頁 135 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17V08VQ44I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 44-VQFP Programmable Type: OTP Memory Size: 8Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存5,856
XC17S100APD8C	Xilinx Inc.	IC PROM SER 100000 C-TEMP 8-DIP Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存4,560
XC17128EVO8C	Xilinx Inc.	IC SERIAL CFG PROM 128K 8-SOIC Programmable Type: OTP Memory Size: 128kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存7,600
XCZU4CG-1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,552
XA2S150E-6FT256I	Xilinx Inc.	IC FPGA 182 I/O 256FTBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 182 Number of Gates: 150000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存7,472
XCV400E-8PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 163840 Number of I/O: 158 Number of Gates: 569952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存3,024
XCV1000E-6HQ240I	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 393216 Number of I/O: 158 Number of Gates: 1569178 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存5,216
XCS30-3PQ208I	Xilinx Inc.	IC FPGA 169 I/O 208QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 169 Number of Gates: 30000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,288
XC4036XL-1HQ304I	Xilinx Inc.	IC FPGA 256 I/O 304HQFP Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 256 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 304-BFQFP Exposed Pad Supplier Device Package: 304-PQFP (40x40)	封裝: 304-BFQFP Exposed Pad	庫存2,688
XC4013XL-3PQ160I	Xilinx Inc.	IC FPGA 129 I/O 160QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 129 Number of Gates: 13000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存5,008
XC4008E-2PC84C	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 61 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存2,240
XCVU080-2FFVC1517E	Xilinx Inc.	IC FPGA 520 I/O 1517FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 520 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,424
XC6VLX195T-2FF1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 15600 Number of Logic Elements/Cells: 199680 Total RAM Bits: 12681216 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,592
XC5VLX110-2FFG1153C	Xilinx Inc.	IC FPGA 800 I/O 1153FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 800 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	封裝: 1153-BBGA, FCBGA	庫存19,212
XC5VFX70T-1FF665I	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存3,424
XC6VLX130T-1FFG784I	Xilinx Inc.	IC FPGA 400 I/O 784FCBGA Number of LABs/CLBs: 10000 Number of Logic Elements/Cells: 128000 Total RAM Bits: 9732096 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (29x29)	封裝: 784-BBGA, FCBGA	庫存6,512
XQ6SLX75T-2FGG676I	Xilinx Inc.	IC FPGA SPARTAN 6 75K 676BGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 348 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存7,776
XQ6SLX75T-2FG484I	Xilinx Inc.	IC FPGA SPARTAN 6 75K 484BGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 268 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,024
XA6SLX45T-2CSG324Q	Xilinx Inc.	IC FPGA 190 I/O 324CSGBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 190 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存7,280
XC3S1000-5FGG320C	Xilinx Inc.	IC FPGA 221 I/O 320 FBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 221 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 320-BGA Supplier Device Package: 320-FBGA (19x19)	封裝: 320-BGA	庫存2,032
XC6SLX25-3FTG256I	Xilinx Inc.	IC FPGA 186 I/O 256FTBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存8,352
XC3S200-4PQ208C	Xilinx Inc.	IC FPGA 141 I/O 208QFP Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 4320 Total RAM Bits: 221184 Number of I/O: 141 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存5,984
XA3S100E-4VQG100Q	Xilinx Inc.	IC FPGA 66 I/O 100VQFP Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 66 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存6,540
XC7S50-2FGGA484I	Xilinx Inc.	XC7S50-2FGGA484I Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,216
XC3S500E-4CPG132C	Xilinx Inc.	IC FPGA 92 I/O 132CSBGA Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 92 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8x8)	封裝: 132-TFBGA, CSPBGA	庫存14,940
XC6SLX75-2CSG484C	Xilinx Inc.	IC FPGA 328 I/O 484CSBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 328 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-FBGA, CSPBGA	庫存15,168
XAZU2EG-1SFVC784I	Xilinx Inc.	XAZU2EG-1SFVC784I Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BFBGA, FCBGA	庫存7,488
XC7A100T-1FG676I	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存7,744

XC17V08VQ44I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

Programmable Type: OTP
Memory Size: 8Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存5,856

XC17S100APD8C

Xilinx Inc.

IC PROM SER 100000 C-TEMP 8-DIP

Programmable Type: OTP
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存4,560

XC17128EVO8C

Xilinx Inc.

IC SERIAL CFG PROM 128K 8-SOIC

Programmable Type: OTP
Memory Size: 128kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存7,600

XCZU4CG-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,552

XA2S150E-6FT256I

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 182
Number of Gates: 150000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存7,472

XCV400E-8PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 10800
Total RAM Bits: 163840
Number of I/O: 158
Number of Gates: 569952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存3,024

XCV1000E-6HQ240I

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Number of LABs/CLBs: 6144
Number of Logic Elements/Cells: 27648
Total RAM Bits: 393216
Number of I/O: 158
Number of Gates: 1569178
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存5,216

XCS30-3PQ208I

Xilinx Inc.

IC FPGA 169 I/O 208QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 169
Number of Gates: 30000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,288

XC4036XL-1HQ304I

Xilinx Inc.

IC FPGA 256 I/O 304HQFP

Number of LABs/CLBs: 1296
Number of Logic Elements/Cells: 3078
Total RAM Bits: 41472
Number of I/O: 256
Number of Gates: 36000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 304-BFQFP Exposed Pad
Supplier Device Package: 304-PQFP (40x40)

封裝: 304-BFQFP Exposed Pad

庫存2,688

XC4013XL-3PQ160I

Xilinx Inc.

IC FPGA 129 I/O 160QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 129
Number of Gates: 13000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存5,008

XC4008E-2PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 61
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存2,240

XCVU080-2FFVC1517E

Xilinx Inc.

IC FPGA 520 I/O 1517FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 520
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,424

XC6VLX195T-2FF1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 15600
Number of Logic Elements/Cells: 199680
Total RAM Bits: 12681216
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,592

XC5VLX110-2FFG1153C

Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 800
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1153-BBGA, FCBGA
Supplier Device Package: 1153-FCBGA (35x35)

封裝: 1153-BBGA, FCBGA

庫存19,212

XC5VFX70T-1FF665I

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 5600
Number of Logic Elements/Cells: 71680
Total RAM Bits: 5455872
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存3,424

XC6VLX130T-1FFG784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

Number of LABs/CLBs: 10000
Number of Logic Elements/Cells: 128000
Total RAM Bits: 9732096
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (29x29)

封裝: 784-BBGA, FCBGA

庫存6,512

XQ6SLX75T-2FGG676I

Xilinx Inc.

IC FPGA SPARTAN 6 75K 676BGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 348
Number of Gates: -
Voltage - Supply: 1.2 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存7,776

XQ6SLX75T-2FG484I

Xilinx Inc.

IC FPGA SPARTAN 6 75K 484BGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 268
Number of Gates: -
Voltage - Supply: 1.2 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,024

XA6SLX45T-2CSG324Q

Xilinx Inc.

IC FPGA 190 I/O 324CSGBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 190
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存7,280

XC3S1000-5FGG320C

Xilinx Inc.

IC FPGA 221 I/O 320 FBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 221
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 320-BGA
Supplier Device Package: 320-FBGA (19x19)

封裝: 320-BGA

庫存2,032

XC6SLX25-3FTG256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

Number of LABs/CLBs: 1879
Number of Logic Elements/Cells: 24051
Total RAM Bits: 958464
Number of I/O: 186
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存8,352

XC3S200-4PQ208C

Xilinx Inc.

IC FPGA 141 I/O 208QFP

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 4320
Total RAM Bits: 221184
Number of I/O: 141
Number of Gates: 200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存5,984

XA3S100E-4VQG100Q

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 66
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存6,540

XC7S50-2FGGA484I

Xilinx Inc.

XC7S50-2FGGA484I

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,216

XC3S500E-4CPG132C

Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

Number of LABs/CLBs: 1164
Number of Logic Elements/Cells: 10476
Total RAM Bits: 368640
Number of I/O: 92
Number of Gates: 500000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 132-TFBGA, CSPBGA
Supplier Device Package: 132-CSPBGA (8x8)

封裝: 132-TFBGA, CSPBGA

庫存14,940

XC6SLX75-2CSG484C

Xilinx Inc.

IC FPGA 328 I/O 484CSBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 328
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

庫存15,168

XAZU2EG-1SFVC784I

Xilinx Inc.

XAZU2EG-1SFVC784I

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BFBGA, FCBGA

庫存7,488

XC7A100T-1FG676I

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存7,744