頁 5 - Samtec Inc. 產品 - 卡緣連接器 - 邊緣板連接器 | 黑森爾電子
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Samtec Inc. 產品 - 卡緣連接器 - 邊緣板連接器

記錄 253
頁  5/10
圖片
零件編號
製造商
描述
封裝
庫存
數量
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
HSEC8-110-01-S-DV-A-WT-K
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Solder Retention
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存6,858
Female
10
20
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Solder Retention
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
-
Black
-
-
MEC1-120-02-F-D-A-K-TR
Samtec Inc.

1MM MINI-EDGE CARD ASSEMBLY

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 40
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Contact Type: Loop Bellows
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存7,956
Female
-
40
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide
Surface Mount
Solder
Phosphor Bronze
Gold
3µin (0.08µm)
Loop Bellows
Black
-
-55°C ~ 125°C
HSEC8-140-01-S-DV-A-K
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 40
  • Number of Positions: 80
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存4,230
Female
40
80
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-130-01-S-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 30
  • Number of Positions: 60
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存6,336
Female
30
60
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
MEC6-110-02-L-D-RA1-TR
Samtec Inc.

.635MM RIGHT ANGLE EDGE CARD ASS

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.025" (0.64mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount, Right Angle
  • Termination: Solder
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存8,118
Female
10
20
0.062" (1.57mm)
2
0.025" (0.64mm)
Board Guide
Surface Mount, Right Angle
Solder
Phosphor Bronze
Gold
10µin (0.25µm)
-
Black
-
-55°C ~ 125°C
HSEC8-137-01-L-DV-A
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 37
  • Number of Positions: 74
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存7,254
Female
37
74
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-125-01-L-DV-A-L2
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 25
  • Number of Positions: 50
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Latches, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存6,534
Female
25
50
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Latches, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
MEC1-120-02-F-D-A-TR
Samtec Inc.

CONN EDGE DUAL FMALE 40POS 0.039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 40
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Contact Type: Loop Bellows
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存3,276
Female
-
40
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide
Surface Mount
Solder
Phosphor Bronze
Gold
3µin (0.08µm)
Loop Bellows
Black
-
-55°C ~ 125°C
HSEC8-110-01-L-RA-TR
Samtec Inc.

8MM HIGH SPEED DUAL R/A MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount, Right Angle
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存6,354
Female
10
20
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide
Surface Mount, Right Angle
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
MEC1-130-02-F-D-LC
Samtec Inc.

CONN EDGE DUAL FMALE 60POS 0.039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 60
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Lock
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Contact Type: Loop Bellows
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存4,968
Female
-
60
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Lock
Surface Mount
Solder
Phosphor Bronze
Gold
3µin (0.08µm)
Loop Bellows
Black
-
-55°C ~ 125°C
MEC6-110-02-L-DV-A-K-TR
Samtec Inc.

.635MM RIGHT ANGLE EDGE CARD ASS

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.025" (0.64mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存5,220
Female
10
20
0.062" (1.57mm)
2
0.025" (0.64mm)
Board Guide
Surface Mount
Solder
Phosphor Bronze
Gold
10µin (0.25µm)
-
Black
-
-55°C ~ 125°C
HSEC8-160-01-L-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 60
  • Number of Positions: 120
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存5,076
Female
60
120
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-120-01-S-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 20
  • Number of Positions: 40
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存5,976
Female
20
40
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
MEC2-20-01-L-DV-K-TR
Samtec Inc.

MEC2 2.0MM EDGE CARD ASSEMBLY

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 20
  • Number of Positions: 40
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.079" (2.00mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存3,528
Female
20
40
0.062" (1.57mm)
2
0.079" (2.00mm)
Board Guide
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
-
Black
-
-55°C ~ 125°C
HSEC8-130-01-S-DV-A-TR
Samtec Inc.

CONN EDGE DUAL FMALE 60POS 0.031

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 30
  • Number of Positions: 60
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存2,682
Female
30
60
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-130-01-L-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 30
  • Number of Positions: 60
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存5,112
Female
30
60
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-125-01-L-DV-A
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 25
  • Number of Positions: 50
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存8,910
Female
25
50
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-113-01-L-DV-A-L2
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 13
  • Number of Positions: 26
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Latches, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存8,532
Female
13
26
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Latches, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-140-01-S-DV-A-K-TR
Samtec Inc.

CONN EDGE DUAL FMALE 80POS 0.031

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 40
  • Number of Positions: 80
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存8,694
Female
40
80
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
MEC8-110-01-L-DV-A
Samtec Inc.

.8MM MINI-EDGE CARD ASSEMBLY

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Material: Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存3,564
Female
10
20
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide
Through Hole
Press-Fit
Copper
Gold
10µin (0.25µm)
-
Black
-
-55°C ~ 125°C
HSEC8-113-01-S-DV-A
Samtec Inc.

CONN EDGE DUAL FMALE 26POS 0.031

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 13
  • Number of Positions: 26
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存4,446
Female
13
26
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-120-01-L-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 20
  • Number of Positions: 40
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存3,562
Female
20
40
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
MEC1-108-02-F-D-A-TR
Samtec Inc.

CONN EDGE DUAL FMALE 16POS 0.039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 16
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Contact Type: Loop Bellows
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存6,192
Female
-
16
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide
Surface Mount
Solder
Phosphor Bronze
Gold
3µin (0.08µm)
Loop Bellows
Black
-
-55°C ~ 125°C
HSEC8-125-01-S-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 25
  • Number of Positions: 50
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存8,766
Female
25
50
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-110-01-L-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存5,436
Female
10
20
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-120-03-S-DV-A-K-TR
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 20
  • Number of Positions: 40
  • Card Thickness: 0.093" (2.36mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存6,408
Female
20
40
0.093" (2.36mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-110-01-L-DV-A
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 10µin (0.25µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存6,948
Female
10
20
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
10µin (0.25µm)
Cantilever
Black
-
-55°C ~ 125°C
HSEC8-110-01-S-DV-A-K
Samtec Inc.

.8MM HIGH SPEED DUAL VERTICAL MO

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 10
  • Number of Positions: 20
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Beryllium Copper
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 125°C
封裝: -
庫存3,960
Female
10
20
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide, Locking Ramp
Surface Mount
Solder
Beryllium Copper
Gold
30µin (0.76µm)
Cantilever
Black
-
-55°C ~ 125°C