頁 147 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S30XLVO8C	Xilinx Inc.	IC 3V PROM SER 300K 8-SOIC Programmable Type: OTP Memory Size: 300kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存4,960
XC18V02VQ44C	Xilinx Inc.	IC PROM SRL FOR 2M GATE 44-VQFP Programmable Type: In System Programmable Memory Size: 2Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存56,628
XCZU7CG-L1FFVC1156I	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存7,792
XCZU2CG-2SBVA484E	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	封裝: 484-BBGA, FCBGA	庫存2,880
XC2V1000-4BG575I	Xilinx Inc.	IC FPGA 328 I/O 575BGA Number of LABs/CLBs: 1280 Number of Logic Elements/Cells: - Total RAM Bits: 737280 Number of I/O: 328 Number of Gates: 1000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 575-BBGA Supplier Device Package: 575-BGA (31x31)	封裝: 575-BBGA	庫存37,200
XC2V1500-6FFG896C	Xilinx Inc.	IC FPGA 528 I/O 896FCBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 528 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存6,864
XC2V1000-6FFG896C	Xilinx Inc.	IC FPGA 432 I/O 896FCBGA Number of LABs/CLBs: 1280 Number of Logic Elements/Cells: - Total RAM Bits: 737280 Number of I/O: 432 Number of Gates: 1000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存4,000
XCV800-6HQ240C	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 166 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存5,600
XCV600-5BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 316 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存36,240
XCV150-6BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 260 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存20,940
XCVU125-1FLVC2104I	Xilinx Inc.	IC FPGA 416 I/O 2104FCBGA Number of LABs/CLBs: 89520 Number of Logic Elements/Cells: 1566600 Total RAM Bits: 90726400 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存6,032
XCVU5P-2FLVA2104E	Xilinx Inc.	XCVU5P-2FLVA2104E Number of LABs/CLBs: 75072 Number of Logic Elements/Cells: 1313763 Total RAM Bits: 172236800 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存3,152
XC5VFX100T-3FF1738C	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 102400 Total RAM Bits: 8404992 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存2,992
XC6VLX240T-L1FFG1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,616
XCKU5P-1FFVD900E	Xilinx Inc.	XCKU5P-1FFVD900E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 35737600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存3,872
XC4VLX60-12FF1148C	Xilinx Inc.	IC FPGA 640 I/O 1148FCBGA Number of LABs/CLBs: 6656 Number of Logic Elements/Cells: 59904 Total RAM Bits: 2949120 Number of I/O: 640 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	封裝: 1148-BBGA, FCBGA	庫存7,568
XC7K325T-2FBG900I	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,104
XC5VLX30-3FFG676C	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 30720 Total RAM Bits: 1179648 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存3,840
XC4VFX12-12SFG363C	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 1368 Number of Logic Elements/Cells: 12312 Total RAM Bits: 663552 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存6,480
XC3S1400A-4FG676I	Xilinx Inc.	IC FPGA 502 I/O 676FBGA Number of LABs/CLBs: 2816 Number of Logic Elements/Cells: 25344 Total RAM Bits: 589824 Number of I/O: 502 Number of Gates: 1400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存4,160
XA7A35T-1CPG236Q	Xilinx Inc.	IC FPGA 106 I/O 236BGA Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33280 Total RAM Bits: 1843200 Number of I/O: 106 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 238-LFBGA, CSPBGA Supplier Device Package: 236-CSBGA (10x10)	封裝: 238-LFBGA, CSPBGA	庫存4,224
XC3S700A-4FGG400I	Xilinx Inc.	IC FPGA 311 I/O 400FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 311 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存2,720
XC2S100-5FGG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 176 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存9,672
XC3S100E-5VQ100C	Xilinx Inc.	IC FPGA 66 I/O 100VQFP Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 66 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存3,920
XC95108-15PQ100C	Xilinx Inc.	IC CPLD 108MC 15NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 108 Number of Gates: 2400 Number of I/O: 81 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存9,444
XC2C32A-4CP56C	Xilinx Inc.	IC CPLD 32MC 3.8NS 56BGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 3.8ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 750 Number of I/O: 33 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 56-LFBGA, CSPBGA Supplier Device Package: 56-CSBGA (6x6)	封裝: 56-LFBGA, CSPBGA	庫存4,912
XAZU3EG-1SFVC784I	Xilinx Inc.	XAZU3EG-1SFVC784I Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BFBGA, FCBGA	庫存4,416
XC7A200T-L2FBV484E	Xilinx Inc.	IC FPGA ARTIX7 484FCBGA Number of LABs/CLBs: 16825 Number of Logic Elements/Cells: 215360 Total RAM Bits: 13455360 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存5,968

XC17S30XLVO8C

Xilinx Inc.

IC 3V PROM SER 300K 8-SOIC

Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存4,960

XC18V02VQ44C

Xilinx Inc.

IC PROM SRL FOR 2M GATE 44-VQFP

Programmable Type: In System Programmable
Memory Size: 2Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存56,628

XCZU7CG-L1FFVC1156I

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存7,792

XCZU2CG-2SBVA484E

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

封裝: 484-BBGA, FCBGA

庫存2,880

XC2V1000-4BG575I

Xilinx Inc.

IC FPGA 328 I/O 575BGA

Number of LABs/CLBs: 1280
Number of Logic Elements/Cells: -
Total RAM Bits: 737280
Number of I/O: 328
Number of Gates: 1000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 575-BBGA
Supplier Device Package: 575-BGA (31x31)

封裝: 575-BBGA

庫存37,200

XC2V1500-6FFG896C

Xilinx Inc.

IC FPGA 528 I/O 896FCBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: -
Total RAM Bits: 884736
Number of I/O: 528
Number of Gates: 1500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存6,864

XC2V1000-6FFG896C

Xilinx Inc.

IC FPGA 432 I/O 896FCBGA

Number of LABs/CLBs: 1280
Number of Logic Elements/Cells: -
Total RAM Bits: 737280
Number of I/O: 432
Number of Gates: 1000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存4,000

XCV800-6HQ240C

Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Number of LABs/CLBs: 4704
Number of Logic Elements/Cells: 21168
Total RAM Bits: 114688
Number of I/O: 166
Number of Gates: 888439
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存5,600

XCV600-5BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 98304
Number of I/O: 316
Number of Gates: 661111
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存36,240

XCV150-6BG352C

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 260
Number of Gates: 164674
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存20,940

XCVU125-1FLVC2104I

Xilinx Inc.

IC FPGA 416 I/O 2104FCBGA

Number of LABs/CLBs: 89520
Number of Logic Elements/Cells: 1566600
Total RAM Bits: 90726400
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存6,032

XCVU5P-2FLVA2104E

Xilinx Inc.

XCVU5P-2FLVA2104E

Number of LABs/CLBs: 75072
Number of Logic Elements/Cells: 1313763
Total RAM Bits: 172236800
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,152

XC5VFX100T-3FF1738C

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 102400
Total RAM Bits: 8404992
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存2,992

XC6VLX240T-L1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,616

XCKU5P-1FFVD900E

Xilinx Inc.

XCKU5P-1FFVD900E

Number of LABs/CLBs: 27120
Number of Logic Elements/Cells: 474600
Total RAM Bits: 35737600
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存3,872

XC4VLX60-12FF1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

Number of LABs/CLBs: 6656
Number of Logic Elements/Cells: 59904
Total RAM Bits: 2949120
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1148-BBGA, FCBGA
Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

庫存7,568

XC7K325T-2FBG900I

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,104

XC5VLX30-3FFG676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 30720
Total RAM Bits: 1179648
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存3,840

XC4VFX12-12SFG363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 1368
Number of Logic Elements/Cells: 12312
Total RAM Bits: 663552
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存6,480

XC3S1400A-4FG676I

Xilinx Inc.

IC FPGA 502 I/O 676FBGA

Number of LABs/CLBs: 2816
Number of Logic Elements/Cells: 25344
Total RAM Bits: 589824
Number of I/O: 502
Number of Gates: 1400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存4,160

XA7A35T-1CPG236Q

Xilinx Inc.

IC FPGA 106 I/O 236BGA

Number of LABs/CLBs: 2600
Number of Logic Elements/Cells: 33280
Total RAM Bits: 1843200
Number of I/O: 106
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 238-LFBGA, CSPBGA
Supplier Device Package: 236-CSBGA (10x10)

封裝: 238-LFBGA, CSPBGA

庫存4,224

XC3S700A-4FGG400I

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存2,720

XC2S100-5FGG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 176
Number of Gates: 100000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存9,672

XC3S100E-5VQ100C

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 66
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存3,920

XC95108-15PQ100C

Xilinx Inc.

IC CPLD 108MC 15NS 100QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 108
Number of Gates: 2400
Number of I/O: 81
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存9,444

XC2C32A-4CP56C

Xilinx Inc.

IC CPLD 32MC 3.8NS 56BGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 3.8ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 750
Number of I/O: 33
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-LFBGA, CSPBGA
Supplier Device Package: 56-CSBGA (6x6)

封裝: 56-LFBGA, CSPBGA

庫存4,912

XAZU3EG-1SFVC784I

Xilinx Inc.

XAZU3EG-1SFVC784I

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BFBGA, FCBGA

庫存4,416

XC7A200T-L2FBV484E

Xilinx Inc.

IC FPGA ARTIX7 484FCBGA

Number of LABs/CLBs: 16825
Number of Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存5,968