頁 350 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BF908WR,115	NXP	MOSFET NCH DUAL GATE 12V CMPAK-4 Transistor Type: N-Channel Dual Gate Frequency: 200MHz Gain: - Voltage - Test: 8V Current Rating: 40mA Noise Figure: 0.6dB Current - Test: 15mA Power - Output: - Voltage - Rated: 12V Package / Case: SC-82A, SOT-343 Supplier Device Package: CMPAK-4	封裝: SC-82A, SOT-343	庫存3,504
CBT6832DGG,118	NXP	IC 16BIT 1OF2 MUX/DEMUX 56TSSOP Type: Multiplexer/Demultiplexer Circuit: 16 x 1:2 Independent Circuits: 1 Current - Output High, Low: 15mA, 64mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	封裝: 56-TFSOP (0.240", 6.10mm Width)	庫存2,672
74LVC543ABQ,118	NXP	IC REGISTERED TXRX 8BIT 24DHVQFN Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-DHVQFN (5.5x3.5)	封裝: 24-VFQFN Exposed Pad	庫存2,896
74ABT623D,602	NXP	IC TRANSCVR TRI-ST 8BIT 20SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存5,472
TDF8546AJ/N1,112	NXP	IC AMP AUDIO BTL DBS27P Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Through Hole Operating Temperature: - Supplier Device Package: DBS27P Package / Case: 27-SIP, Formed Leads	封裝: 27-SIP, Formed Leads	庫存2,704
PCA9554PW,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存24,564
SGTL5000XNAA3	NXP	IC AUDIO CODEC STEREO 32-QFN Type: Stereo Audio Data Interface: I2C, Serial, SPI? Resolution (Bits): - Number of ADCs / DACs: 1 / 1 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Dynamic Range, ADCs / DACs (db) Typ: - Voltage - Supply, Analog: 1.62 V ~ 3.6 V Voltage - Supply, Digital: 1.1 V ~ 2 V, 1.62 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN Exposed Pad (5x5)	封裝: 32-VFQFN Exposed Pad	庫存83,328
MPC8347EZQAGD	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	封裝: 620-BBGA Exposed Pad	庫存4,896
MC68EN360VR25L	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存7,632
MCIMX7D2DVM12SC	NXP	I.MX 7D 1.2 GHZ 19X19 MAPBGA Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 85°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Package / Case: 541-LFBGA Supplier Device Package: 541-MAPBGA (19x19)	封裝: 541-LFBGA	庫存2,272
MK22FN1M0AVMD12	NXP	IC MCU 32BIT 1MB FLASH 144BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LFBGA Supplier Device Package: 144-PBGA (13x13)	封裝: 144-LFBGA	庫存7,320
MC9S08LG16CLF	NXP	IC MCU 8BIT 18KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM Number of I/O: 39 Program Memory Size: 18KB (18K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.9K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存12,600
LPC11U68JBD64E	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 36K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存11,436
DSP56301VF80B1	NXP	IC DSP 24BIT 80MHZ 252-BGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 80MHz Non-Volatile Memory: ROM (9 kB) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 252-BGA Supplier Device Package: 252-MAPBGA (21x21)	封裝: 252-BGA	庫存203,400
ADC0808S125HW/C1:1	NXP	ADC 8BIT SGL 125MHZ 48HTQFP Number of Bits: 8 Sampling Rate (Per Second): 125M Number of Inputs: 1 Input Type: Differential Data Interface: Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 1 Architecture: - Reference Type: External, Internal Voltage - Supply, Analog: 3 V ~ 3.6 V Voltage - Supply, Digital: 1.65 V ~ 1.95 V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 48-TQFP Exposed Pad Supplier Device Package: 48-HTQFP Mounting Type: -	封裝: 48-TQFP Exposed Pad	庫存6,496
MPX5050D	NXP	SENSOR DIFF PRESS 7.25 PSI MAX Pressure Type: Differential Operating Pressure: 7.25 PSI (50 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±2.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 29.01 PSI (200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	封裝: 6-SIP Module	庫存11,076
MMA6255AEG	NXP	ACCELEROMETER 50G ANALOG 20SOIC Type: Analog Axis: X, Y Acceleration Range: ±50g Sensitivity (LSB/g): - Sensitivity (mV/g): 9.37mV/V/g Bandwidth: 3kHz Output Type: Analog Voltage Voltage - Supply: 3.15 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存4,536
TEF6721HL/V1T,518	NXP	IC FRONT END DGTL CAR RAD 64LQFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM, WB Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 5V, 8.5V Operating Temperature: -40°C ~ 85°C Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存3,528
LS1023ASE8MQB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,616
SPC5644CF0VLT1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 177 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b, 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-TQFP (28x28)	封裝: 208-LQFP	庫存2,160
S912XEQ384BCAG	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,704
MC33PF8200DHES	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: 56-VFQFN Exposed Pad	庫存4,512
BB131	NXP	VARIABLE CAPACITANCE DIODE, VERY Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz Capacitance Ratio: 16 Capacitance Ratio Condition: C0.5/C28 Voltage - Peak Reverse (Max): 30 V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323	封裝: -	Request a Quote
MC33FS4507KAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
LPC55S26JEV98Y	NXP	IC MCU 32BIT 256KB FLASH 98VFBGA Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 98-VFBGA Supplier Device Package: 98-VFBGA (7x7)	封裝: -	Request a Quote
S9S12G64J0VLFR	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote
LS1043ACE9MQB	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A53 Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) SATA: SATA 6Gbps (1) USB: USB 3.0 + PHY (3) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Package / Case: 780-BFBGA Supplier Device Package: 780-FBGA (23x23)	封裝: -	Request a Quote
MC33FS6528NAER2	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote

BF908WR,115

NXP

MOSFET NCH DUAL GATE 12V CMPAK-4

Transistor Type: N-Channel Dual Gate
Frequency: 200MHz
Gain: -
Voltage - Test: 8V
Current Rating: 40mA
Noise Figure: 0.6dB
Current - Test: 15mA
Power - Output: -
Voltage - Rated: 12V
Package / Case: SC-82A, SOT-343
Supplier Device Package: CMPAK-4

封裝: SC-82A, SOT-343

庫存3,504

CBT6832DGG,118

NXP

IC 16BIT 1OF2 MUX/DEMUX 56TSSOP

Type: Multiplexer/Demultiplexer
Circuit: 16 x 1:2
Independent Circuits: 1
Current - Output High, Low: 15mA, 64mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

封裝: 56-TFSOP (0.240", 6.10mm Width)

庫存2,672

74LVC543ABQ,118

NXP

IC REGISTERED TXRX 8BIT 24DHVQFN

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-DHVQFN (5.5x3.5)

封裝: 24-VFQFN Exposed Pad

庫存2,896

74ABT623D,602

NXP

IC TRANSCVR TRI-ST 8BIT 20SOIC

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存5,472

TDF8546AJ/N1,112

NXP

IC AMP AUDIO BTL DBS27P

Type: Class AB
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Short-Circuit and Thermal Protection
Mounting Type: Through Hole
Operating Temperature: -
Supplier Device Package: DBS27P
Package / Case: 27-SIP, Formed Leads

封裝: 27-SIP, Formed Leads

庫存2,704

PCA9554PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存24,564

SGTL5000XNAA3

NXP

IC AUDIO CODEC STEREO 32-QFN

Type: Stereo Audio
Data Interface: I2C, Serial, SPI?
Resolution (Bits): -
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Dynamic Range, ADCs / DACs (db) Typ: -
Voltage - Supply, Analog: 1.62 V ~ 3.6 V
Voltage - Supply, Digital: 1.1 V ~ 2 V, 1.62 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN Exposed Pad (5x5)

封裝: 32-VFQFN Exposed Pad

庫存83,328

MPC8347EZQAGD

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

封裝: 620-BBGA Exposed Pad

庫存4,896

MC68EN360VR25L

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存7,632

MCIMX7D2DVM12SC

NXP

I.MX 7D 1.2 GHZ 19X19 MAPBGA

Core Processor: ARM? Cortex?-A7, ARM? Cortex?-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: 0°C ~ 85°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Package / Case: 541-LFBGA
Supplier Device Package: 541-MAPBGA (19x19)

封裝: 541-LFBGA

庫存2,272

MK22FN1M0AVMD12

NXP

IC MCU 32BIT 1MB FLASH 144BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LFBGA
Supplier Device Package: 144-PBGA (13x13)

封裝: 144-LFBGA

庫存7,320

MC9S08LG16CLF

NXP

IC MCU 8BIT 18KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Number of I/O: 39
Program Memory Size: 18KB (18K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.9K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存12,600

LPC11U68JBD64E

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 36K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存11,436

DSP56301VF80B1

NXP

IC DSP 24BIT 80MHZ 252-BGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 80MHz
Non-Volatile Memory: ROM (9 kB)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 252-BGA
Supplier Device Package: 252-MAPBGA (21x21)

封裝: 252-BGA

庫存203,400

ADC0808S125HW/C1:1

NXP

ADC 8BIT SGL 125MHZ 48HTQFP

Number of Bits: 8
Sampling Rate (Per Second): 125M
Number of Inputs: 1
Input Type: Differential
Data Interface: Parallel
Configuration: S/H-ADC
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Architecture: -
Reference Type: External, Internal
Voltage - Supply, Analog: 3 V ~ 3.6 V
Voltage - Supply, Digital: 1.65 V ~ 1.95 V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 48-TQFP Exposed Pad
Supplier Device Package: 48-HTQFP
Mounting Type: -

封裝: 48-TQFP Exposed Pad

庫存6,496

MPX5050D

NXP

SENSOR DIFF PRESS 7.25 PSI MAX

Pressure Type: Differential
Operating Pressure: 7.25 PSI (50 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±2.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 29.01 PSI (200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

封裝: 6-SIP Module

庫存11,076

MMA6255AEG

NXP

ACCELEROMETER 50G ANALOG 20SOIC

Type: Analog
Axis: X, Y
Acceleration Range: ±50g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 9.37mV/V/g
Bandwidth: 3kHz
Output Type: Analog Voltage
Voltage - Supply: 3.15 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存4,536

TEF6721HL/V1T,518

NXP

IC FRONT END DGTL CAR RAD 64LQFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM, WB
Applications: AM/FM Radio Receiver
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 5V, 8.5V
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存3,528

LS1023ASE8MQB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,616

SPC5644CF0VLT1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

封裝: 208-LQFP

庫存2,160

S912XEQ384BCAG

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,704

MC33PF8200DHES

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: 56-VFQFN Exposed Pad

庫存4,512

BB131

NXP

VARIABLE CAPACITANCE DIODE, VERY

Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
Capacitance Ratio: 16
Capacitance Ratio Condition: C0.5/C28
Voltage - Peak Reverse (Max): 30 V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Supplier Device Package: SOD-323

封裝: -

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MC33FS4507KAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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LPC55S26JEV98Y

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封裝: -

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S9S12G64J0VLFR

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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LS1043ACE9MQB

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A53

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.6GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1)
SATA: SATA 6Gbps (1)
USB: USB 3.0 + PHY (3)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Boot Security
Package / Case: 780-BFBGA
Supplier Device Package: 780-FBGA (23x23)

封裝: -

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MC33FS6528NAER2

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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