頁 582 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  582/950
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BC369,112
NXP

TRANS PNP 20V 1A TO-92

  • Transistor Type: PNP
  • Current - Collector (Ic) (Max): 1A
  • Voltage - Collector Emitter Breakdown (Max): 20V
  • Vce Saturation (Max) @ Ib, Ic: 500mV @ 100mA, 1A
  • Current - Collector Cutoff (Max): 100nA (ICBO)
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
  • Power - Max: 830mW
  • Frequency - Transition: 140MHz
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA)
  • Supplier Device Package: TO-92-3
封裝: TO-226-3, TO-92-3 (TO-226AA)
庫存5,088
BAP51-04W,115
NXP

DIODE PIN GP 50V 50MA SOT323

  • Diode Type: PIN - 1 Pair Series Connection
  • Voltage - Peak Reverse (Max): 50V
  • Current - Max: 50mA
  • Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
  • Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
  • Power Dissipation (Max): 240mW
  • Operating Temperature: -65°C ~ 150°C (TJ)
  • Package / Case: SC-70, SOT-323
  • Supplier Device Package: SOT-323-3
封裝: SC-70, SOT-323
庫存4,240
N74F153D,623
NXP

IC MULTIPLEXER DUAL 4IN 16SOIC

  • Type: Multiplexer
  • Circuit: 2 x 4:1
  • Independent Circuits: 1
  • Current - Output High, Low: 1mA, 20mA
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
封裝: 16-SOIC (0.154", 3.90mm Width)
庫存3,648
74HCT2G126DC,125
NXP

IC BUFF DVR TRI-ST DL 8VSSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 1
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 6mA, 6mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 8-VFSOP (0.091", 2.30mm Width)
  • Supplier Device Package: 8-VSSOP, US8
封裝: 8-VFSOP (0.091", 2.30mm Width)
庫存5,040
SC16C850IBS/Q900,5
NXP

IC UART SGL UNIV ASYNC 32HVQFN

  • Features: -
  • Number of Channels: 1, UART
  • FIFO's: 128 Byte
  • Protocol: RS485
  • Data Rate (Max): 5Mbps
  • Voltage - Supply: 2.5 V ~ 3.3 V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: Yes
  • With False Start Bit Detection: Yes
  • With Modem Control: Yes
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
封裝: 32-VFQFN Exposed Pad
庫存3,840
MC33978AEK
NXP

IC INTERFACE SW DETECT 32-SOIC

  • Applications: Multiple Switch Detection
  • Interface: SPI
  • Voltage - Supply: 3 V ~ 5.25 V
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package: 32-SOIC EP
  • Mounting Type: Surface Mount
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
庫存15,096
PCA9516AD,112
NXP

IC REDRIVER I2C 5CH 400KHZ 16SO

  • Type: Buffer, ReDriver
  • Applications: I2C
  • Input: 2-Wire Bus
  • Output: 2-Wire Bus
  • Data Rate (Max): 400kHz
  • Number of Channels: 5
  • Delay Time: -
  • Signal Conditioning: -
  • Capacitance - Input: 6pF
  • Voltage - Supply: 3 V ~ 3.6 V
  • Current - Supply: 5mA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
封裝: 16-SOIC (0.154", 3.90mm Width)
庫存18,504
SC18IS600IBS,151
NXP

IC SPI TO I2C BUS 24-HVQFN

  • Protocol: I2C
  • Function: Controller
  • Interface: SPI
  • Standards: -
  • Voltage - Supply: 2.4 V ~ 3.6 V
  • Current - Supply: 11mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
封裝: 24-VFQFN Exposed Pad
庫存18,102
MPC563CVR40
NXP

IC MCU 32BIT 512KB FLASH 388BGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 40MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 56
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
封裝: 388-BBGA
庫存2,672
hot MC9S08PT60AVLF
NXP

IC MCU 8BIT 60KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 41
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存3,856
MC9S08AW32CFGER
NXP

IC MCU 8BIT 32KB FLASH 44LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
封裝: 44-LQFP
庫存4,736
LPC1102UK,118
NXP

IC MCU 32BIT 32KB FLASH 16WLCSP

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 11
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 5x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-UFBGA, WLCSP
  • Supplier Device Package: -
封裝: 16-UFBGA, WLCSP
庫存6,912
ADC1004S040TS/C1:1
NXP

IC ADC 10BIT PAR 40MHZ 28-SSOP

  • Number of Bits: 10
  • Sampling Rate (Per Second): 40M
  • Number of Inputs: 1
  • Input Type: Single Ended
  • Data Interface: Parallel
  • Configuration: ADC
  • Ratio - S/H:ADC: -
  • Number of A/D Converters: 1
  • Architecture: -
  • Reference Type: External
  • Voltage - Supply, Analog: 5V
  • Voltage - Supply, Digital: 5V
  • Features: -
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 28-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 28-SSOP
  • Mounting Type: -
封裝: 28-SSOP (0.209", 5.30mm Width)
庫存5,520
BZA868AL,115
NXP

TVS DIODE 6.8VWM 5TSSOP

  • Type: Zener
  • Unidirectional Channels: 4
  • Bidirectional Channels: -
  • Voltage - Reverse Standoff (Typ): 6.8V
  • Voltage - Breakdown (Min): -
  • Voltage - Clamping (Max) @ Ipp: -
  • Current - Peak Pulse (10/1000µs): -
  • Power - Peak Pulse: 14W
  • Power Line Protection: No
  • Applications: General Purpose
  • Capacitance @ Frequency: 180pF @ 1MHz
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 5-TSSOP, SC-70-5, SOT-353
  • Supplier Device Package: 5-TSSOP
封裝: 5-TSSOP, SC-70-5, SOT-353
庫存3,472
MPXHZ6116A6T1
NXP

IC SENSOR IPS ABSOLUTE 8SSOP

  • Pressure Type: Absolute
  • Operating Pressure: 2.9 PSI ~ 16.68 PSI (20 kPa ~ 115 kPa)
  • Output Type: Analog Voltage
  • Output: 0.399 V ~ 4.645 V
  • Accuracy: ±1.5%
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Port Size: -
  • Port Style: No Port
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 58.02 PSI (400 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 8-SSOP
封裝: 8-SOIC (0.295", 7.50mm Width)
庫存8,874
MMA1211EG
NXP

ACCELEROMETER 169G ANALOG 16SOIC

  • Type: Analog
  • Axis: Z
  • Acceleration Range: ±169g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 13.33
  • Bandwidth: 400Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Features: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
封裝: 16-SOIC (0.295", 7.50mm Width)
庫存3,456
MPXV8500DK016T1
NXP

IC PRESSURE SENSOR

  • Frequency: 315MHz, 434MHz
  • Applications: TPM (Tire Pressure Monitor)
  • Modulation or Protocol: FSK, OOK
  • Data Rate (Max): -
  • Power - Output: -
  • Current - Transmitting: -
  • Data Interface: PCB, Surface Mount
  • Antenna Connector: PCB, Surface Mount
  • Memory Size: 8kB Flash, 512B SRAM
  • Features: -
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 32-QFN Exposed Pad
封裝: 32-QFN Exposed Pad
庫存6,354
MCIMX6U1AVM08AD
NXP

I.MX6 DL ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
封裝: 624-LFBGA
庫存6,384
SPC5673FK0MVY2R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z7
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: CANbus, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM
  • Number of I/O: 32
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
封裝: 516-BBGA
庫存4,560
SP5745BBK1AMMH2R
NXP

32 BIT SINGLE CORE 2M FLASH 1

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
封裝: 100-LBGA
庫存4,432
MC56F8023VLCR
NXP

16-BIT DSC 56800E CORE 32KB FL

  • Core Processor: 56800E
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I²C, LINbus, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 32KB (16K x 16)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 16
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 6x12b; D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存6,944
S9S08DV96F2CLFR
NXP

8-BIT MCU S08 CORE 96KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存2,928
MC9S08SE4MWL
NXP

IC MCU 8BIT 4KB FLASH 28SOIC

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: LINbus, SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 24
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存6,096
K32L3A60VPJ1AT
NXP

IC MCU 32B 1.25MB FLASH 176VFBGA

  • Core Processor: ARM® Cortex®-M4/M0+
  • Core Size: 32-Bit Dual-Core
  • Speed: 72MHz
  • Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB
  • Peripherals: AC'97, DMA, I2S, LCD, POR, PWM, WDT
  • Number of I/O: 104
  • Program Memory Size: 1.25MB (1.25M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 48K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 176-VFBGA
  • Supplier Device Package: 176-VFBGA (9x9)
封裝: -
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MC33FS8510A3ESR2
NXP

SYSTEM BASIS CHIP FS8510

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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MC33771CTP2AE
NXP

BATTERY CELL CONTROLLER, PREMIUM

  • Function: Battery Cell Controller
  • Battery Chemistry: Lithium Ion
  • Number of Cells: 7 ~ 14
  • Fault Protection: Over/Under Voltage
  • Interface: SPI
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
封裝: -
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SPC5746BSK1AVKU2
NXP

IC MCU 32BIT 3MB FLASH 176LQFP

  • Core Processor: e200z4
  • Core Size: 32-Bit Single-Core
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
封裝: -
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MIMX8ML8DVNLZCB
NXP

IC

  • Architecture: DSP, MCU, MPU
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
  • Flash Size: -
  • RAM Size: 868KB
  • Peripherals: DMA, PWM, WDT
  • Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
  • Speed: 1.8GHz, 800MHz
  • Primary Attributes: -
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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