頁 6 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRFE6S9130HR5	NXP	FET RF 66V 880MHZ NI-780 Transistor Type: LDMOS Frequency: 880MHz Gain: 19.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 950mA Power - Output: 27W Voltage - Rated: 66V Package / Case: NI-780 Supplier Device Package: NI-780	封裝: NI-780	庫存2,480
MC15XS3400CPNA	NXP	IC SWITCH HIGH SIDE QUAD 24-QFN Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 15 mOhm Input Type: - Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12)	封裝: 24-PowerQFN	庫存6,384
SSTU32866EC/G,551	NXP	IC 25BIT CONFIG REG BUFF 96LFBGA Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	封裝: 96-LFBGA	庫存2,704
CBTV4010EE,551	NXP	IC 10BIT 1:4 BUS SWITCH 64-TFBGA Type: Bus Switch Circuit: 10 x 1:4 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 2.3 V ~ 2.7 V Operating Temperature: 0°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (7x7)	封裝: 64-TFBGA	庫存6,304
N74F04D,602	NXP	IC INVERTR HEX COMM 6.9MA 14SOIC Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存3,216
MC8641HX1000GE	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	封裝: 994-BCBGA, FCCBGA	庫存3,808
P2020PSE2MZB	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存6,080
MPC8313ECZQADD	NXP	IC MPU MPC83XX 267MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 267MHz Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	封裝: 516-BBGA Exposed Pad	庫存2,800
MC9328MX21SVKR2	NXP	IC MPU I.MX21 266MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: - SATA: - USB: USB 1.x (2) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 289-LFBGA Supplier Device Package: -	封裝: 289-LFBGA	庫存3,056
MPC8260AVVPIBB	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	封裝: 480-LBGA	庫存5,488
MPC870CZT66	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	封裝: 256-BBGA	庫存16,164
MC9S12DJ256VPVE	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存3,136
P87C51RC2FN,112	NXP	IC MCU 8BIT 32KB OTP 40DIP Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-DIP	封裝: 40-DIP (0.600", 15.24mm)	庫存2,448
MCF52221CAF66	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存6,144
S9S12G128F0CLL	NXP	IC MCU 16BIT 128KB FLASH 100LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存4,640
MC9S08QE8CPG	NXP	IC MCU 8BIT 8KB FLASH 16DIP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存4,480
MMA6826BKWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±60g Sensitivity (LSB/g): 8.192 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	封裝: 16-QFN Exposed Pad	庫存2,430
MCIMX6DP5EVT2AB	NXP	I.MX 6QP ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	封裝: 624-FBGA, FCBGA	庫存5,968
T2081NXN8P1B	NXP	QORIQ64B POWER ARCH8X 1.5GHZ T Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,036
SPC5644CCF0MMJ1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 199 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	封裝: 256-LBGA	庫存4,496
SPC5746BFK1AVMH6	NXP	SINGLE CORE 3M FLASH 384 RAM Core Processor: e200z4 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	封裝: 100-LBGA	庫存3,104
S912ZVLA12F0WLF	NXP	MAGNIV 16-BIT MCU S12Z CORE 12 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存7,328
FD32K142HRT0VLLR	NXP	S32K142, M4F, FLASH 256K, RAM 32 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
SAF7751HV-N205-SBK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MCIMX6U6AVM10ADR	NXP	I.MX 6 SERIES 32-BIT MPU, DUAL A Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI Ethernet: 10/100/1000Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	封裝: -	Request a Quote
S9S12ZVL16ACLF	NXP	S12Z CPU, 16K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
FS32K148HAT0VLQR	NXP	S32K148 32-BIT MCU, ARM CORTEX- Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 156 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: -	Request a Quote
S9S12ZVL32AMLF	NXP	S12Z CPU, 32K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 10x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote

MRFE6S9130HR5

NXP

FET RF 66V 880MHZ NI-780

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 19.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 950mA
Power - Output: 27W
Voltage - Rated: 66V
Package / Case: NI-780
Supplier Device Package: NI-780

封裝: NI-780

庫存2,480

MC15XS3400CPNA

NXP

IC SWITCH HIGH SIDE QUAD 24-QFN

Switch Type: General Purpose
Number of Outputs: 4
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 6 V ~ 20 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 6A
Rds On (Typ): 15 mOhm
Input Type: -
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 24-PowerQFN
Supplier Device Package: 24-PQFN (12x12)

封裝: 24-PowerQFN

庫存6,384

SSTU32866EC/G,551

NXP

IC 25BIT CONFIG REG BUFF 96LFBGA

Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 1.9 V
Number of Bits: 25, 14
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

封裝: 96-LFBGA

庫存2,704

CBTV4010EE,551

NXP

IC 10BIT 1:4 BUS SWITCH 64-TFBGA

Type: Bus Switch
Circuit: 10 x 1:4
Independent Circuits: 1
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 2.3 V ~ 2.7 V
Operating Temperature: 0°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (7x7)

封裝: 64-TFBGA

庫存6,304

N74F04D,602

NXP

IC INVERTR HEX COMM 6.9MA 14SOIC

Logic Type: Inverter
Number of Circuits: 6
Number of Inputs: 6
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存3,216

MC8641HX1000GE

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

封裝: 994-BCBGA, FCCBGA

庫存3,808

P2020PSE2MZB

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存6,080

MPC8313ECZQADD

NXP

IC MPU MPC83XX 267MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 267MHz
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

封裝: 516-BBGA Exposed Pad

庫存2,800

MC9328MX21SVKR2

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: -
SATA: -
USB: USB 1.x (2)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 289-LFBGA
Supplier Device Package: -

封裝: 289-LFBGA

庫存3,056

MPC8260AVVPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

封裝: 480-LBGA

庫存5,488

MPC870CZT66

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 100°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

封裝: 256-BBGA

庫存16,164

MC9S12DJ256VPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存3,136

P87C51RC2FN,112

NXP

IC MCU 8BIT 32KB OTP 40DIP

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 40-DIP (0.600", 15.24mm)
Supplier Device Package: 40-DIP

封裝: 40-DIP (0.600", 15.24mm)

庫存2,448

MCF52221CAF66

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存6,144

S9S12G128F0CLL

NXP

IC MCU 16BIT 128KB FLASH 100LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存4,640

MC9S08QE8CPG

NXP

IC MCU 8BIT 8KB FLASH 16DIP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存4,480

MMA6826BKWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±60g
Sensitivity (LSB/g): 8.192
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

封裝: 16-QFN Exposed Pad

庫存2,430

MCIMX6DP5EVT2AB

NXP

I.MX 6QP ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

封裝: 624-FBGA, FCBGA

庫存5,968

T2081NXN8P1B

NXP

QORIQ64B POWER ARCH8X 1.5GHZ T

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,036

SPC5644CCF0MMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

封裝: 256-LBGA

庫存4,496

SPC5746BFK1AVMH6

NXP

SINGLE CORE 3M FLASH 384 RAM

Core Processor: e200z4
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

封裝: 100-LBGA

庫存3,104

S912ZVLA12F0WLF

NXP

MAGNIV 16-BIT MCU S12Z CORE 12

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 10x10b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存7,328

FD32K142HRT0VLLR

NXP

S32K142, M4F, FLASH 256K, RAM 32

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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SAF7751HV-N205-SBK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MCIMX6U6AVM10ADR

NXP

I.MX 6 SERIES 32-BIT MPU, DUAL A

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Ethernet: 10/100/1000Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

封裝: -

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S9S12ZVL16ACLF

NXP

S12Z CPU, 16K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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FS32K148HAT0VLQR

NXP

S32K148 32-BIT MCU, ARM CORTEX-

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 156
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 32x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: -

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S9S12ZVL32AMLF

NXP

S12Z CPU, 32K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 10x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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