頁 310 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  310/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGV2010F226K
TE Connectivity Passive Product

RES SMD 226K OHM 1% 1/2W 2010

  • Resistance: 226 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,590
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F221K
TE Connectivity Passive Product

RES SMD 221K OHM 1% 1/2W 2010

  • Resistance: 221 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,874
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F215K
TE Connectivity Passive Product

RES SMD 215K OHM 1% 1/2W 2010

  • Resistance: 215 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,622
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F210K
TE Connectivity Passive Product

RES SMD 210K OHM 1% 1/2W 2010

  • Resistance: 210 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,784
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F205K
TE Connectivity Passive Product

RES SMD 205K OHM 1% 1/2W 2010

  • Resistance: 205 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,544
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F200K
TE Connectivity Passive Product

RES SMD 200K OHM 1% 1/2W 2010

  • Resistance: 200 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,364
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F196K
TE Connectivity Passive Product

RES SMD 196K OHM 1% 1/2W 2010

  • Resistance: 196 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,834
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F191K
TE Connectivity Passive Product

RES SMD 191K OHM 1% 1/2W 2010

  • Resistance: 191 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,732
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F187K
TE Connectivity Passive Product

RES SMD 187K OHM 1% 1/2W 2010

  • Resistance: 187 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,088
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F182K
TE Connectivity Passive Product

RES SMD 182K OHM 1% 1/2W 2010

  • Resistance: 182 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,446
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F178K
TE Connectivity Passive Product

RES SMD 178K OHM 1% 1/2W 2010

  • Resistance: 178 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,208
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F174K
TE Connectivity Passive Product

RES SMD 174K OHM 1% 1/2W 2010

  • Resistance: 174 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,094
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F169K
TE Connectivity Passive Product

RES SMD 169K OHM 1% 1/2W 2010

  • Resistance: 169 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,164
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F165K
TE Connectivity Passive Product

RES SMD 165K OHM 1% 1/2W 2010

  • Resistance: 165 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,236
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F162K
TE Connectivity Passive Product

RES SMD 162K OHM 1% 1/2W 2010

  • Resistance: 162 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,750
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F158K
TE Connectivity Passive Product

RES SMD 158K OHM 1% 1/2W 2010

  • Resistance: 158 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,978
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F154K
TE Connectivity Passive Product

RES SMD 154K OHM 1% 1/2W 2010

  • Resistance: 154 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,526
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F150K
TE Connectivity Passive Product

RES SMD 150K OHM 1% 1/2W 2010

  • Resistance: 150 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,092
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F147K
TE Connectivity Passive Product

RES SMD 147K OHM 1% 1/2W 2010

  • Resistance: 147 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,610
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F143K
TE Connectivity Passive Product

RES SMD 143K OHM 1% 1/2W 2010

  • Resistance: 143 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,348
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F140K
TE Connectivity Passive Product

RES SMD 140K OHM 1% 1/2W 2010

  • Resistance: 140 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,642
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F137K
TE Connectivity Passive Product

RES SMD 137K OHM 1% 1/2W 2010

  • Resistance: 137 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,834
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F133K
TE Connectivity Passive Product

RES SMD 133K OHM 1% 1/2W 2010

  • Resistance: 133 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,060
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F130K
TE Connectivity Passive Product

RES SMD 130K OHM 1% 1/2W 2010

  • Resistance: 130 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,232
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F127K
TE Connectivity Passive Product

RES SMD 127K OHM 1% 1/2W 2010

  • Resistance: 127 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,166
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F124K
TE Connectivity Passive Product

RES SMD 124K OHM 1% 1/2W 2010

  • Resistance: 124 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,570
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F121K
TE Connectivity Passive Product

RES SMD 121K OHM 1% 1/2W 2010

  • Resistance: 121 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,130
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F118K
TE Connectivity Passive Product

RES SMD 118K OHM 1% 1/2W 2010

  • Resistance: 118 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,088
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-