頁 315 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  315/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGV2010F6M49
TE Connectivity Passive Product

RES SMD 6.49M OHM 1% 1/2W 2010

  • Resistance: 6.49 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,048
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F6M34
TE Connectivity Passive Product

RES SMD 6.34M OHM 1% 1/2W 2010

  • Resistance: 6.34 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,552
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F6M19
TE Connectivity Passive Product

RES SMD 6.19M OHM 1% 1/2W 2010

  • Resistance: 6.19 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,862
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F6M04
TE Connectivity Passive Product

RES SMD 6.04M OHM 1% 1/2W 2010

  • Resistance: 6.04 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,950
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M9
TE Connectivity Passive Product

RES SMD 5.9M OHM 1% 1/2W 2010

  • Resistance: 5.9 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,938
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M76
TE Connectivity Passive Product

RES SMD 5.76M OHM 1% 1/2W 2010

  • Resistance: 5.76 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,074
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M62
TE Connectivity Passive Product

RES SMD 5.62M OHM 1% 1/2W 2010

  • Resistance: 5.62 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,102
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M49
TE Connectivity Passive Product

RES SMD 5.49M OHM 1% 1/2W 2010

  • Resistance: 5.49 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,920
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M36
TE Connectivity Passive Product

RES SMD 5.36M OHM 1% 1/2W 2010

  • Resistance: 5.36 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,588
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M23
TE Connectivity Passive Product

RES SMD 5.23M OHM 1% 1/2W 2010

  • Resistance: 5.23 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,946
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F5M11
TE Connectivity Passive Product

RES SMD 5.11M OHM 1% 1/2W 2010

  • Resistance: 5.11 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,598
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M99
TE Connectivity Passive Product

RES SMD 4.99M OHM 1% 1/2W 2010

  • Resistance: 4.99 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,878
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M87
TE Connectivity Passive Product

RES SMD 4.87M OHM 1% 1/2W 2010

  • Resistance: 4.87 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,232
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M75
TE Connectivity Passive Product

RES SMD 4.75M OHM 1% 1/2W 2010

  • Resistance: 4.75 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,546
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M64
TE Connectivity Passive Product

RES SMD 4.64M OHM 1% 1/2W 2010

  • Resistance: 4.64 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,002
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M53
TE Connectivity Passive Product

RES SMD 4.53M OHM 1% 1/2W 2010

  • Resistance: 4.53 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,246
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M42
TE Connectivity Passive Product

RES SMD 4.42M OHM 1% 1/2W 2010

  • Resistance: 4.42 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,622
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M32
TE Connectivity Passive Product

RES SMD 4.32M OHM 1% 1/2W 2010

  • Resistance: 4.32 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,752
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M22
TE Connectivity Passive Product

RES SMD 4.22M OHM 1% 1/2W 2010

  • Resistance: 4.22 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,798
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M12
TE Connectivity Passive Product

RES SMD 4.12M OHM 1% 1/2W 2010

  • Resistance: 4.12 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,420
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F4M02
TE Connectivity Passive Product

RES SMD 4.02M OHM 1% 1/2W 2010

  • Resistance: 4.02 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,272
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M92
TE Connectivity Passive Product

RES SMD 3.92M OHM 1% 1/2W 2010

  • Resistance: 3.92 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,668
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M83
TE Connectivity Passive Product

RES SMD 3.83M OHM 1% 1/2W 2010

  • Resistance: 3.83 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,014
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M74
TE Connectivity Passive Product

RES SMD 3.74M OHM 1% 1/2W 2010

  • Resistance: 3.74 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,916
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M65
TE Connectivity Passive Product

RES SMD 3.65M OHM 1% 1/2W 2010

  • Resistance: 3.65 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,910
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M57
TE Connectivity Passive Product

RES SMD 3.57M OHM 1% 1/2W 2010

  • Resistance: 3.57 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,696
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M48
TE Connectivity Passive Product

RES SMD 3.48M OHM 1% 1/2W 2010

  • Resistance: 3.48 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,920
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F3M4
TE Connectivity Passive Product

RES SMD 3.4M OHM 1% 1/2W 2010

  • Resistance: 3.4 MOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,580
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-