頁 293 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  293/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGH2010F93R1
TE Connectivity Passive Product

RES SMD 93.1 OHM 1% 1W 2010

  • Resistance: 93.1 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,664
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F90R9
TE Connectivity Passive Product

RES SMD 90.9 OHM 1% 1W 2010

  • Resistance: 90.9 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,898
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F88R7
TE Connectivity Passive Product

RES SMD 88.7 OHM 1% 1W 2010

  • Resistance: 88.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,316
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F86R6
TE Connectivity Passive Product

RES SMD 86.6 OHM 1% 1W 2010

  • Resistance: 86.6 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,240
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F84R5
TE Connectivity Passive Product

RES SMD 84.5 OHM 1% 1W 2010

  • Resistance: 84.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,786
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F82R5
TE Connectivity Passive Product

RES SMD 82.5 OHM 1% 1W 2010

  • Resistance: 82.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,200
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F80R6
TE Connectivity Passive Product

RES SMD 80.6 OHM 1% 1W 2010

  • Resistance: 80.6 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,670
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F78R7
TE Connectivity Passive Product

RES SMD 78.7 OHM 1% 1W 2010

  • Resistance: 78.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,192
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F76R8
TE Connectivity Passive Product

RES SMD 76.8 OHM 1% 1W 2010

  • Resistance: 76.8 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,798
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F75R
TE Connectivity Passive Product

RES SMD 75 OHM 1% 1W 2010

  • Resistance: 75 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,668
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F73R2
TE Connectivity Passive Product

RES SMD 73.2 OHM 1% 1W 2010

  • Resistance: 73.2 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,454
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F71R5
TE Connectivity Passive Product

RES SMD 71.5 OHM 1% 1W 2010

  • Resistance: 71.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,460
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F69R8
TE Connectivity Passive Product

RES SMD 69.8 OHM 1% 1W 2010

  • Resistance: 69.8 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存6,984
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F68R1
TE Connectivity Passive Product

RES SMD 68.1 OHM 1% 1W 2010

  • Resistance: 68.1 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,866
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F66R5
TE Connectivity Passive Product

RES SMD 66.5 OHM 1% 1W 2010

  • Resistance: 66.5 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,438
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F64R9
TE Connectivity Passive Product

RES SMD 64.9 OHM 1% 1W 2010

  • Resistance: 64.9 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,878
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F63R4
TE Connectivity Passive Product

RES SMD 63.4 OHM 1% 1W 2010

  • Resistance: 63.4 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,146
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F61R9
TE Connectivity Passive Product

RES SMD 61.9 OHM 1% 1W 2010

  • Resistance: 61.9 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,238
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F60R4
TE Connectivity Passive Product

RES SMD 60.4 OHM 1% 1W 2010

  • Resistance: 60.4 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,274
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F59R
TE Connectivity Passive Product

RES SMD 59 OHM 1% 1W 2010

  • Resistance: 59 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存7,326
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F57R6
TE Connectivity Passive Product

RES SMD 57.6 OHM 1% 1W 2010

  • Resistance: 57.6 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,244
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F56R2
TE Connectivity Passive Product

RES SMD 56.2 OHM 1% 1W 2010

  • Resistance: 56.2 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存2,268
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F54R9
TE Connectivity Passive Product

RES SMD 54.9 OHM 1% 1W 2010

  • Resistance: 54.9 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,770
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F53R6
TE Connectivity Passive Product

RES SMD 53.6 OHM 1% 1W 2010

  • Resistance: 53.6 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,166
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F52R3
TE Connectivity Passive Product

RES SMD 52.3 OHM 1% 1W 2010

  • Resistance: 52.3 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存5,598
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F51R1
TE Connectivity Passive Product

RES SMD 51.1 OHM 1% 1W 2010

  • Resistance: 51.1 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存4,608
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F49R9
TE Connectivity Passive Product

RES SMD 49.9 OHM 1% 1W 2010

  • Resistance: 49.9 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存3,204
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F48R7
TE Connectivity Passive Product

RES SMD 48.7 OHM 1% 1W 2010

  • Resistance: 48.7 Ohms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 2010 (5025 Metric)
庫存8,496
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-