頁 541 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PSMN013-30LL,115	NXP	MOSFET N-CH 30V QFN3333 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 21A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 12.2nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 768pF @ 15V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 41W (Tc) Rds On (Max) @ Id, Vgs: 13 mOhm @ 5A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 8-DFN3333 (3.3x3.3) Package / Case: 8-VDFN Exposed Pad	封裝: 8-VDFN Exposed Pad	庫存2,576
BUK9520-55,127	NXP	MOSFET N-CH 55V 52A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 52A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 2400pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 116W (Tc) Rds On (Max) @ Id, Vgs: 20 mOhm @ 25A, 5V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存7,616
BSR12,215	NXP	TRANS PNP 15V 0.1A SOT-23 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 15V Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 50mA, 1V Power - Max: 250mW Frequency - Transition: 1.5GHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存28,314
PZM24NB3,115	NXP	DIODE ZENER 24V 300MW SMT3 Voltage - Zener (Nom) (Vz): 24V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 30 Ohms Current - Reverse Leakage @ Vr: 70nA @ 19V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存4,464
MCZ33937AEKR2	NXP	IC PRE-DRIVER 3PH ENH 54-SOIC Motor Type - Stepper: - Motor Type - AC, DC: Brushless DC (BLDC) Function: Controller - Commutation, Direction Management Output Configuration: Pre-Driver - Half Bridge (3) Interface: SPI Technology: NMOS Step Resolution: - Applications: Automotive Current - Output: - Voltage - Supply: 6 V ~ 58 V Voltage - Load: - Operating Temperature: -40°C ~ 135°C (TA) Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存3,616
M86291G12	NXP	IC C2K 900MHZ 8CH VOIP 625FCBGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,528
MCZ33989EGR2	NXP	IC SYSTEM BASIS CHIP CAN 28-SOIC Applications: System Basis Chip Interface: CAN, SPI Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存120,876
MC145484EJ	NXP	IC CODEC-FILTER PCM 5V 20-TSSOP Type: PCM, Filter Data Interface: PCM Audio Interface Resolution (Bits): 13 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: - Dynamic Range, ADCs / DACs (db) Typ: - Voltage - Supply, Analog: - Voltage - Supply, Digital: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存4,192
MPC8547EHXAQG	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存5,040
MPC8241TZQ200D	NXP	IC MPU MPC82XX 200MHZ 357BGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存4,080
MC908QY1ACDTE	NXP	IC MCU 8BIT 1.5KB FLASH 16TSSOP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存364,932
P89LPC914FDH,129	NXP	IC MCU 8BIT 1KB FLASH 14TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 12MHz Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 1KB (1K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 14-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 14-TSSOP	封裝: 14-TSSOP (0.173", 4.40mm Width)	庫存2,880
MC56F8335MFGE	NXP	IC MCU 16BIT 64KB FLASH 128LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Number of I/O: 49 Program Memory Size: 64KB (32K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 6K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 128-LQFP Supplier Device Package: 128-LQFP (14x20)	封裝: 128-LQFP	庫存4,240
MC68332ACEH20	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	封裝: 132-BQFP Bumpered	庫存6,096
MM912F634CV1AE	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: 48-LQFP Exposed Pad	庫存117,180
A7002CMHN1/T1AGBEL	NXP	MCU SECURE ID Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: I2C, 2-Wire Serial Number of I/O: - Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -40°C ~ 90°C Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,216
MMA6856LKWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,084
T1024NSE7KNA	NXP	QORIQ 2XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,152
MCIMX6DP4AVT1ABR	NXP	IC MPU I.MX6DP ENHAN 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	封裝: 624-FBGA, FCBGA	庫存4,496
S912XEP768W1MAGR	NXP	16-BIT MCU S12X CORE 768KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存6,512
S912XET256J2VAA	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封裝: 80-QFP	庫存6,672
S9S12G96AMLL	NXP	16BIT 96K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存6,576
S912ZVCA96F0MLFR	NXP	MAGNIV 16-BIT MCU S12Z CORE 96 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 10x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存3,424
MKL17Z32VDA4R	NXP	KINETIS KL17: 48MHZ CORTEX-M0+ U Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, FlexIO, SPI, UART/USART Peripherals: DMA, I²S, PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 15x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 36-XFBGA Supplier Device Package: 36-XFBGA (3.5x3.5)	封裝: 36-XFBGA	庫存3,072
S912ZVMC12AMKH	NXP	S12Z CORE,128K FLASH,CAN,64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-HLQFP (10x10)	封裝: -	Request a Quote
SAF775CHN-N208W-MP	NXP	CAR RADIO TUNER & AUDIO DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MC33PF8100EPESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
S912ZVLA12ACLF	NXP	S12Z CPU, 128K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x10b, 10x12b; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote

PSMN013-30LL,115

NXP

MOSFET N-CH 30V QFN3333

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 21A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 12.2nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 768pF @ 15V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 41W (Tc)
Rds On (Max) @ Id, Vgs: 13 mOhm @ 5A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Package / Case: 8-VDFN Exposed Pad

封裝: 8-VDFN Exposed Pad

庫存2,576

BUK9520-55,127

NXP

MOSFET N-CH 55V 52A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 52A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 2400pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 116W (Tc)
Rds On (Max) @ Id, Vgs: 20 mOhm @ 25A, 5V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存7,616

BSR12,215

NXP

TRANS PNP 15V 0.1A SOT-23

Transistor Type: PNP
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 50mA, 1V
Power - Max: 250mW
Frequency - Transition: 1.5GHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存28,314

PZM24NB3,115

NXP

DIODE ZENER 24V 300MW SMT3

Voltage - Zener (Nom) (Vz): 24V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 30 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 19V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存4,464

MCZ33937AEKR2

NXP

IC PRE-DRIVER 3PH ENH 54-SOIC

Motor Type - Stepper: -
Motor Type - AC, DC: Brushless DC (BLDC)
Function: Controller - Commutation, Direction Management
Output Configuration: Pre-Driver - Half Bridge (3)
Interface: SPI
Technology: NMOS
Step Resolution: -
Applications: Automotive
Current - Output: -
Voltage - Supply: 6 V ~ 58 V
Voltage - Load: -
Operating Temperature: -40°C ~ 135°C (TA)
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存3,616

M86291G12

NXP

IC C2K 900MHZ 8CH VOIP 625FCBGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,528

MCZ33989EGR2

NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

Applications: System Basis Chip
Interface: CAN, SPI
Voltage - Supply: 5.5 V ~ 18 V
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC
Mounting Type: Surface Mount

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存120,876

MC145484EJ

NXP

IC CODEC-FILTER PCM 5V 20-TSSOP

Type: PCM, Filter
Data Interface: PCM Audio Interface
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
S/N Ratio, ADCs / DACs (db) Typ: -
Dynamic Range, ADCs / DACs (db) Typ: -
Voltage - Supply, Analog: -
Voltage - Supply, Digital: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存4,192

MPC8547EHXAQG

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存5,040

MPC8241TZQ200D

NXP

IC MPU MPC82XX 200MHZ 357BGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存4,080

MC908QY1ACDTE

NXP

IC MCU 8BIT 1.5KB FLASH 16TSSOP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存364,932

P89LPC914FDH,129

NXP

IC MCU 8BIT 1KB FLASH 14TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 12MHz
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 1KB (1K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 14-TSSOP

封裝: 14-TSSOP (0.173", 4.40mm Width)

庫存2,880

MC56F8335MFGE

NXP

IC MCU 16BIT 64KB FLASH 128LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 49
Program Memory Size: 64KB (32K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 6K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 128-LQFP
Supplier Device Package: 128-LQFP (14x20)

封裝: 128-LQFP

庫存4,240

MC68332ACEH20

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

封裝: 132-BQFP Bumpered

庫存6,096

MM912F634CV1AE

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (32 KB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: 48-LQFP Exposed Pad

庫存117,180

A7002CMHN1/T1AGBEL

NXP

MCU SECURE ID

Applications: Authentication
Core Processor: MX51
Program Memory Type: EEPROM (76.4 kB)
Controller Series: A700x
RAM Size: 3.2kB
Interface: I2C, 2-Wire Serial
Number of I/O: -
Voltage - Supply: 1.62 V ~ 5.5 V
Operating Temperature: -40°C ~ 90°C
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,216

MMA6856LKWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,084

T1024NSE7KNA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,152

MCIMX6DP4AVT1ABR

NXP

IC MPU I.MX6DP ENHAN 624FCBGA

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

封裝: 624-FBGA, FCBGA

庫存4,496

S912XEP768W1MAGR

NXP

16-BIT MCU S12X CORE 768KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存6,512

S912XET256J2VAA

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

庫存6,672

S9S12G96AMLL

NXP

16BIT 96K FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存6,576

S912ZVCA96F0MLFR

NXP

MAGNIV 16-BIT MCU S12Z CORE 96

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 10x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存3,424

MKL17Z32VDA4R

NXP

KINETIS KL17: 48MHZ CORTEX-M0+ U

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, FlexIO, SPI, UART/USART
Peripherals: DMA, I²S, PWM, WDT
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 15x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 36-XFBGA
Supplier Device Package: 36-XFBGA (3.5x3.5)

封裝: 36-XFBGA

庫存3,072

S912ZVMC12AMKH

NXP

S12Z CORE,128K FLASH,CAN,64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 9x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-HLQFP (10x10)

封裝: -

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SAF775CHN-N208W-MP

NXP

CAR RADIO TUNER & AUDIO DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MC33PF8100EPESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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S912ZVLA12ACLF

NXP

S12Z CPU, 128K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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