NXP 產品

BSR58,215

NXP

JFET N-CH 40V 250MW SOT23

• FET Type: N-Channel
• Voltage - Breakdown (V(BR)GSS): 40V
• Drain to Source Voltage (Vdss): 40V
• Current - Drain (Idss) @ Vds (Vgs=0): 8mA @ 15V
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: 800mV @ 0.5nA
• Input Capacitance (Ciss) (Max) @ Vds: -
• Resistance - RDS(On): 60 Ohm
• Power - Max: 250mW
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23 (TO-236AB)

封裝: TO-236-3, SC-59, SOT-23-3

SI4800,518

NXP

MOSFET N-CH 30V 9A SOT96-1

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 9A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 800mV @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 11.8nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: -
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 2.5W (Ta)
• Rds On (Max) @ Id, Vgs: 18.5 mOhm @ 9A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-SO
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

封裝: 8-SOIC (0.154", 3.90mm Width)

PMG370XN,115

NXP

MOSFET N-CH 30V 0.96A 6TSSOP

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 960mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
• Vgs(th) (Max) @ Id: 1.5V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 0.65nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 37pF @ 25V
• Vgs (Max): ±12V
• FET Feature: -
• Power Dissipation (Max): 690mW (Tc)
• Rds On (Max) @ Id, Vgs: 440 mOhm @ 200mA, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 6-TSSOP
• Package / Case: 6-TSSOP, SC-88, SOT-363

封裝: 6-TSSOP, SC-88, SOT-363

BF1215,115

NXP

FET RF 6V 400MHZ 6TSSOP

• Transistor Type: N-Channel Dual Gate
• Frequency: 400MHz
• Gain: 30dB
• Voltage - Test: 5V
• Current Rating: 30mA
• Noise Figure: 1.5dB
• Current - Test: 19mA
• Power - Output: -
• Voltage - Rated: 6V
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封裝: 6-TSSOP, SC-88, SOT-363

PDTC123JS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 2.2k
• Resistor - Emitter Base (R2) (Ohms): 47k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

UBA2021P/N2,112

NXP

IC CFL DRIVER 630V 14-DIP

• Type: CFL/TL Controller
• Frequency: 41.21kHz ~ 44.59kHz
• Voltage - Supply: 10.15 V ~ 11.95 V
• Current - Supply: 1mA
• Current - Output Source/Sink: -
• Dimming: No
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

封裝: 14-DIP (0.300", 7.62mm)

PCF2119DU/2/2Z

NXP

IC LCD CTLR/DRIVER UNCASED

• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
• Interface: I2C, Parallel
• Digits or Characters: 16 Characters, 32 Characters, 40 Elements
• Current - Supply: 35µA
• Voltage - Supply: 1.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封裝: Die

74CBTLV16211DGV:11

NXP

IC BUS SWITCH 24BIT DUAL 56TSSOP

• Type: Bus Switch
• Circuit: 12 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 56-TSSOP

封裝: 56-TFSOP (0.173", 4.40mm Width)

74ALVCHS162830DGB:

NXP

IC ADDRESS DVR 18-36BIT 80TSSOP

• Logic Type: Address Driver
• Number of Elements: 1
• Number of Bits per Element: 1:2
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 80-TSSOP

封裝: 80-TFSOP (0.240", 6.10mm Width)

74LVCH322244AEC:55

NXP

IC BUFF DVR TRI-ST 32BIT 96LFBGA

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 8
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

封裝: 96-LFBGA

PCA9555AHF,128

NXP

IC I/O EXPANDER I2C 24QFN

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-WFQFN Exposed Pad
• Supplier Device Package: 24-HWQFN (4x4)

封裝: 24-WFQFN Exposed Pad

NX3L4684GM,115

NXP

IC ANALOG SWITCH SPDT 10XQFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 40 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 45ns, 20ns
• -3db Bandwidth: 20MHz
• Charge Injection: 50pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.55x2)

封裝: 10-XFQFN

MC908KX2MDWE

NXP

IC MCU 8BIT 2KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

MKV44F128VLL16

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 168MHz
• Connectivity: CAN, I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 74
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 38x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

MKL26Z32VLH4

NXP

IC MCU 32BIT 32KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

MC68HC908QT2CPE

NXP

IC MCU 8BIT 1.5KB FLASH 8DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

PN5180A0HN/C1,551

NXP

HVQFN40

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, ISO 15693, ISO 18000-3
• Interface: SPI, UART
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

封裝: 40-VFQFN Exposed Pad

PN7150B0HN/C11002Y

NXP

IC RFID READER 13.56MHZ 40VFQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: FeliCa, ISO 14443, MIFARE, NFC
• Interface: I2C, UART
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

封裝: 40-VFQFN Exposed Pad

SAA6581T/V1H,512

NXP

IC DEMODULATOR RDS/RBDS SO16

• Function: Demodulator, Filter
• LO Frequency: 4.332MHz, 8.664MHz
• RF Frequency: -
• P1dB: -
• Gain: 20dB
• Noise Figure: -
• Current - Supply: 6mA
• Voltage - Supply: 4 V ~ 5.5 V
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

封裝: 16-SOIC (0.295", 7.50mm Width)

MW7IC930GNR1

NXP

IC PWR AMP RF 900MHZ TO-270-16

• Frequency: 728MHz ~ 768MHz, 920MHz ~ 960MHz
• P1dB: 44.9dBm (31W)
• Gain: 36.8dB
• Noise Figure: -
• RF Type: W-CDMA
• Voltage - Supply: 32V
• Current - Supply: 340mA
• Test Frequency: 940MHz
• Package / Case: TO-270-16 Variant, Gull Wing
• Supplier Device Package: TO-270 WBL-16 GULL

封裝: TO-270-16 Variant, Gull Wing

MC33FS6512LAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP Exposed Pad

MC32PF1550A0EP

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

封裝: 40-VFQFN Exposed Pad

A3G26H350W17SR3

NXP

RF MOSFET GAN 48V NI780

• Transistor Type: GaN
• Frequency: 2.496GHz ~ 2.69GHz
• Gain: 13.3dB
• Voltage - Test: 48 V
• Current Rating: -
• Noise Figure: -
• Current - Test: 250 mA
• Power - Output: 59W
• Voltage - Rated: 125 V
• Package / Case: NI-780S-4S2S
• Supplier Device Package: NI-780S-4S2S

封裝: -

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MKM35Z512VLQ7

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 75MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LCD, RNG, WDT
• Number of I/O: 99
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 16x16b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封裝: -

S9KEAZ64AVLHR

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 58
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封裝: -

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MC9S08PB16MTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封裝: -

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FC32K146UAT0VLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

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MFS2633AMDA0AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: System Basis Chip
• Current - Supply: 29µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

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