NXP 產品

BUK7608-55,118

NXP

MOSFET N-CH 55V 75A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 4500pF @ 25V
• Vgs (Max): ±16V
• FET Feature: -
• Power Dissipation (Max): 187W (Tc)
• Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

MRF7S16150HSR3

NXP

FET RF 65V 1.66GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 1.6GHz ~ 1.66GHz
• Gain: 19.7dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 32W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

封裝: NI-780S

MRF6S9125NR1

NXP

FET RF 68V 880MHZ TO-270-4

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 950mA
• Power - Output: 27W
• Voltage - Rated: 68V
• Package / Case: TO-270AB
• Supplier Device Package: TO-270 WB-4

封裝: TO-270AB

1PS193,115

NXP

DIODE GEN PURP 80V 215MA SMT3

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 80V
• Current - Average Rectified (Io): 215mA (DC)
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK
• Operating Temperature - Junction: 150°C (Max)

封裝: TO-236-3, SC-59, SOT-23-3

MC34716EP

NXP

IC CONVERTER DDR 26QFN

• Applications: Converter, DDR
• Voltage - Input: 3 V ~ 6 V
• Number of Outputs: 2
• Voltage - Output: 0.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 26-VFQFN Exposed Pad
• Supplier Device Package: 26-QFN-EP (5x5)

封裝: 26-VFQFN Exposed Pad

BUK1M200-50SGTD,11

NXP

TOPFET QUAD 50V 20-SOIC

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: On/Off
• Voltage - Load: 50V (Max)
• Voltage - Supply (Vcc/Vdd): Not Required
• Current - Output (Max): 2.7A
• Rds On (Typ): 150 mOhm
• Input Type: Non-Inverting
• Features: -
• Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
• Operating Temperature: 150°C (TJ)
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

TDA19988BHN/C1,518

NXP

IC HDMI TRANSMITTER 64-HVQFN

• Type: HDMI Transmitter
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Dual Rows Exposed Pad
• Supplier Device Package: 64-HVQFN (9x9)

封裝: 64-VFQFN Dual Rows Exposed Pad

PC34901WNEFR2

NXP

CANHS 8SOIC

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

封裝: -

NX3DV3899HR,115

NXP

IC ANLG SWITCH DPDT 16-HXQFN

• Switch Circuit: DPDT
• Multiplexer/Demultiplexer Circuit: 2:2
• Number of Circuits: 2
• On-State Resistance (Max): 3.3 Ohm
• Channel-to-Channel Matching (ΔRon): 700 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 200MHz
• Charge Injection: 4pC
• Channel Capacitance (CS(off), CD(off)): 8pF
• Current - Leakage (IS(off)) (Max): 5nA
• Crosstalk: -90dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-XFQFN Exposed Pad
• Supplier Device Package: 16-HXQFN (3x3)

封裝: 16-XFQFN Exposed Pad

MPC8548VTAUJB

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

MC7448HX867ND

NXP

IC MPU MPC74XX 867MHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 867MHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BCBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

封裝: 360-BCBGA, FCCBGA

MC7447AVU1000NB

NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BCBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

封裝: 360-BCBGA, FCCBGA

MK30DN512ZVLL10

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 38x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

P80CE598FFB/00,557

NXP

IC MCU 8BIT ROMLESS 80QFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: CAN, EBI/EMI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-BQFP
• Supplier Device Package: 80-PQFP (14x20)

封裝: 80-BQFP

MC908SR12MFAER

NXP

IC MCU 8BIT 12KB FLASH 48LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, SCI
• Peripherals: LVD, POR, PWM, Temp Sensor
• Number of I/O: 31
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

PCF8564ACX9/B/1,02

NXP

IC RTC CLK/CALENDAR I2C DIE

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 1 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封裝: Die

IP4389CX4,315

NXP

IC ESD PROTECT HS MMC 4CSP

• Voltage - Clamping: -
• Technology: Mixed Technology
• Number of Circuits: 1
• Number of Circuits: 1
• Applications: General Purpose
• Mounting Type: Surface Mount
• Package / Case: 4-UFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

封裝: 4-UFBGA, WLCSP

MAG3110FCR1

NXP

SENSOR MAGMTR I2C 10DFN

• Type: Compass/Magnetometer
• Technology: Magnetoresistive
• Axis: X, Y, Z
• Output Type: I2C
• Sensing Range: ±1mT
• Voltage - Supply: 1.9 V ~ 3.6 V
• Current - Supply (Max): 900µA (Typ)
• Current - Output (Max): -
• Resolution: -
• Bandwidth: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Temperature Compensated
• Package / Case: 10-VFDFN
• Supplier Device Package: 10-DFN (2x2)

封裝: 10-VFDFN

MMA6527KW

NXP

ACCELEROMETER 120G SPI 16QFN

• Type: Digital
• Axis: X, Y
• Acceleration Range: ±120g
• Sensitivity (LSB/g): 16
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: SPI
• Voltage - Supply: 3.135 V ~ 5.25 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

封裝: 16-QFN Exposed Pad

PJF7992ATW/C1C/DJ

NXP

IMMOBIL BASESTATION IC 20HTSSOP

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
• Supplier Device Package: 20-HTSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad

NCK2913AHN/T2CY

NXP

IC RECEIVER 3CH 48HVQFN

• Type: -
• RF Family/Standard: -
• Protocol: -
• Modulation: -
• Frequency: -
• Data Rate (Max): -
• Power - Output: -
• Sensitivity: -
• Memory Size: -
• Serial Interfaces: -
• GPIO: -
• Voltage - Supply: -
• Current - Receiving: -
• Current - Transmitting: -
• Operating Temperature: -
• Package / Case: -

封裝: -

TDA18287HN/C1Y

NXP

CABLE FST DEMOD

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

SPC5675KF0MMM2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z7d
• Core Size: 32-Bit Dual-Core
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
• Data Converters: A/D 22x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-MAPBGA (14x14)

封裝: 257-LFBGA

SPC5605BF1VLQ6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

TDF8532HH-N2K

NXP

BAP3 DIE1

• Type: -
• Output Type: -
• Max Output Power x Channels @ Load: -
• Voltage - Supply: -
• Features: -
• Mounting Type: -
• Operating Temperature: -
• Supplier Device Package: -
• Package / Case: -

封裝: -

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NVT4557UKAZ

NXP

IC TRANSLTR BIDIRECTIONAL 9WLCSP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 1
• Voltage - VCCA: 1.08 V ~ 1.95 V
• Voltage - VCCB: 1.65 V ~ 3.6 V
• Input Signal: -
• Output Signal: -
• Output Type: Non-Inverted
• Data Rate: 10MHz
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 9-XFBGA, WLCSP
• Supplier Device Package: 9-WLCSP (0.92x0.92)

封裝: -

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S32K312NHT0VPASR

NXP

S32K312, 2MB FLASH, ARM M7

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
• Peripherals: DMA, I2S, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128K x 8
• RAM Size: 192K x 8
• Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
• Data Converters: A/D 24x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-QFP
• Supplier Device Package: 100-MaxQFP (10x10)

封裝: -

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SAF7770EL-101Z13AK

NXP

SAF7770EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (15x15)

封裝: -

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