頁 507 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PH1825AL,115	NXP	MOSFET N-CH 25V 100A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 31nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 4300pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 104W (Tc) Rds On (Max) @ Id, Vgs: 1.8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	封裝: SC-100, SOT-669	庫存3,616
MRF6V2010NBR5	NXP	FET RF 110V 220MHZ TO-272-2 Transistor Type: LDMOS Frequency: 220MHz Gain: 23.9dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 30mA Power - Output: 10W Voltage - Rated: 110V Package / Case: TO-272BC Supplier Device Package: TO-272-2	封裝: TO-272BC	庫存5,760
BFU790F,115	NXP	TRANSISTOR NPN SOT343F Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 2.8V Frequency - Transition: 25GHz Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz Gain: - Power - Max: 234mW DC Current Gain (hFE) (Min) @ Ic, Vce: 235 @ 10mA, 2V Current - Collector (Ic) (Max): 100mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SOT-343F Supplier Device Package: 4-DFP	封裝: SOT-343F	庫存5,184
MC34920EIR2	NXP	IC MOTOR DRIVER SER 44PLCC Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (8) Interface: Serial Technology: Power MOSFET Step Resolution: - Applications: General Purpose Current - Output: 1.5A Voltage - Supply: 3.3V, 5V Voltage - Load: 21 V ~ 42 V Operating Temperature: 0°C ~ 135°C (TJ) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (17.525x17.525)	封裝: 44-LCC (J-Lead)	庫存3,904
74HCT42N,652	NXP	IC BCD TO DECIMAL DECODER 16DIP Type: Decoder Circuit: 1 x 4:10 Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存3,504
74HCT85N,652	NXP	IC COMPARATOR MAGNITUDE 4B 16DIP Type: Magnitude Comparator Number of Bits: 4 Output: Active High Output Function: A<B, A=B, A>B Voltage - Supply: 4.5 V ~ 5.5 V Current - Output High, Low: 4mA, 4mA Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF Current - Quiescent (Iq): 8µA Operating Temperature: -40°C ~ 125°C Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole	封裝: 16-DIP (0.300", 7.62mm)	庫存5,696
74HCT646D,653	NXP	IC TXRX NON-INV 3-ST 8BIT 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存5,104
PCA9554PW/DG,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存7,424
TJA1145TKJ	NXP	IC TRANSCEIVER CAN HS 14HVSON Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 3.3 V ~ 5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	封裝: 14-VDFN Exposed Pad	庫存6,448
TJA1051T,112	NXP	IC CAN TXRX HI-SPEED 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120mV Data Rate: 5Mbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存19,680
P1014NXN5DFA	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	封裝: 425-FBGA	庫存4,144
P1010PSN5HFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA1	封裝: 425-FBGA	庫存5,360
P89CV51RC2FBC,557	NXP	IC MCU 8BIT 32KB FLASH 44TQFP Core Processor: 8051 Core Size: 8-Bit Speed: 40MHz Connectivity: EBI/EMI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	封裝: 44-TQFP	庫存4,000
MC908GZ32MFUE	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 53 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存2,976
LPC1810FBD144,551	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 83 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存5,568
MC9S12C128MFAE	NXP	IC MCU 16BIT 128KB FLASH 48LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 31 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存14,994
MK22DX256VLH5	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 18x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存7,236
MMA6823LKCWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±50g Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	封裝: 16-QFN Exposed Pad	庫存8,514
JN5174/001Y	NXP	IC MCU WIRELESS HVQFN40 Type: - RF Family/Standard: - Protocol: - Modulation: - Frequency: - Data Rate (Max): - Power - Output: - Sensitivity: - Memory Size: - Serial Interfaces: - GPIO: - Voltage - Supply: - Current - Receiving: - Current - Transmitting: - Operating Temperature: - Package / Case: -	封裝: -	庫存5,724
OM7616/BGM1013	NXP	EVAL BOARD FOR BGM1013 Type: Amplifier Frequency: 0Hz ~ 2.2GHz For Use With/Related Products: BGM1013 Supplied Contents: Board	封裝: -	庫存4,104
FS32K144UAT0VMHT	NXP	S32K144 100 MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	封裝: 100-LBGA	庫存2,432
FS32K146HFT0MLLT	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: -	Request a Quote
MC10XS4200CFK	NXP	HIGH-SIDE SWITCH, 24V, DUAL 10MO Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Rds On (Typ): 10mOhm (Max) Input Type: CMOS Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	封裝: -	Request a Quote
MC33FS8510B6KSR2	NXP	FS8500 C0 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
S9S12GN48J0MLHR	NXP	S12 CORE,48K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
MC17XS6400DEKR2	NXP	HIGH-SIDE SWITCH, 12V, QUAD 17MO Switch Type: General Purpose Number of Outputs: 6 Ratio - Input:Output: 1:6 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 11A Rds On (Typ): 15mOhm Input Type: Non-Inverting Features: PWM Input, Slew Rate Controlled, Status Flag Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-HSOP	封裝: -	Request a Quote
SAF5000EL-V100K	NXP	IC RADIO SYSTEM MULTI Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	Request a Quote
MKW37A512VFT4	NXP	IC MCU 32BIT 512KB FLASH 48HVQFN Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封裝: -	Request a Quote

PH1825AL,115

NXP

MOSFET N-CH 25V 100A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 31nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 4300pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 104W (Tc)
Rds On (Max) @ Id, Vgs: 1.8 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

封裝: SC-100, SOT-669

庫存3,616

MRF6V2010NBR5

NXP

FET RF 110V 220MHZ TO-272-2

Transistor Type: LDMOS
Frequency: 220MHz
Gain: 23.9dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 30mA
Power - Output: 10W
Voltage - Rated: 110V
Package / Case: TO-272BC
Supplier Device Package: TO-272-2

封裝: TO-272BC

庫存5,760

BFU790F,115

NXP

TRANSISTOR NPN SOT343F

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 2.8V
Frequency - Transition: 25GHz
Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz
Gain: -
Power - Max: 234mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 235 @ 10mA, 2V
Current - Collector (Ic) (Max): 100mA
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SOT-343F
Supplier Device Package: 4-DFP

封裝: SOT-343F

庫存5,184

MC34920EIR2

NXP

IC MOTOR DRIVER SER 44PLCC

Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (8)
Interface: Serial
Technology: Power MOSFET
Step Resolution: -
Applications: General Purpose
Current - Output: 1.5A
Voltage - Supply: 3.3V, 5V
Voltage - Load: 21 V ~ 42 V
Operating Temperature: 0°C ~ 135°C (TJ)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (17.525x17.525)

封裝: 44-LCC (J-Lead)

庫存3,904

74HCT42N,652

NXP

IC BCD TO DECIMAL DECODER 16DIP

Type: Decoder
Circuit: 1 x 4:10
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存3,504

74HCT85N,652

NXP

IC COMPARATOR MAGNITUDE 4B 16DIP

Type: Magnitude Comparator
Number of Bits: 4
Output: Active High
Output Function: A<B, A=B, A>B
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Output High, Low: 4mA, 4mA
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Current - Quiescent (Iq): 8µA
Operating Temperature: -40°C ~ 125°C
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole

封裝: 16-DIP (0.300", 7.62mm)

庫存5,696

74HCT646D,653

NXP

IC TXRX NON-INV 3-ST 8BIT 24SOIC

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 6mA, 6mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存5,104

PCA9554PW/DG,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存7,424

TJA1145TKJ

NXP

IC TRANSCEIVER CAN HS 14HVSON

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 3.3 V ~ 5 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

封裝: 14-VDFN Exposed Pad

庫存6,448

TJA1051T,112

NXP

IC CAN TXRX HI-SPEED 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 120mV
Data Rate: 5Mbps
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存19,680

P1014NXN5DFA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

封裝: 425-FBGA

庫存4,144

P1010PSN5HFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA1

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA1

封裝: 425-FBGA

庫存5,360

P89CV51RC2FBC,557

NXP

IC MCU 8BIT 32KB FLASH 44TQFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 40MHz
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-TQFP
Supplier Device Package: 44-TQFP (10x10)

封裝: 44-TQFP

庫存4,000

MC908GZ32MFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 53
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存2,976

LPC1810FBD144,551

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存5,568

MC9S12C128MFAE

NXP

IC MCU 16BIT 128KB FLASH 48LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存14,994

MK22DX256VLH5

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 18x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存7,236

MMA6823LKCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±50g
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

封裝: 16-QFN Exposed Pad

庫存8,514

JN5174/001Y

NXP

IC MCU WIRELESS HVQFN40

Type: -
RF Family/Standard: -
Protocol: -
Modulation: -
Frequency: -
Data Rate (Max): -
Power - Output: -
Sensitivity: -
Memory Size: -
Serial Interfaces: -
GPIO: -
Voltage - Supply: -
Current - Receiving: -
Current - Transmitting: -
Operating Temperature: -
Package / Case: -

封裝: -

庫存5,724

OM7616/BGM1013

NXP

EVAL BOARD FOR BGM1013

Type: Amplifier
Frequency: 0Hz ~ 2.2GHz
For Use With/Related Products: BGM1013
Supplied Contents: Board

封裝: -

庫存4,104

FS32K144UAT0VMHT

NXP

S32K144 100 MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

封裝: 100-LBGA

庫存2,432

FS32K146HFT0MLLT

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

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MC10XS4200CFK

NXP

HIGH-SIDE SWITCH, 24V, DUAL 10MO

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Rds On (Typ): 10mOhm (Max)
Input Type: CMOS
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 23-PowerQFN
Supplier Device Package: 23-PQFN (12x12)

封裝: -

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MC33FS8510B6KSR2

NXP

FS8500 C0

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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S9S12GN48J0MLHR

NXP

S12 CORE,48K FLASH

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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MC17XS6400DEKR2

NXP

HIGH-SIDE SWITCH, 12V, QUAD 17MO

Switch Type: General Purpose
Number of Outputs: 6
Ratio - Input:Output: 1:6
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Features: PWM Input, Slew Rate Controlled, Status Flag
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-HSOP

封裝: -

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SAF5000EL-V100K

NXP

IC RADIO SYSTEM MULTI

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

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MKW37A512VFT4

NXP

IC MCU 32BIT 512KB FLASH 48HVQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 16b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封裝: -

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