圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Preci-Dip |
CONN HDR 23POS 0.200 T/H
|
封裝: - |
庫存4,824 |
|
Male Pin | 0.200" (5.08mm) | Board to Board | Unshrouded | 23 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.195" (4.95mm) | 0.126" (3.20mm) | - | 0.100" (2.54mm) | Circular | Gold | 29.5µin (0.75µm) | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 31POS 0.100 SMD R/A AU
|
封裝: - |
庫存8,604 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 31 | All | 1 | - | Surface Mount, Right Angle | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.100" (2.54mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 31POS 0.100 SMD GOLD
|
封裝: - |
庫存4,788 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 31 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.116" (2.95mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 21POS 0.100 T/H GOLD
|
封裝: - |
庫存8,154 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 21 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.126" (3.20mm) | 0.846" (21.50mm) | 0.116" (2.95mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 16POS 0.100 T/H
|
封裝: - |
庫存2,970 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 16 | All | 1 | - | Through Hole | Press-Fit, Solder | Push-Pull | 0.141" (3.60mm) | 0.110" (2.79mm) | 0.378" (9.60mm) | 0.272" (6.91mm) | Circular | Gold | 29.5µin (0.75µm) | Tin | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 30POS 1.27MM T/H R/A
|
封裝: - |
庫存6,102 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 30 | All | 2 | 0.050" (1.27mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.118" (3.00mm) | 0.126" (3.20mm) | - | 0.128" (3.25mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 30POS 0.200 T/H GOLD
|
封裝: - |
庫存8,910 |
|
Male Pin | 0.200" (5.08mm) | Board to Board | Unshrouded | 30 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.141" (3.60mm) | 0.114" (2.90mm) | 0.394" (10.00mm) | 0.110" (2.79mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 19POS 2.54 WIRE WRAP
|
封裝: - |
庫存8,442 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 19 | All | 1 | - | Through Hole | Wire Wrap | Push-Pull | 0.147" (3.73mm) | 0.510" (12.95mm) | 0.880" (22.36mm) | 0.116" (2.95mm) | Circular, Square | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 37POS 0.100 T/H
|
封裝: - |
庫存3,114 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 37 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.191" (4.85mm) | 0.121" (3.08mm) | 0.438" (11.12mm) | 0.116" (2.95mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 33POS 2.54MM T/H R/A
|
封裝: - |
庫存8,964 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 33 | All | 3 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.276" (7.00mm) | 0.118" (3.00mm) | - | 0.300" (7.62mm) | Square | Gold | Flash | Gold | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 21POS 2.54MM PRESS FIT
|
封裝: - |
庫存4,626 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 21 | All | 1 | - | Through Hole | Press-Fit, Solder | Push-Pull | 0.141" (3.60mm) | 0.110" (2.79mm) | 0.378" (9.60mm) | 0.116" (2.95mm) | Circular | Gold | 29.5µin (0.75µm) | Tin | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 35POS 0.070 T/H TIN
|
封裝: - |
庫存5,796 |
|
Male Pin | 0.070" (1.78mm) | Board to Board | Unshrouded | 35 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.154" (3.91mm) | 0.163" (4.15mm) | 0.475" (12.07mm) | 0.112" (2.85mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 24POS 0.100 SMD
|
封裝: - |
庫存4,014 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.272" (6.91mm) | Circular | Gold | 29.5µin (0.75µm) | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 24POS 0.100 SMD
|
封裝: - |
庫存3,472 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 24 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.272" (6.91mm) | Circular | Gold | 29.5µin (0.75µm) | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 25POS 1.27MM SMD R/A
|
封裝: - |
庫存4,518 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 25 | All | 1 | - | Surface Mount, Right Angle | Solder | Push-Pull | 0.118" (3.00mm) | - | - | 0.087" (2.20mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 46POS 2.54MM T/H
|
封裝: - |
庫存6,606 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 46 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.335" (8.51mm) | 0.118" (3.00mm) | 0.553" (14.04mm) | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 37POS T/H 0.100 GOLD
|
封裝: - |
庫存4,014 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 37 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.134" (3.39mm) | 0.121" (3.08mm) | 0.416" (10.57mm) | 0.116" (2.95mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 40POS 2.54MM T/H R/A
|
封裝: - |
庫存8,352 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 40 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.276" (7.00mm) | 0.118" (3.00mm) | - | 0.200" (5.08mm) | Square | Gold | 10µin (0.25µm) | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 38POS 2.54MM SMD
|
封裝: - |
庫存2,502 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 38 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.110" (2.79mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 38POS 0.100 SMD GOLD
|
封裝: - |
庫存4,536 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 38 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.110" (2.79mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 37POS 2MM T/H
|
封裝: - |
庫存3,294 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 37 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.141" (3.60mm) | 0.114" (2.90mm) | 0.394" (10.00mm) | 0.110" (2.79mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 62POS 0.100 SMD
|
封裝: - |
庫存6,984 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 62 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.110" (2.79mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 114POS 2.54MM T/H
|
封裝: - |
庫存2,106 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 114 | All | 3 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.122" (3.10mm) | 0.458" (11.64mm) | 0.100" (2.54mm) | Square | Gold | Flash | Gold | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 36POS 1.27MM SMD
|
封裝: - |
庫存3,960 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 36 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | - | - | 0.075" (1.90mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 36POS 1.27MM SMD
|
封裝: - |
庫存7,254 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 36 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | - | - | 0.075" (1.90mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 84POS 2.54MM T/H
|
封裝: - |
庫存7,470 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 84 | All | 3 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.335" (8.51mm) | 0.118" (3.00mm) | 0.553" (14.04mm) | 0.100" (2.54mm) | Square | Gold | Flash | Gold | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 44POS 2MM SMD R/A
|
封裝: - |
庫存5,652 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 44 | All | 1 | - | Surface Mount, Right Angle | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.087" (2.20mm) | Circular | Tin | - | Tin | Brass | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 44POS 2MM T/H R/A
|
封裝: - |
庫存4,248 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 44 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.141" (3.60mm) | 0.126" (3.20mm) | - | 0.087" (2.20mm) | Circular | Tin | - | Tin | Brass | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |