NXP 產品

MRF9030LR5

NXP

FET RF 68V 945MHZ NI-360

• Transistor Type: LDMOS
• Frequency: 945MHz
• Gain: 19dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 250mA
• Power - Output: 30W
• Voltage - Rated: 68V
• Package / Case: NI-360
• Supplier Device Package: NI-360

封裝: NI-360

PMEM4030NS,115

NXP

TRANS NPN 50V 2A SOT96-1

• Transistor Type: NPN + Diode (Isolated)
• Current - Collector (Ic) (Max): 2A
• Voltage - Collector Emitter Breakdown (Max): 50V
• Vce Saturation (Max) @ Ib, Ic: 370mV @ 300mA, 3A
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1A, 2V
• Power - Max: 1W
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

PDTD123TS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 2.2k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
• Current - Collector Cutoff (Max): 500nA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MMPF0100F4AEPR2

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 12
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

封裝: 56-VFQFN Exposed Pad

74LVCH32374AEC/G,5

NXP

IC D-TYPE POS TRG QUAD 96LFBGA

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 4
• Number of Bits per Element: 8
• Clock Frequency: 300MHz
• Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Iq): 40µA
• Input Capacitance: 5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA

封裝: 96-LFBGA

74ABT374APW,118

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 300MHz
• Max Propagation Delay @ V, Max CL: 4.9ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 250µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

封裝: 20-TSSOP (0.173", 4.40mm Width)

74AVC16835ADGV,112

NXP

IC RGSTRD DVR 3-ST 18BIT 56TVSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 18
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 56-TSSOP

封裝: 56-TFSOP (0.173", 4.40mm Width)

74ALVT16245DL,118

NXP

IC 16BIT TXRX 3-ST 48SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 48-SSOP

封裝: 48-BSSOP (0.295", 7.50mm Width)

MCZ33904B3EKR2

NXP

IC SBC CAN HS 3.3V 32SOIC

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

MPC8535AVTANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

MPC860DEZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

MPC8265ACVVMIBC

NXP

IC MPU MPC82XX 266MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

封裝: 480-LBGA

MPC8545EVJANGD

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BFBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BFBGA, FCBGA

MCF5216CVM66J

NXP

IC MCU 32BIT 512KB FLASH 256BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 142
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

封裝: 256-LBGA

LPC3180FEL320

NXP

IC MCU 32BIT ROMLESS 320LFBGA

• Core Processor: ARM9?
• Core Size: 16/32-Bit
• Speed: 208MHz
• Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
• Peripherals: DMA, PWM, WDT
• Number of I/O: 55
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.1 V ~ 3.3 V
• Data Converters: A/D 3x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 320-LFBGA
• Supplier Device Package: 320-LFBGA (13x13)

封裝: 320-LFBGA

MCF51JF32VHS

NXP

IC MCU 32BIT 32KB FLASH 44MAPLGA

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x12b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-VFLGA
• Supplier Device Package: 44-MAPLGA (5x5)

封裝: 44-VFLGA

S9S12G128F0MLFR

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

JN5139-001-M/01R1V

NXP

RF TXRX MODULE 802.15.4 SMA ANT

• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: -
• Frequency: 2.4GHz
• Data Rate: -
• Power - Output: 2.5dBm
• Sensitivity: -96dBm
• Serial Interfaces: I2C, SPI, UART
• Antenna Type: Not Included, SMA
• Memory Size: 192kB ROM, 96kB RAM
• Voltage - Supply: 2.2 V ~ 3.6 V
• Current - Receiving: 37mA
• Current - Transmitting: 37mA
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module

封裝: Module

TEF6902AH/V5S,557

NXP

IC CAR RADIO SGL CHIP CIRC 64QFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 102mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-BQFP
• Supplier Device Package: 64-QFP (14x14)

封裝: 64-BQFP

MC33CD1030AER2

NXP

SWITCH DETECT INTERFACE 33 CHAN

• Applications: Switch Monitoring
• Interface: SPI
• Voltage - Supply: 4.5 V ~ 36 V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

封裝: -

SPC5644BAMLU1R

NXP

NXP 32-BIT MCU POWER ARCH 1.5M

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 147
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 27x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

SPC5743PK1AMLQ5R

NXP

2MB NVM 2 X E200Z4 CORES 150MH

• Core Processor: e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

MPC8313EVRAGDC

NXP

IC MPU POWERQUICC II PRO 516PBGA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

封裝: 516-BBGA Exposed Pad

MFS2302BMMA0EPR2

NXP

IC

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

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FX32K146HAT0MLHT

NXP

S32K146 ARM CORTEX-M4F, 80 MHZ,

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

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MC33FS6528NAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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MFS8600BMDA0ES

NXP

IC FS86 SYSTEM BASIS CHIP ASIL

• Applications: Camera
• Current - Supply: -
• Voltage - Supply: 4.5V ~ 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

封裝: -

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MIMXRT1062CVJ5B

NXP

IC MCU 32BIT EXT MEM 196LFBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 528MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number of I/O: 127
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-LFBGA (12x12)

封裝: -