGG400C	Xilinx Inc.	IC FPGA 304 I/O 400FBGA Number of LABs/CLBs: 2168 Number of Logic Elements/Cells: 19512 Total RAM Bits: 516096 Number of I/O: 304 Number of Gates: 1200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存23,424
XC9572-15TQ100C	Xilinx Inc.	IC CPLD 72MC 15NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-LQFP	庫存26,556
XCR3384XL-10PQ208C	Xilinx Inc.	IC CPLD 384MC 9NS 208QFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 172 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存4,480
XC2C256-7TQG144I	Xilinx Inc.	IC CPLD 256MC 6.7NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 118 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存6,672
XCKU11P-L1FFVD900I	Xilinx Inc.	XCKU11P-L1FFVD900I Number of LABs/CLBs: 37320 Number of Logic Elements/Cells: 653100 Total RAM Bits: 53964800 Number of I/O: 408 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存4,656

XCMECH-FFG1760

Xilinx Inc.

FFG1760 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,184

XCMECH-FFG1738

Xilinx Inc.

FFG1738 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,680

XCMECH-FF1513

Xilinx Inc.

FF1513 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,256

XC17S30AVO8I

Xilinx Inc.

IC PROM SER 300K 8-SOIC

Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存69,324

XCZU7CG-2FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存6,320

XCZU7EV-1FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存4,336

XC7Z030-2FBG484E

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 484FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存6,768

XQV600-4BG432N

Xilinx Inc.

IC FPGA 2.5V 600K GATES 432-BGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 98304
Number of I/O: 316
Number of Gates: 661111
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存4,800

XQV300-4BG352NES

Xilinx Inc.

IC FPGA 2.5V 300K GATES 352-BGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 260
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存5,808

XC2V6000-4FFG1152I

Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

Number of LABs/CLBs: 8448
Number of Logic Elements/Cells: -
Total RAM Bits: 2654208
Number of I/O: 824
Number of Gates: 6000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,704

XCV800-4FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 4704
Number of Logic Elements/Cells: 21168
Total RAM Bits: 114688
Number of I/O: 512
Number of Gates: 888439
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存2,080

XCV600-5FG680I

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 98304
Number of I/O: 512
Number of Gates: 661111
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存4,784

XCV200-4BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 260
Number of Gates: 236666
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存21,600

XC4028XL-3HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Number of LABs/CLBs: 1024
Number of Logic Elements/Cells: 2432
Total RAM Bits: 32768
Number of I/O: 193
Number of Gates: 28000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存4,096

XC3030A-7PQ100C

Xilinx Inc.

IC FPGA 80 I/O 100QFP

Number of LABs/CLBs: 100
Number of Logic Elements/Cells: -
Total RAM Bits: 22176
Number of I/O: 80
Number of Gates: 2000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存5,488

XCVU9P-1FSGD2104I

Xilinx Inc.

XCVU9P-1FSGD2104I

Number of LABs/CLBs: 147780
Number of Logic Elements/Cells: 2586150
Total RAM Bits: 354201600
Number of I/O: 676
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: -
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,688

XC5VTX150T-2FF1759C

Xilinx Inc.

IC FPGA 680 I/O 1759FCBGA

Number of LABs/CLBs: 11600
Number of Logic Elements/Cells: 148480
Total RAM Bits: 8404992
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存6,176

XC5VLX85T-3FFG1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3981312
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存6,000

XC5VLX85T-1FF1136I

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3981312
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存6,608

XC5VFX30T-2FF665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 2560
Number of Logic Elements/Cells: 32768
Total RAM Bits: 2506752
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存5,504

XC2VP20-5FFG1152I

Xilinx Inc.

IC FPGA 564 I/O 1152FCBGA

Number of LABs/CLBs: 2320
Number of Logic Elements/Cells: 20880
Total RAM Bits: 1622016
Number of I/O: 564
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,504

XC3S1400A-4FG676C

Xilinx Inc.

IC FPGA 502 I/O 676FBGA

Number of LABs/CLBs: 2816
Number of Logic Elements/Cells: 25344
Total RAM Bits: 589824
Number of I/O: 502
Number of Gates: 1400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,000

XA3S100E-4TQG144Q

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 108
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存4,080

XC3S1200E-4FGG400C

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

Number of LABs/CLBs: 2168
Number of Logic Elements/Cells: 19512
Total RAM Bits: 516096
Number of I/O: 304
Number of Gates: 1200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存23,424

XC9572-15TQ100C

Xilinx Inc.

IC CPLD 72MC 15NS 100TQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 72
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-LQFP

庫存26,556

XCR3384XL-10PQ208C

Xilinx Inc.

IC CPLD 384MC 9NS 208QFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 172
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存4,480

XC2C256-7TQG144I

Xilinx Inc.

IC CPLD 256MC 6.7NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.7ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 6000
Number of I/O: 118
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存6,672

XCKU11P-L1FFVD900I

Xilinx Inc.

XCKU11P-L1FFVD900I

Number of LABs/CLBs: 37320
Number of Logic Elements/Cells: 653100
Total RAM Bits: 53964800
Number of I/O: 408
Number of Gates: -
Voltage - Supply: 0.698 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存4,656