頁 302 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  302/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGH2010F39K2
TE Connectivity Passive Product

RES SMD 39.2K OHM 1% 1W 2010

  • Resistance: 39.2 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,312
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F38K3
TE Connectivity Passive Product

RES SMD 38.3K OHM 1% 1W 2010

  • Resistance: 38.3 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,192
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F37K4
TE Connectivity Passive Product

RES SMD 37.4K OHM 1% 1W 2010

  • Resistance: 37.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,294
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F36K5
TE Connectivity Passive Product

RES SMD 36.5K OHM 1% 1W 2010

  • Resistance: 36.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,436
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F35K7
TE Connectivity Passive Product

RES SMD 35.7K OHM 1% 1W 2010

  • Resistance: 35.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,886
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F34K8
TE Connectivity Passive Product

RES SMD 34.8K OHM 1% 1W 2010

  • Resistance: 34.8 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,608
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F34K
TE Connectivity Passive Product

RES SMD 34K OHM 1% 1W 2010

  • Resistance: 34 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,598
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F33K2
TE Connectivity Passive Product

RES SMD 33.2K OHM 1% 1W 2010

  • Resistance: 33.2 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,348
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F32K4
TE Connectivity Passive Product

RES SMD 32.4K OHM 1% 1W 2010

  • Resistance: 32.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,228
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F31K6
TE Connectivity Passive Product

RES SMD 31.6K OHM 1% 1W 2010

  • Resistance: 31.6 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,024
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F30K9
TE Connectivity Passive Product

RES SMD 30.9K OHM 1% 1W 2010

  • Resistance: 30.9 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,376
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F30K1
TE Connectivity Passive Product

RES SMD 30.1K OHM 1% 1W 2010

  • Resistance: 30.1 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,688
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F29K4
TE Connectivity Passive Product

RES SMD 29.4K OHM 1% 1W 2010

  • Resistance: 29.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,202
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F28K7
TE Connectivity Passive Product

RES SMD 28.7K OHM 1% 1W 2010

  • Resistance: 28.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,174
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F28K
TE Connectivity Passive Product

RES SMD 28K OHM 1% 1W 2010

  • Resistance: 28 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,924
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F27K4
TE Connectivity Passive Product

RES SMD 27.4K OHM 1% 1W 2010

  • Resistance: 27.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,614
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F26K7
TE Connectivity Passive Product

RES SMD 26.7K OHM 1% 1W 2010

  • Resistance: 26.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,526
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F26K1
TE Connectivity Passive Product

RES SMD 26.1K OHM 1% 1W 2010

  • Resistance: 26.1 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,168
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F25K5
TE Connectivity Passive Product

RES SMD 25.5K OHM 1% 1W 2010

  • Resistance: 25.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,724
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F24K9
TE Connectivity Passive Product

RES SMD 24.9K OHM 1% 1W 2010

  • Resistance: 24.9 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,442
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F24K3
TE Connectivity Passive Product

RES SMD 24.3K OHM 1% 1W 2010

  • Resistance: 24.3 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,168
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F23K7
TE Connectivity Passive Product

RES SMD 23.7K OHM 1% 1W 2010

  • Resistance: 23.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,904
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F23K2
TE Connectivity Passive Product

RES SMD 23.2K OHM 1% 1W 2010

  • Resistance: 23.2 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,038
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F22K6
TE Connectivity Passive Product

RES SMD 22.6K OHM 1% 1W 2010

  • Resistance: 22.6 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,634
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F22K1
TE Connectivity Passive Product

RES SMD 22.1K OHM 1% 1W 2010

  • Resistance: 22.1 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,372
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F21K5
TE Connectivity Passive Product

RES SMD 21.5K OHM 1% 1W 2010

  • Resistance: 21.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,364
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F21K
TE Connectivity Passive Product

RES SMD 21K OHM 1% 1W 2010

  • Resistance: 21 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,570
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F20K5
TE Connectivity Passive Product

RES SMD 20.5K OHM 1% 1W 2010

  • Resistance: 20.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,046
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-