頁 666 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PHP54N06T,127	NXP	MOSFET N-CH 55V 54A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 54A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 36nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1592pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 118W (Tc) Rds On (Max) @ Id, Vgs: 20 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存3,328
BC635,112	NXP	TRANS NPN 45V 1A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Power - Max: 830mW Frequency - Transition: 180MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA)	庫存6,608
BB135,135	NXP	DIODE UHF VAR CAP 30V SOD323 Capacitance @ Vr, F: 2.1pF @ 28V, 1MHz Capacitance Ratio: 12 Capacitance Ratio Condition: C0.5/C28 Voltage - Peak Reverse (Max): 30V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323	封裝: SC-76, SOD-323	庫存7,920
PCF1252-6T/F4,112	NXP	IC VOLT DETECT W/RESET 8SO Type: Simple Reset/Power-On Reset Number of Voltages Monitored: 1 Output: Push-Pull, Totem Pole Reset: Active High Reset Timeout: 400 µs Minimum Voltage - Threshold: 3.25V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存6,016
PCA8530DUG/DAZ	NXP	IC LCD DRIVER COG 102X4 Display Type: LCD Configuration: - Interface: SPI Digits or Characters: - Current - Supply: - Voltage - Supply: 2.5 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存2,576
CBTS3257PW,118	NXP	IC 4BIT 1OF2 MUX/DEMUX 16TSSOP Type: Multiplexer/Demultiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存4,112
74LVT574BQ,115	NXP	IC D-TYPE POS TRG SNGL 20DHVQFN Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 150MHz Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Iq): 190µA Input Capacitance: 4pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-VFQFN Exposed Pad	封裝: 20-VFQFN Exposed Pad	庫存3,680
UJA1075ATW/5V0/1J	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存4,800
74HCT4353N,112	NXP	IC MUX/DEMUX TRIPLE 1X2 20DIP Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Number of Circuits: 3 On-State Resistance (Max): 120 Ohm Channel-to-Channel Matching (ΔRon): 6 Ohm Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V Voltage - Supply, Dual (V±): ±1 V ~ 5 V Switch Time (Ton, Toff) (Max): 45ns, 45ns -3db Bandwidth: 170MHz Charge Injection: - Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 100nA Crosstalk: -60dB @ 1MHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封裝: 20-DIP (0.300", 7.62mm)	庫存2,544
74HCT4016N,112	NXP	IC SWITCH QUAD SPST 14DIP Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 2 On-State Resistance (Max): 95 Ohm Channel-to-Channel Matching (ΔRon): 5 Ohm Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 30ns, 44ns -3db Bandwidth: 200MHz Charge Injection: - Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Crosstalk: -60dB @ 1MHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	封裝: 14-DIP (0.300", 7.62mm)	庫存3,568
MC7447AVU600NB	NXP	IC MPU MPC74XX 600MHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	封裝: 360-BCBGA, FCCBGA	庫存2,288
MC68302EH25CB1	NXP	IC MPU M683XX 25MHZ 132QFP Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 25MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	封裝: 132-BQFP Bumpered	庫存7,584
SPC5645SF1VLT	NXP	IC MCU 32BIT 2MB FLASH 208LQFP Core Processor: e200z4d Core Size: 32-Bit Speed: 125MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 150 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.064M x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 20x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	封裝: 208-LQFP	庫存6,688
MCF54453VR266	NXP	IC MCU 32BIT ROMLESS 360PBGA Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 266MHz Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 132 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 360-BBGA Supplier Device Package: 360-PBGA (23x23)	封裝: 360-BBGA	庫存5,392
MC9S12D64MPVE	NXP	IC MCU 16BIT 64KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存17,724
LPC2129FBD64/01,15	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 46 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存17,220
MPC9109AC	NXP	IC CLOCK DIST CHIP 1:18 32-LQFP PLL: No Main Purpose: Intel CPU Servers Input: LVCMOS, LVPECL Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 2:18 Differential - Input:Output: Yes/No Frequency - Max: 250MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (9x9)	封裝: 32-LQFP	庫存4,528
SX5148P3LCWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,012
MC44S803EVK	NXP	KIT EVAL MC44S803 SI TUNER Type: Tuner Frequency: - For Use With/Related Products: 802A Tuner Supplied Contents: -	封裝: -	庫存7,596
MHV5IC2215NR2	NXP	IC RF POWER AMP 2170MHZ 16-PFP Frequency: 1.93GHz ~ 1.99GHz P1dB: 41.8dBm (15W) Gain: 24dB Noise Figure: - RF Type: Cellular, W-CDMA, IS-95, N-CDMA Voltage - Supply: 28V Current - Supply: 115mA Test Frequency: - Package / Case: 16-SOP (0.276", 7.00mm Width) Supplier Device Package: 16-PFP	封裝: 16-SOP (0.276", 7.00mm Width)	庫存40,992
MIMXRT1051DVL6B	NXP	I.MXRT1050 A1 Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	封裝: 196-LFBGA	庫存8,928
SPC5606BK0CLU6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP	庫存2,784
MKM34Z256VLL7R	NXP	KINETIS KM34: 75MHZ CORTEX-M0+ M Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 75MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LCD, WDT Number of I/O: 72 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, 4x24b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存7,136
S912ZVML64F3VKHR	NXP	S12Z CORE, 64K FLASH, LIN, 64LQF Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 24 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
MFS2633AMDA0ADR2	NXP	SAFETY SYSTEM BASIS CHIP WITH LO Applications: - Current - Supply: 29µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: -	Request a Quote
S32K312NHT0MPAIT	NXP	S32K312, 2MB FLASH, ISELED Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-QFP Supplier Device Package: 100-MaxQFP (10x10)	封裝: -	Request a Quote
LPC5512JBD64Y	NXP	IC MCU 32BIT 64KB FLASH 64TQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	封裝: -	Request a Quote
MC33FS6515KAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote

PHP54N06T,127

NXP

MOSFET N-CH 55V 54A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 36nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1592pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 118W (Tc)
Rds On (Max) @ Id, Vgs: 20 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存3,328

BC635,112

NXP

TRANS NPN 45V 1A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Power - Max: 830mW
Frequency - Transition: 180MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA)

庫存6,608

BB135,135

NXP

DIODE UHF VAR CAP 30V SOD323

Capacitance @ Vr, F: 2.1pF @ 28V, 1MHz
Capacitance Ratio: 12
Capacitance Ratio Condition: C0.5/C28
Voltage - Peak Reverse (Max): 30V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Supplier Device Package: SOD-323

封裝: SC-76, SOD-323

庫存7,920

PCF1252-6T/F4,112

NXP

IC VOLT DETECT W/RESET 8SO

Type: Simple Reset/Power-On Reset
Number of Voltages Monitored: 1
Output: Push-Pull, Totem Pole
Reset: Active High
Reset Timeout: 400 µs Minimum
Voltage - Threshold: 3.25V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存6,016

PCA8530DUG/DAZ

NXP

IC LCD DRIVER COG 102X4

Display Type: LCD
Configuration: -
Interface: SPI
Digits or Characters: -
Current - Supply: -
Voltage - Supply: 2.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存2,576

CBTS3257PW,118

NXP

IC 4BIT 1OF2 MUX/DEMUX 16TSSOP

Type: Multiplexer/Demultiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存4,112

74LVT574BQ,115

NXP

IC D-TYPE POS TRG SNGL 20DHVQFN

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 150MHz
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Quiescent (Iq): 190µA
Input Capacitance: 4pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad

封裝: 20-VFQFN Exposed Pad

庫存3,680

UJA1075ATW/5V0/1J

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存4,800

74HCT4353N,112

NXP

IC MUX/DEMUX TRIPLE 1X2 20DIP

Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Number of Circuits: 3
On-State Resistance (Max): 120 Ohm
Channel-to-Channel Matching (ΔRon): 6 Ohm
Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
Voltage - Supply, Dual (V±): ±1 V ~ 5 V
Switch Time (Ton, Toff) (Max): 45ns, 45ns
-3db Bandwidth: 170MHz
Charge Injection: -
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Crosstalk: -60dB @ 1MHz
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封裝: 20-DIP (0.300", 7.62mm)

庫存2,544

74HCT4016N,112

NXP

IC SWITCH QUAD SPST 14DIP

Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Number of Circuits: 2
On-State Resistance (Max): 95 Ohm
Channel-to-Channel Matching (ΔRon): 5 Ohm
Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
Voltage - Supply, Dual (V±): -
Switch Time (Ton, Toff) (Max): 30ns, 44ns
-3db Bandwidth: 200MHz
Charge Injection: -
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Crosstalk: -60dB @ 1MHz
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

封裝: 14-DIP (0.300", 7.62mm)

庫存3,568

MC7447AVU600NB

NXP

IC MPU MPC74XX 600MHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

封裝: 360-BCBGA, FCCBGA

庫存2,288

MC68302EH25CB1

NXP

IC MPU M683XX 25MHZ 132QFP

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

封裝: 132-BQFP Bumpered

庫存7,584

SPC5645SF1VLT

NXP

IC MCU 32BIT 2MB FLASH 208LQFP

Core Processor: e200z4d
Core Size: 32-Bit
Speed: 125MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 150
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.064M x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 20x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

封裝: 208-LQFP

庫存6,688

MCF54453VR266

NXP

IC MCU 32BIT ROMLESS 360PBGA

Core Processor: Coldfire V4
Core Size: 32-Bit
Speed: 266MHz
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 132
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 360-BBGA
Supplier Device Package: 360-PBGA (23x23)

封裝: 360-BBGA

庫存5,392

MC9S12D64MPVE

NXP

IC MCU 16BIT 64KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存17,724

LPC2129FBD64/01,15

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 46
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存17,220

MPC9109AC

NXP

IC CLOCK DIST CHIP 1:18 32-LQFP

PLL: No
Main Purpose: Intel CPU Servers
Input: LVCMOS, LVPECL
Output: LVCMOS
Number of Circuits: 1
Ratio - Input:Output: 2:18
Differential - Input:Output: Yes/No
Frequency - Max: 250MHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (9x9)

封裝: 32-LQFP

庫存4,528

SX5148P3LCWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,012

MC44S803EVK

NXP

KIT EVAL MC44S803 SI TUNER

Type: Tuner
Frequency: -
For Use With/Related Products: 802A Tuner
Supplied Contents: -

封裝: -

庫存7,596

MHV5IC2215NR2

NXP

IC RF POWER AMP 2170MHZ 16-PFP

Frequency: 1.93GHz ~ 1.99GHz
P1dB: 41.8dBm (15W)
Gain: 24dB
Noise Figure: -
RF Type: Cellular, W-CDMA, IS-95, N-CDMA
Voltage - Supply: 28V
Current - Supply: 115mA
Test Frequency: -
Package / Case: 16-SOP (0.276", 7.00mm Width)
Supplier Device Package: 16-PFP

封裝: 16-SOP (0.276", 7.00mm Width)

庫存40,992

MIMXRT1051DVL6B

NXP

I.MXRT1050 A1

Core Processor: ARM® Cortex®-M7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
Package / Case: 196-LFBGA
Supplier Device Package: 196-MAPBGA (10x10)

封裝: 196-LFBGA

庫存8,928

SPC5606BK0CLU6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

庫存2,784

MKM34Z256VLL7R

NXP

KINETIS KM34: 75MHZ CORTEX-M0+ M

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 75MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Number of I/O: 72
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x16b, 4x24b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存7,136

S912ZVML64F3VKHR

NXP

S12Z CORE, 64K FLASH, LIN, 64LQF

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 24
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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MFS2633AMDA0ADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

Applications: -
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

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S32K312NHT0MPAIT

NXP

S32K312, 2MB FLASH, ISELED

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-QFP
Supplier Device Package: 100-MaxQFP (10x10)

封裝: -

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LPC5512JBD64Y

NXP

IC MCU 32BIT 64KB FLASH 64TQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封裝: -

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MC33FS6515KAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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