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NXP 產品

記錄 26,590
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hot PHD36N03LT,118
NXP

MOSFET N-CH 30V 43.4A DPAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 30V
  • Current - Continuous Drain (Id) @ 25°C: 43.4A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs: 18.5nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 690pF @ 25V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 57.6W (Tc)
  • Rds On (Max) @ Id, Vgs: 17 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: DPAK
  • Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
封裝: TO-252-3, DPak (2 Leads + Tab), SC-63
庫存19,392
PDTD123TK,115
NXP

TRANS PREBIAS NPN 250MW SMT3

  • Transistor Type: NPN - Pre-Biased
  • Current - Collector (Ic) (Max): 500mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 2.2k
  • Resistor - Emitter Base (R2) (Ohms): -
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
  • Current - Collector Cutoff (Max): 500nA
  • Frequency - Transition: -
  • Power - Max: 250mW
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
封裝: TO-236-3, SC-59, SOT-23-3
庫存6,336
PZM7.5NB1,115
NXP

DIODE ZENER 7.5V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 7.5V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 10 Ohms
  • Current - Reverse Leakage @ Vr: 1µA @ 4V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
封裝: TO-236-3, SC-59, SOT-23-3
庫存6,400
MCZ33880EGR2
NXP

IC SWITCH OCTAL SER I/O 28-SOIC

  • Switch Type: General Purpose
  • Number of Outputs: 8
  • Ratio - Input:Output: 1:8
  • Output Configuration: High Side or Low Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 5.5 V ~ 24.5 V
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Current - Output (Max): 800mA
  • Rds On (Typ): 550 mOhm
  • Input Type: -
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存7,168
74ALVT16260DL,512
NXP

IC 12-24BIT MUX D LATCH 56-SSOP

  • Logic Type: D-Type Transparent Latch
  • Circuit: 12:24
  • Output Type: Tri-State
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 2.8ns
  • Current - Output High, Low: 8mA, 24mA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-BSSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 56-SSOP
封裝: 56-BSSOP (0.295", 7.50mm Width)
庫存3,376
74LV174N,112
NXP

IC D-TYPE POS TRG SNGL 16DIP

  • Function: Master Reset
  • Type: D-Type
  • Output Type: Non-Inverted
  • Number of Elements: 1
  • Number of Bits per Element: 6
  • Clock Frequency: 100MHz
  • Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 12mA, 12mA
  • Voltage - Supply: 1 V ~ 5.5 V
  • Current - Quiescent (Iq): 160µA
  • Input Capacitance: 3.5pF
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
封裝: 16-DIP (0.300", 7.62mm)
庫存7,952
74LVT273PW,112
NXP

IC D-TYPE POS TRG SNGL 20TSSOP

  • Function: Master Reset
  • Type: D-Type
  • Output Type: Non-Inverted
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Clock Frequency: 150MHz
  • Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Current - Quiescent (Iq): 190µA
  • Input Capacitance: 4pF
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
封裝: 20-TSSOP (0.173", 4.40mm Width)
庫存2,800
74HC243N,652
NXP

IC BUS TXRX TRI-ST 4BIT 14DIP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 7.8mA, 7.8mA
  • Voltage - Supply: 2 V ~ 6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 14-DIP (0.300", 7.62mm)
  • Supplier Device Package: 14-DIP
封裝: 14-DIP (0.300", 7.62mm)
庫存2,256
UJA1078TW/5V0,118
NXP

IC SBC CAN/DUAL LIN 5V 32HTSSOP

  • Applications: Automotive
  • Interface: CAN, LIN
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
庫存4,272
MC33742SDWR2
NXP

IC SYSTEM BASE W/LIN 28-SOIC

  • Applications: Automotive
  • Interface: SPI Serial
  • Voltage - Supply: 5.5 V ~ 18 V
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
  • Mounting Type: Surface Mount
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存5,536
P1010NXN5DFA
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
封裝: 425-FBGA
庫存6,144
hot MC7447AHX733NB
NXP

IC MPU MPC74XX 733MHZ 360FCCBGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 733MHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
封裝: 360-BCBGA, FCCBGA
庫存6,224
MCIMX6QP6AVT8AA
NXP

IC MPU I.MX6QP 852MHZ 624FCBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 4 Core, 32-Bit
  • Speed: 852MHZ
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, DDR3L, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封裝: 624-FBGA, FCBGA
庫存6,144
hot MPC5200VR400
NXP

IC MPU MPC52XX 400MHZ 272BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 1.1 (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 272-BBGA
  • Supplier Device Package: 272-PBGA (27x27)
封裝: 272-BBGA
庫存8,952
hot MPC564CZP40
NXP

IC MCU 32BIT 512KB FLASH 388BGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 40MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 56
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
封裝: 388-BBGA
庫存6,352
MCF51AG128CLH
NXP

IC MCU 32BIT 128KB FLASH 64LQFP

  • Core Processor: Coldfire V1
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: DMA, LVD, PWM, WDT
  • Number of I/O: 53
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 19x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存3,584
LPC11E68JBD100E
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 80
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 36K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存4,496
hot S9S08LG16J0CLH
NXP

IC MCU 8BIT 18KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LCD, LVD, POR, PWM, WDT
  • Number of I/O: 53
  • Program Memory Size: 18KB (18K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1.9K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存10,560
P87C51MC2BA/02,529
NXP

IC MCU 8BIT 96KB OTP 44PLCC

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 24MHz
  • Connectivity: EBI/EMI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 3K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存9,216
hot MK20DN512VLL10
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 66
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 33x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存10,008
XC56L307VL150
NXP

IC DSP 24BIT 150MHZ 196-MABGA

  • Type: Fixed Point
  • Interface: Host Interface, SSI, SCI
  • Clock Rate: 150MHz
  • Non-Volatile Memory: ROM (576 B)
  • On-Chip RAM: 576kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.80V
  • Operating Temperature: -40°C ~ 100°C
  • Mounting Type: Surface Mount
  • Package / Case: 196-LBGA
  • Supplier Device Package: 196-MAPBGA (15x15)
封裝: 196-LBGA
庫存6,640
hot MPXH6115A6U
NXP

SENSOR ABS PRESS 16.7PSI MAX

  • Pressure Type: Absolute
  • Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
  • Output Type: Analog Voltage
  • Output: 0.2 V ~ 4.7 V
  • Accuracy: ±1.5%
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Port Size: -
  • Port Style: No Port
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 58.02 PSI (400 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 8-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 8-SSOP
封裝: 8-SOIC (0.295", 7.50mm Width)
庫存12,552
SPC5603EEF2MLHR
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, WDT
  • Number of I/O: 39
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 4x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存7,824
S9S12GN32ACLF
NXP

16-BIT32K FLASH2K RAM

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存3,344
LPC55S69JBD100E
NXP

IC MCU 32BIT 640KB FLASH 100LQFP

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 64
  • Program Memory Size: 640KB (640K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 320K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP Exposed Pad
  • Supplier Device Package: 100-HLQFP (14x14)
封裝: -
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S912ZVL12AMLF
NXP

S12Z CPU, 128K FLASH

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
  • Data Converters: A/D 10x10b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: -
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S32G399AACK1VUCR
NXP

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
  • Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
  • Speed: 400MHz, 1.3GHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 2.5Gbps (3)
  • SATA: -
  • USB: USB 2.0 OTG (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
封裝: -
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FB32K148HFT0VLQR
NXP

S32K148 144 LQFP

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote