頁 426 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MMRF1012NR1	NXP	FET RF 120V 220MHZ Transistor Type: LDMOS Frequency: 220MHz Gain: 23.9dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 30mA Power - Output: 10W Voltage - Rated: 120V Package / Case: TO-270-2 Supplier Device Package: TO-270-2	封裝: TO-270-2	庫存2,432
MRF7S15100HR5	NXP	FET RF 65V 1.51GHZ NI780 Transistor Type: LDMOS Frequency: 1.51GHz Gain: 19.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 600mA Power - Output: 23W Voltage - Rated: 65V Package / Case: NI-780 Supplier Device Package: NI-780	封裝: NI-780	庫存3,472
MMRF1016HR5	NXP	FET RF 2CH 120V 225MHZ Transistor Type: LDMOS (Dual) Frequency: 225MHz Gain: 25dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 2.6A Power - Output: 125W Voltage - Rated: 120V Package / Case: SOT-979A Supplier Device Package: NI-1230-4H	封裝: SOT-979A	庫存5,424
BAV199/ZLVL	NXP	DIODE ARRAY GEN PURP 75V SOT23 Diode Configuration: 1 Pair Series Connection Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 75V Current - Average Rectified (Io) (per Diode): 160mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 3µs Current - Reverse Leakage @ Vr: 5nA @ 75V Operating Temperature - Junction: 150°C (Max) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存6,288
SSL5236BTE/1Y	NXP	IC LED DRIVER DIMMABLE 8SO Type: AC DC Offline Switcher Topology: Step-Down (Buck) Internal Switch(s): Yes Number of Outputs: 1 Voltage - Supply (Min): 9.9V Voltage - Supply (Max): 16V Voltage - Output: - Current - Output / Channel: 450mA Frequency: - Dimming: Triac Applications: - Operating Temperature: -40°C ~ 160°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad Supplier Device Package: 8-HSO	封裝: 8-SOIC (0.154", 3.90mm Width) Exposed Pad	庫存5,280
TEA1520P/N2,112	NXP	IC CTRLR SMPS OVP UVLO HV 8DIP Output Isolation: Isolated Internal Switch(s): Yes Voltage - Breakdown: 650V Topology: Flyback Voltage - Start Up: 9.5V Voltage - Supply (Vcc/Vdd): 7.5 V ~ 40 V Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Power (Watts): 30W Fault Protection: Current Limiting, Over Temperature, Short Circuit Control Features: Frequency Control Operating Temperature: -40°C ~ 145°C (TJ) Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP Mounting Type: Through Hole	封裝: 8-DIP (0.300", 7.62mm)	庫存3,136
MCZ33903BS3EK	NXP	IC SBC CAN HS 3.3V 32SOIC Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存6,528
PTN3332DH,118	NXP	IC DIFF LINE RCVR 16TSSOP Type: Driver Protocol: LVDS Number of Drivers/Receivers: 4/0 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存7,264
P1016NSN5BFB	NXP	IC MPU Q OR IQ 667MHZ 561TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 561-FBGA Supplier Device Package: 561-TEPBGA1 (23x23)	封裝: 561-FBGA	庫存6,624
P1013PSE2LFA	NXP	IC MPU Q OR IQ 1.067GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存3,376
KMPC8241TVR200D	NXP	IC MPU MPC82XX 200MHZ 357BGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存4,816
P2040NSN7HLC	NXP	IC MPU Q OR IQ 800MHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: - Supplier Device Package: 780-FCPBGA (23x23)	封裝: -	庫存6,288
MPC8245LZU350D	NXP	IC MPU MPC82XX 350MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	封裝: 352-LBGA	庫存5,456
MC9328MXSCVP10R2	NXP	IC MPU I.MXS 100MHZ 225MAPBGA Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: - SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13)	封裝: 225-LFBGA	庫存4,096
MC908QL3CDWE	NXP	IC MCU 8BIT 6KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: 6KB (6K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存6,640
MMC2107CFCPV33	NXP	IC MCU 32BIT 128KB FLASH 144LQFP Core Processor: M210 Core Size: 32-Bit Speed: 33MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 72 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存6,720
MC9S12D64VPVE	NXP	IC MCU 16BIT 64KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存5,424
MC56F84441VLF	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 60MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存8,232
LPC812M101JDH20J	NXP	IC MCU 32BIT 16KB FLASH 20TSSOP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 30MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存2,656
MC9S08AW32CPUE	NXP	IC MCU 8BIT 32KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存16,980
MKE02Z32VLD2	NXP	IC MCU 32BIT 32KB FLASH 44LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 20MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存5,616
MC9S08SH4CTJ	NXP	IC MCU 8BIT 4KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 17 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存7,136
MCF52211CAE66	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 43 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存7,664
SAF7741HV/N125YK	NXP	IC HD RADIO PROCESSOR 144HLQFP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,392
S912XHY256F0VLLR	NXP	16-BIT MCU S12 CORE 256KB FLAS Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 76 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存2,432
S9S12G128AVLHR	NXP	16BIT 128K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存6,592
MC9S08PA16VTJ	NXP	8 BITHCS08L CORE16K FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存5,712
A3T21H455W23SR6	NXP	RF MOSFET LDMOS 30V ACP1230S-4 Transistor Type: LDMOS Frequency: 2.11GHz ~ 2.2GHz Gain: 15dB Voltage - Test: 30 V Current Rating: 10µA Noise Figure: - Current - Test: 400 mA Power - Output: 87W Voltage - Rated: 65 V Package / Case: ACP-1230S-4L2S Supplier Device Package: ACP-1230S-4L2S	封裝: -	Request a Quote

MMRF1012NR1

NXP

FET RF 120V 220MHZ

Transistor Type: LDMOS
Frequency: 220MHz
Gain: 23.9dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 30mA
Power - Output: 10W
Voltage - Rated: 120V
Package / Case: TO-270-2
Supplier Device Package: TO-270-2

封裝: TO-270-2

庫存2,432

MRF7S15100HR5

NXP

FET RF 65V 1.51GHZ NI780

Transistor Type: LDMOS
Frequency: 1.51GHz
Gain: 19.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 600mA
Power - Output: 23W
Voltage - Rated: 65V
Package / Case: NI-780
Supplier Device Package: NI-780

封裝: NI-780

庫存3,472

MMRF1016HR5

NXP

FET RF 2CH 120V 225MHZ

Transistor Type: LDMOS (Dual)
Frequency: 225MHz
Gain: 25dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 2.6A
Power - Output: 125W
Voltage - Rated: 120V
Package / Case: SOT-979A
Supplier Device Package: NI-1230-4H

封裝: SOT-979A

庫存5,424

BAV199/ZLVL

NXP

DIODE ARRAY GEN PURP 75V SOT23

Diode Configuration: 1 Pair Series Connection
Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 75V
Current - Average Rectified (Io) (per Diode): 160mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3µs
Current - Reverse Leakage @ Vr: 5nA @ 75V
Operating Temperature - Junction: 150°C (Max)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存6,288

SSL5236BTE/1Y

NXP

IC LED DRIVER DIMMABLE 8SO

Type: AC DC Offline Switcher
Topology: Step-Down (Buck)
Internal Switch(s): Yes
Number of Outputs: 1
Voltage - Supply (Min): 9.9V
Voltage - Supply (Max): 16V
Voltage - Output: -
Current - Output / Channel: 450mA
Frequency: -
Dimming: Triac
Applications: -
Operating Temperature: -40°C ~ 160°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package: 8-HSO

封裝: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

庫存5,280

TEA1520P/N2,112

NXP

IC CTRLR SMPS OVP UVLO HV 8DIP

Output Isolation: Isolated
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Topology: Flyback
Voltage - Start Up: 9.5V
Voltage - Supply (Vcc/Vdd): 7.5 V ~ 40 V
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Power (Watts): 30W
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Control Features: Frequency Control
Operating Temperature: -40°C ~ 145°C (TJ)
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP
Mounting Type: Through Hole

封裝: 8-DIP (0.300", 7.62mm)

庫存3,136

MCZ33903BS3EK

NXP

IC SBC CAN HS 3.3V 32SOIC

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存6,528

PTN3332DH,118

NXP

IC DIFF LINE RCVR 16TSSOP

Type: Driver
Protocol: LVDS
Number of Drivers/Receivers: 4/0
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存7,264

P1016NSN5BFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 561-FBGA
Supplier Device Package: 561-TEPBGA1 (23x23)

封裝: 561-FBGA

庫存6,624

P1013PSE2LFA

NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存3,376

KMPC8241TVR200D

NXP

IC MPU MPC82XX 200MHZ 357BGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存4,816

P2040NSN7HLC

NXP

IC MPU Q OR IQ 800MHZ 780FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: -
Supplier Device Package: 780-FCPBGA (23x23)

封裝: -

庫存6,288

MPC8245LZU350D

NXP

IC MPU MPC82XX 350MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 350MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

封裝: 352-LBGA

庫存5,456

MC9328MXSCVP10R2

NXP

IC MPU I.MXS 100MHZ 225MAPBGA

Core Processor: ARM920T
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 100MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: -
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 225-LFBGA
Supplier Device Package: 225-MAPBGA (13x13)

封裝: 225-LFBGA

庫存4,096

MC908QL3CDWE

NXP

IC MCU 8BIT 6KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: 6KB (6K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存6,640

MMC2107CFCPV33

NXP

IC MCU 32BIT 128KB FLASH 144LQFP

Core Processor: M210
Core Size: 32-Bit
Speed: 33MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 72
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存6,720

MC9S12D64VPVE

NXP

IC MCU 16BIT 64KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存5,424

MC56F84441VLF

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 60MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存8,232

LPC812M101JDH20J

NXP

IC MCU 32BIT 16KB FLASH 20TSSOP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存2,656

MC9S08AW32CPUE

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存16,980

MKE02Z32VLD2

NXP

IC MCU 32BIT 32KB FLASH 44LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 20MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 37
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存5,616

MC9S08SH4CTJ

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 17
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存7,136

MCF52211CAE66

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 43
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存7,664

SAF7741HV/N125YK

NXP

IC HD RADIO PROCESSOR 144HLQFP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,392

S912XHY256F0VLLR

NXP

16-BIT MCU S12 CORE 256KB FLAS

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 76
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 8K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存2,432

S9S12G128AVLHR

NXP

16BIT 128K FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存6,592

MC9S08PA16VTJ

NXP

8 BITHCS08L CORE16K FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存5,712

A3T21H455W23SR6

NXP

RF MOSFET LDMOS 30V ACP1230S-4

Transistor Type: LDMOS
Frequency: 2.11GHz ~ 2.2GHz
Gain: 15dB
Voltage - Test: 30 V
Current Rating: 10µA
Noise Figure: -
Current - Test: 400 mA
Power - Output: 87W
Voltage - Rated: 65 V
Package / Case: ACP-1230S-4L2S
Supplier Device Package: ACP-1230S-4L2S

封裝: -

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