頁 576 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PDTA144ES,126	NXP	TRANS PREBIAS PNP 500MW TO92-3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	庫存4,064
BZX84-C30/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 30V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 50nA @ 18.9V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存3,360
BBY31,215	NXP	DIODE UHF VAR CAP 30V SOT-23 Capacitance @ Vr, F: 2pF @ 28V, 1MHz Capacitance Ratio: 8.3 Capacitance Ratio Condition: C1/C28 Voltage - Peak Reverse (Max): 30V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存5,408
NX5P2553GU6Z	NXP	IC POWER SWITCH PREC 6HXSON Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 2.5 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1.5A Rds On (Typ): 115 mOhm Input Type: Non-Inverting Features: Status Flag Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 6-XDFN Exposed Pad Supplier Device Package: 6-HXSON (1.6x1.6)	封裝: 6-XDFN Exposed Pad	庫存4,048
NTBA104GU12,115	NXP	IC TXRX TRANSLATING 4BIT 12XQFN Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 4 Voltage - VCCA: 1.2V ~ 3.6V Voltage - VCCB: 1.65V ~ 5.5V Input Signal: - Output Signal: - Output Type: Tri-State, Non-Inverted Data Rate: 80Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 12-XFQFN Supplier Device Package: 12-XQFN (2x1.7)	封裝: 12-XFQFN	庫存31,140
N74F153N,602	NXP	IC MULTIPLEXER DUAL 4IN 16DIP Type: Multiplexer Circuit: 2 x 4:1 Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存5,840
74LVCH32373AEC/G,5	NXP	IC 32BIT TRANSP D LATCH 93LFBGA Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 2.7 V ~ 3.6 V Independent Circuits: 4 Delay Time - Propagation: 3ns Current - Output High, Low: 24mA, 24mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	封裝: 96-LFBGA	庫存4,320
SC16C554IB80,557	NXP	IC UART QUAD 80LQFP Features: - Number of Channels: 4, QUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存6,160
TJF1051T/3/CM,118	NXP	IC TRANSCEIVER CAN 8SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120mV Data Rate: 5Mbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存4,368
MPC8544EAVTARJA	NXP	IC MPU MPC85XX 1.067GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存5,440
MC8641VU1000GC	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	封裝: 994-BCBGA, FCCBGA	庫存7,376
MPC8547HXAUJ	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,784
MPC862TVR50B	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存2,192
MC8640DTVJ1067NE	NXP	IC MPU E600 DUAL CORE 1023FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BCBGA, FCCBGA Supplier Device Package: 1023-FCCBGA (33x33)	封裝: 1023-BCBGA, FCCBGA	庫存3,728
MC9S08RC60FJE	NXP	IC MCU 8BIT 60KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存7,696
S9S08SL8F1MTJR	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存3,920
S9S08SC4E0CTGR	NXP	IC MCU 8BIT 4KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: LIN, SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存2,384
MC88915FN55	NXP	IC DRIVER CLK PLL 55MHZ 28-PLCC Type: Clock Driver, Fanout Distribution, Multiplexer PLL: Yes Input: TTL Output: CMOS, TTL Number of Circuits: 1 Ratio - Input:Output: 3:8 Differential - Input:Output: No/No Frequency - Max: 55MHz Divider/Multiplier: Yes/Yes Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 28-LCC (J-Lead) Supplier Device Package: 28-PLCC (12.45x12.45)	封裝: 28-LCC (J-Lead)	庫存15,480
TEF6635HW/V105,518	NXP	IC DGTL CHIP AUTO RADIO 100HTQFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: - Current - Receiving: - Data Interface: - Memory Size: - Antenna Connector: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存8,388
JN517X-XK030UL	NXP	ZIGBEE GENERIC NODE EXPANSION KI Type: Transceiver; 802.15.4 (Thread, ZigBee?) Frequency: 2.4GHz For Use With/Related Products: JN5179 Supplied Contents: Board	封裝: -	庫存5,058
SPC5746CK1AMMJ6R	NXP	DUAL CORE 3M FLASH 384K RAM F Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	封裝: 256-LBGA	庫存7,744
MKM34Z128ACLL5R	NXP	KINETIS KM34: 50MHZ CORTEX-M0+ M Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 50MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LCD, WDT Number of I/O: 68 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, 4x24b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存6,384
S9S12GN16BMLCR	NXP	16-BIT16K FLASH2K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存6,352
SAF4000EL-101S23BY	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MVR5510AMMALESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: - Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
FS32K148HFT0MLLR	NXP	S32K148 32-BIT MCU, ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 156 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: -	Request a Quote
MC33816MAE	NXP	INJECTOR GATE DRIVERS Applications: Solenoid Controller Current - Supply: 46mA Voltage - Supply: 5V ~ 32V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-HLQFP (10x10)	封裝: -	Request a Quote
LPC1112FHI33-102	NXP	IC MCU 32BIT 16KB FLASH 32HVQFN Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: -	Request a Quote

PDTA144ES,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 47k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

庫存4,064

BZX84-C30/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 30V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 80 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 18.9V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存3,360

BBY31,215

NXP

DIODE UHF VAR CAP 30V SOT-23

Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio: 8.3
Capacitance Ratio Condition: C1/C28
Voltage - Peak Reverse (Max): 30V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存5,408

NX5P2553GU6Z

NXP

IC POWER SWITCH PREC 6HXSON

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 2.5 V ~ 5.5 V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.5A
Rds On (Typ): 115 mOhm
Input Type: Non-Inverting
Features: Status Flag
Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 6-XDFN Exposed Pad
Supplier Device Package: 6-HXSON (1.6x1.6)

封裝: 6-XDFN Exposed Pad

庫存4,048

NTBA104GU12,115

NXP

IC TXRX TRANSLATING 4BIT 12XQFN

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 4
Voltage - VCCA: 1.2V ~ 3.6V
Voltage - VCCB: 1.65V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Tri-State, Non-Inverted
Data Rate: 80Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 12-XFQFN
Supplier Device Package: 12-XQFN (2x1.7)

封裝: 12-XFQFN

庫存31,140

N74F153N,602

NXP

IC MULTIPLEXER DUAL 4IN 16DIP

Type: Multiplexer
Circuit: 2 x 4:1
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存5,840

74LVCH32373AEC/G,5

NXP

IC 32BIT TRANSP D LATCH 93LFBGA

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 2.7 V ~ 3.6 V
Independent Circuits: 4
Delay Time - Propagation: 3ns
Current - Output High, Low: 24mA, 24mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

封裝: 96-LFBGA

庫存4,320

SC16C554IB80,557

NXP

IC UART QUAD 80LQFP

Features: -
Number of Channels: 4, QUART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存6,160

TJF1051T/3/CM,118

NXP

IC TRANSCEIVER CAN 8SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 120mV
Data Rate: 5Mbps
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存4,368

MPC8544EAVTARJA

NXP

IC MPU MPC85XX 1.067GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存5,440

MC8641VU1000GC

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

封裝: 994-BCBGA, FCCBGA

庫存7,376

MPC8547HXAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,784

MPC862TVR50B

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存2,192

MC8640DTVJ1067NE

NXP

IC MPU E600 DUAL CORE 1023FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BCBGA, FCCBGA
Supplier Device Package: 1023-FCCBGA (33x33)

封裝: 1023-BCBGA, FCCBGA

庫存3,728

MC9S08RC60FJE

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存7,696

S9S08SL8F1MTJR

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存3,920

S9S08SC4E0CTGR

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: LIN, SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存2,384

MC88915FN55

NXP

IC DRIVER CLK PLL 55MHZ 28-PLCC

Type: Clock Driver, Fanout Distribution, Multiplexer
PLL: Yes
Input: TTL
Output: CMOS, TTL
Number of Circuits: 1
Ratio - Input:Output: 3:8
Differential - Input:Output: No/No
Frequency - Max: 55MHz
Divider/Multiplier: Yes/Yes
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 28-LCC (J-Lead)
Supplier Device Package: 28-PLCC (12.45x12.45)

封裝: 28-LCC (J-Lead)

庫存15,480

TEF6635HW/V105,518

NXP

IC DGTL CHIP AUTO RADIO 100HTQFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: -
Applications: -
Current - Receiving: -
Data Interface: -
Memory Size: -
Antenna Connector: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存8,388

JN517X-XK030UL

NXP

ZIGBEE GENERIC NODE EXPANSION KI

Type: Transceiver; 802.15.4 (Thread, ZigBee?)
Frequency: 2.4GHz
For Use With/Related Products: JN5179
Supplied Contents: Board

封裝: -

庫存5,058

SPC5746CK1AMMJ6R

NXP

DUAL CORE 3M FLASH 384K RAM F

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封裝: 256-LBGA

庫存7,744

MKM34Z128ACLL5R

NXP

KINETIS KM34: 50MHZ CORTEX-M0+ M

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Number of I/O: 68
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x16b, 4x24b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存6,384

S9S12GN16BMLCR

NXP

16-BIT16K FLASH2K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存6,352

SAF4000EL-101S23BY

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MVR5510AMMALESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: -
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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FS32K148HFT0MLLR

NXP

S32K148 32-BIT MCU, ARM CORTEX-M

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 156
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 32x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

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MC33816MAE

NXP

INJECTOR GATE DRIVERS

Applications: Solenoid Controller
Current - Supply: 46mA
Voltage - Supply: 5V ~ 32V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

封裝: -

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LPC1112FHI33-102

NXP

IC MCU 32BIT 16KB FLASH 32HVQFN

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: -

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