頁 168 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S40PD8C	Xilinx Inc.	IC PROM PROG C-TEMP 5V 8-DIP Programmable Type: OTP Memory Size: 400kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存8,304
XC17S15ASO20I	Xilinx Inc.	IC PROM SER 5000 I-TEMP 20-SOIC Programmable Type: OTP Memory Size: 150kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存5,024
XC1736EPC20I	Xilinx Inc.	IC PROM SER I-TEMP 36K 20-PLCC Programmable Type: OTP Memory Size: 36kb Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存14,472
XC7Z100-1FFG1156I	Xilinx Inc.	IC SOC CORTEX A-9 ZYNQ7 1156BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存2,304
XC6SLX75-N3FG484C	Xilinx Inc.	IC FPGA 280 I/O 484FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 280 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,792
XCV600E-6HQ240I	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存7,344
XCV3200E-6CG1156C	Xilinx Inc.	IC FPGA 804 I/O 1156CBGA Number of LABs/CLBs: 16224 Number of Logic Elements/Cells: 73008 Total RAM Bits: 851968 Number of I/O: 804 Number of Gates: 4074387 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BCBGA Supplier Device Package: 1156-CBGA (35x35)	封裝: 1156-BCBGA	庫存6,528
XCV300-4PQ240C	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 166 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存8,124
XC4020E-1PG223C	Xilinx Inc.	IC FPGA 192 I/O 223CPGA Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 192 Number of Gates: 20000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Through Hole Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 223-BCPGA Supplier Device Package: 223-CPGA (47.25x47.25)	封裝: 223-BCPGA	庫存6,944
XC3190A-3PC84C	Xilinx Inc.	IC FPGA 70 I/O 84PLCC Number of LABs/CLBs: 320 Number of Logic Elements/Cells: - Total RAM Bits: 64160 Number of I/O: 70 Number of Gates: 6000 Voltage - Supply: 4.25 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存2,128
XC7VX485T-3FFG1157E	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存3,008
XCKU085-2FLVF1924E	Xilinx Inc.	IC FPGA 624 I/O 1924FCBGA Number of LABs/CLBs: 62190 Number of Logic Elements/Cells: 1088325 Total RAM Bits: 58265600 Number of I/O: 624 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存7,968
5962-9957201QYC	Xilinx Inc.	IC FPGA 2.5V HIREL VIRTEX 300 Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 162 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 228-CQFP Supplier Device Package: 228-CQFP (65.53x65.53)	封裝: 228-CQFP	庫存6,912
XC5VLX50-3FFG676C	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 1769472 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存3,648
XC2VP4-6FG256C	Xilinx Inc.	IC FPGA 140 I/O 256FGBGA Number of LABs/CLBs: 752 Number of Logic Elements/Cells: 6768 Total RAM Bits: 516096 Number of I/O: 140 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存2,896
XC2VP2-5FGG256I	Xilinx Inc.	IC FPGA 140 I/O 256FGBGA Number of LABs/CLBs: 352 Number of Logic Elements/Cells: 3168 Total RAM Bits: 221184 Number of I/O: 140 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存4,096
XC7A50T-L1CPG236I	Xilinx Inc.	IC FPGA ARTIX7 106 I/O 236BGA Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 106 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 238-LFBGA, CSPBGA Supplier Device Package: 236-CSBGA (10x10)	封裝: 238-LFBGA, CSPBGA	庫存3,072
XC3S500E-5FT256C	Xilinx Inc.	IC FPGA 190 I/O 256FTBGA Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 190 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存6,448
XC7A15T-2CSG325I	Xilinx Inc.	IC FPGA 150 I/O 325CSBGA Number of LABs/CLBs: 1300 Number of Logic Elements/Cells: 16640 Total RAM Bits: 921600 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 325-CSBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存7,264
XC2S200-5FGG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 176 Number of Gates: 200000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存6,448
XC95288XV-7TQ144C	Xilinx Inc.	IC CPLD 288MC 7.5NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.37 V ~ 2.62 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 117 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存15,288
XCR3256XL-12CS280I	Xilinx Inc.	IC CPLD 256MC 10.8NS 280CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 164 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	封裝: 280-TFBGA, CSPBGA	庫存7,552
XC2C256-7PQ208I	Xilinx Inc.	IC CPLD 256MC 6.7NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 173 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,960
XCR3128XL-10CS144C	Xilinx Inc.	IC CPLD 128MC 9.1NS 144BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 3000 Number of I/O: 108 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存16,524
XC9572XL-10VQ64C	Xilinx Inc.	IC CPLD 72MC 10NS 64VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 52 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-VQFP (10x10)	封裝: 64-TQFP	庫存33,468
XCVU5P-3FLVA2104E	Xilinx Inc.	XCVU5P-3FLVA2104E Number of LABs/CLBs: 75072 Number of Logic Elements/Cells: 1313763 Total RAM Bits: 190976000 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存3,616
XCVU190-H1FLGB2104E	Xilinx Inc.	IC FPGA VIRTEX-U 2104FCBGA Number of LABs/CLBs: 134280 Number of Logic Elements/Cells: 2349900 Total RAM Bits: 150937600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存5,728
XCDAISY-FF1924	Xilinx Inc.	XCDAISY-FF1924 Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,936

XC17S40PD8C

Xilinx Inc.

IC PROM PROG C-TEMP 5V 8-DIP

Programmable Type: OTP
Memory Size: 400kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存8,304

XC17S15ASO20I

Xilinx Inc.

IC PROM SER 5000 I-TEMP 20-SOIC

Programmable Type: OTP
Memory Size: 150kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存5,024

XC1736EPC20I

Xilinx Inc.

IC PROM SER I-TEMP 36K 20-PLCC

Programmable Type: OTP
Memory Size: 36kb
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存14,472

XC7Z100-1FFG1156I

Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 1156BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存2,304

XC6SLX75-N3FG484C

Xilinx Inc.

IC FPGA 280 I/O 484FBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 280
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,792

XCV600E-6HQ240I

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 158
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存7,344

XCV3200E-6CG1156C

Xilinx Inc.

IC FPGA 804 I/O 1156CBGA

Number of LABs/CLBs: 16224
Number of Logic Elements/Cells: 73008
Total RAM Bits: 851968
Number of I/O: 804
Number of Gates: 4074387
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BCBGA
Supplier Device Package: 1156-CBGA (35x35)

封裝: 1156-BCBGA

庫存6,528

XCV300-4PQ240C

Xilinx Inc.

IC FPGA 166 I/O 240QFP

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 166
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存8,124

XC4020E-1PG223C

Xilinx Inc.

IC FPGA 192 I/O 223CPGA

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 192
Number of Gates: 20000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 223-BCPGA
Supplier Device Package: 223-CPGA (47.25x47.25)

封裝: 223-BCPGA

庫存6,944

XC3190A-3PC84C

Xilinx Inc.

IC FPGA 70 I/O 84PLCC

Number of LABs/CLBs: 320
Number of Logic Elements/Cells: -
Total RAM Bits: 64160
Number of I/O: 70
Number of Gates: 6000
Voltage - Supply: 4.25 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存2,128

XC7VX485T-3FFG1157E

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存3,008

XCKU085-2FLVF1924E

Xilinx Inc.

IC FPGA 624 I/O 1924FCBGA

Number of LABs/CLBs: 62190
Number of Logic Elements/Cells: 1088325
Total RAM Bits: 58265600
Number of I/O: 624
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存7,968

5962-9957201QYC

Xilinx Inc.

IC FPGA 2.5V HIREL VIRTEX 300

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 162
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 228-CQFP
Supplier Device Package: 228-CQFP (65.53x65.53)

封裝: 228-CQFP

庫存6,912

XC5VLX50-3FFG676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 1769472
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存3,648

XC2VP4-6FG256C

Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

Number of LABs/CLBs: 752
Number of Logic Elements/Cells: 6768
Total RAM Bits: 516096
Number of I/O: 140
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存2,896

XC2VP2-5FGG256I

Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

Number of LABs/CLBs: 352
Number of Logic Elements/Cells: 3168
Total RAM Bits: 221184
Number of I/O: 140
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存4,096

XC7A50T-L1CPG236I

Xilinx Inc.

IC FPGA ARTIX7 106 I/O 236BGA

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 106
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 238-LFBGA, CSPBGA
Supplier Device Package: 236-CSBGA (10x10)

封裝: 238-LFBGA, CSPBGA

庫存3,072

XC3S500E-5FT256C

Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

Number of LABs/CLBs: 1164
Number of Logic Elements/Cells: 10476
Total RAM Bits: 368640
Number of I/O: 190
Number of Gates: 500000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存6,448

XC7A15T-2CSG325I

Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

Number of LABs/CLBs: 1300
Number of Logic Elements/Cells: 16640
Total RAM Bits: 921600
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 325-CSBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存7,264

XC2S200-5FGG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 176
Number of Gates: 200000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存6,448

XC95288XV-7TQ144C

Xilinx Inc.

IC CPLD 288MC 7.5NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 2.37 V ~ 2.62 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 117
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存15,288

XCR3256XL-12CS280I

Xilinx Inc.

IC CPLD 256MC 10.8NS 280CSP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 10.8ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 6000
Number of I/O: 164
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 280-TFBGA, CSPBGA
Supplier Device Package: 280-CSBGA (16x16)

封裝: 280-TFBGA, CSPBGA

庫存7,552

XC2C256-7PQ208I

Xilinx Inc.

IC CPLD 256MC 6.7NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.7ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 6000
Number of I/O: 173
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,960

XCR3128XL-10CS144C

Xilinx Inc.

IC CPLD 128MC 9.1NS 144BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 3000
Number of I/O: 108
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存16,524

XC9572XL-10VQ64C

Xilinx Inc.

IC CPLD 72MC 10NS 64VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 52
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Supplier Device Package: 64-VQFP (10x10)

封裝: 64-TQFP

庫存33,468

XCVU5P-3FLVA2104E

Xilinx Inc.

XCVU5P-3FLVA2104E

Number of LABs/CLBs: 75072
Number of Logic Elements/Cells: 1313763
Total RAM Bits: 190976000
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.873 V ~ 0.927 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存3,616

XCVU190-H1FLGB2104E

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

Number of LABs/CLBs: 134280
Number of Logic Elements/Cells: 2349900
Total RAM Bits: 150937600
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存5,728

XCDAISY-FF1924

Xilinx Inc.

XCDAISY-FF1924

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,936