頁 344 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BF421,112	NXP	TRANS PNP 300V 0.05A SOT54 Transistor Type: PNP Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 300V Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 30mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V Power - Max: 830mW Frequency - Transition: 60MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA)	庫存5,456
PZM5.6NB2,115	NXP	DIODE ZENER 5.6V 300MW SMT3 Voltage - Zener (Nom) (Vz): 5.6V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 40 Ohms Current - Reverse Leakage @ Vr: 2µA @ 2.5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存7,408
74ABT640PW,112	NXP	IC TRANSCVR 3ST 8BIT INV 20TSSOP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存7,456
TFA9810T/N1,118	NXP	IC AMP AUDIO 15W STER D 32SO Type: Class D Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 15W x 2 @ 8 Ohm Voltage - Supply: 8 V ~ 20 V Features: Differential Inputs, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 32-SO Package / Case: 32-SOIC (0.295", 7.50mm Width)	封裝: 32-SOIC (0.295", 7.50mm Width)	庫存5,952
PCA9514D,112	NXP	IC BUFFER I2C/SMBUS HOTSWAP 8SO Type: Buffer, Accelerator Applications: I2C - Hotswap Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 10pF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 2.8mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存4,192
TJA1048TK,118	NXP	IC TRANSCEIVER CAN 14HVSON Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 2/2 Duplex: Half Receiver Hysteresis: 120mV Data Rate: 5Mbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	封裝: 14-VDFN Exposed Pad	庫存7,968
MPC8572EVTARLE	NXP	IC MPU MPC85XX 1.067GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	封裝: 1023-BFBGA, FCBGA	庫存7,456
MPC8547PXATGB	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存3,856
MPC8536EBVJAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存3,008
MC9S08DZ32AVLC	NXP	IC MCU 8BIT 32KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存7,488
LPC11A14FBD48/301,	NXP	IC MCU 32BIT 32KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 42 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.6 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存6,160
MC9S08PT32VLF	NXP	IC MCU 8BIT 32KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 41 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存6,384
74HC5555N,112	NXP	IC OSC TIMER W/OSC 89MHZ 16-DIP Type: Timer/Oscillator (Single) Count: - Frequency: 89MHz Voltage - Supply: 2 V ~ 6 V Current - Supply: - Operating Temperature: -40°C ~ 125°C Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIL Mounting Type: Through Hole	封裝: 16-DIP (0.300", 7.62mm)	庫存2,208
KTY84/150,153	NXP	IC TEMPERATURE SENSOR DO-34 Resistance in Ohms @ 25°C: 603 Resistance Tolerance: - Operating Temperature: -40°C ~ 300°C Power - Max: - Mounting Type: Through Hole Package / Case: DO-204AG, DO-34, Axial Supplier Device Package: DO-34	封裝: DO-204AG, DO-34, Axial	庫存2,574
LM75AD,118	NXP	SENSOR TEMPERATURE I2C 8SO Sensor Type: Digital, Local Sensing Temperature - Local: -55°C ~ 125°C Sensing Temperature - Remote: - Output Type: I2C Voltage - Supply: 2.8 V ~ 5.5 V Resolution: 10 b Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存89,160
MMA6555KW	NXP	ACCELEROMETER 105G SPI 16QFN Type: Digital Axis: X Acceleration Range: ±105g Sensitivity (LSB/g): 18.2 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	封裝: 16-QFN Exposed Pad	庫存7,416
HTMS8001FTB/AF,115	NXP	RFID HTAG ADVANCED 3XSON Style: Encapsulated Technology: Passive Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Writable Memory: 1.76kb (User) Standards: ISO 11784, ISO 11785 Operating Temperature: - Size / Dimension: 3.00mm x 2.00mm x 0.85mm	封裝: -	庫存3,240
SJA1105QELY	NXP	SWITCH ETHERNET Protocol: Ethernet Function: Switch Interface: SPI Standards: IEEE 802.3 Voltage - Supply: 1.65 V ~ 3.6 V Current - Supply: 3.5mA Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 159-LFBGA Supplier Device Package: 159-LFBGA (12x12)	封裝: 159-LFBGA	庫存23,064
MC33771BTB1AER2	NXP	BCC14 Function: Battery Cell Controller Battery Chemistry: Lithium-Ion Number of Cells: 7 ~ 14 Fault Protection: Over/Under Voltage Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP Exposed Pad	庫存2,992
T4161NXN7PQB	NXP	QORIQ 64B POWER 16X 1.5GHZ THR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,696
T1013NSE7KQA	NXP	QORIQ 1XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,312
S912XEQ512BMAAR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封裝: 80-QFP	庫存3,440
PCA85176T-Q900-1Y	NXP	40 X 4 AUTOMOTIVE LCD DRIVER FOR Display Type: LCD Configuration: 40 Segment Interface: I2C Digits or Characters: 10 Characters, 20 Characters, 160 Elements Current - Supply: 3.5 µA Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	封裝: -	Request a Quote
SPC5606BAVLU6	NXP	NXP 32-BIT MCU, POWER ARCH CORE Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
SAF4000EL-101S53AK	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
PDTA114TE-115-NXP	NXP	TRANS PREBIAS PNP 50V 0.1A Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Resistor - Base (R1) (Ohms): - Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - Frequency - Transition: - Power - Max: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
A2V07H525-04NR6	NXP	RF MOSFET LDMOS 48V OM1230-4 Transistor Type: LDMOS Frequency: 595MHz ~ 851MHz Gain: 17.5dB Voltage - Test: 48 V Current Rating: 10µA Noise Figure: - Current - Test: 700 mA Power - Output: 120W Voltage - Rated: 105 V Package / Case: OM-1230-4L Supplier Device Package: OM-1230-4L	封裝: -	Request a Quote
S9S12GN48J0CLH	NXP	S12 CORE,48K FLASH Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote

BF421,112

NXP

TRANS PNP 300V 0.05A SOT54

Transistor Type: PNP
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 300V
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Power - Max: 830mW
Frequency - Transition: 60MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA)

庫存5,456

PZM5.6NB2,115

NXP

DIODE ZENER 5.6V 300MW SMT3

Voltage - Zener (Nom) (Vz): 5.6V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 40 Ohms
Current - Reverse Leakage @ Vr: 2µA @ 2.5V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存7,408

74ABT640PW,112

NXP

IC TRANSCVR 3ST 8BIT INV 20TSSOP

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存7,456

TFA9810T/N1,118

NXP

IC AMP AUDIO 15W STER D 32SO

Type: Class D
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 15W x 2 @ 8 Ohm
Voltage - Supply: 8 V ~ 20 V
Features: Differential Inputs, Short-Circuit and Thermal Protection
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 32-SO
Package / Case: 32-SOIC (0.295", 7.50mm Width)

封裝: 32-SOIC (0.295", 7.50mm Width)

庫存5,952

PCA9514D,112

NXP

IC BUFFER I2C/SMBUS HOTSWAP 8SO

Type: Buffer, Accelerator
Applications: I2C - Hotswap
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 10pF
Voltage - Supply: 2.7 V ~ 5.5 V
Current - Supply: 2.8mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存4,192

TJA1048TK,118

NXP

IC TRANSCEIVER CAN 14HVSON

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 2/2
Duplex: Half
Receiver Hysteresis: 120mV
Data Rate: 5Mbps
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

封裝: 14-VDFN Exposed Pad

庫存7,968

MPC8572EVTARLE

NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

封裝: 1023-BFBGA, FCBGA

庫存7,456

MPC8547PXATGB

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存3,856

MPC8536EBVJAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存3,008

MC9S08DZ32AVLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存7,488

LPC11A14FBD48/301,

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 42
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.6 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存6,160

MC9S08PT32VLF

NXP

IC MCU 8BIT 32KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 41
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存6,384

74HC5555N,112

NXP

IC OSC TIMER W/OSC 89MHZ 16-DIP

Type: Timer/Oscillator (Single)
Count: -
Frequency: 89MHz
Voltage - Supply: 2 V ~ 6 V
Current - Supply: -
Operating Temperature: -40°C ~ 125°C
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIL
Mounting Type: Through Hole

封裝: 16-DIP (0.300", 7.62mm)

庫存2,208

KTY84/150,153

NXP

IC TEMPERATURE SENSOR DO-34

Resistance in Ohms @ 25°C: 603
Resistance Tolerance: -
Operating Temperature: -40°C ~ 300°C
Power - Max: -
Mounting Type: Through Hole
Package / Case: DO-204AG, DO-34, Axial
Supplier Device Package: DO-34

封裝: DO-204AG, DO-34, Axial

庫存2,574

LM75AD,118

NXP

SENSOR TEMPERATURE I2C 8SO

Sensor Type: Digital, Local
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -
Output Type: I2C
Voltage - Supply: 2.8 V ~ 5.5 V
Resolution: 10 b
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存89,160

MMA6555KW

NXP

ACCELEROMETER 105G SPI 16QFN

Type: Digital
Axis: X
Acceleration Range: ±105g
Sensitivity (LSB/g): 18.2
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: Selectable Low Pass Filter
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

封裝: 16-QFN Exposed Pad

庫存7,416

HTMS8001FTB/AF,115

NXP

RFID HTAG ADVANCED 3XSON

Style: Encapsulated
Technology: Passive
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Operating Temperature: -
Size / Dimension: 3.00mm x 2.00mm x 0.85mm

封裝: -

庫存3,240

SJA1105QELY

NXP

SWITCH ETHERNET

Protocol: Ethernet
Function: Switch
Interface: SPI
Standards: IEEE 802.3
Voltage - Supply: 1.65 V ~ 3.6 V
Current - Supply: 3.5mA
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 159-LFBGA
Supplier Device Package: 159-LFBGA (12x12)

封裝: 159-LFBGA

庫存23,064

MC33771BTB1AER2

NXP

BCC14

Function: Battery Cell Controller
Battery Chemistry: Lithium-Ion
Number of Cells: 7 ~ 14
Fault Protection: Over/Under Voltage
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP Exposed Pad

庫存2,992

T4161NXN7PQB

NXP

QORIQ 64B POWER 16X 1.5GHZ THR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,696

T1013NSE7KQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,312

S912XEQ512BMAAR

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

庫存3,440

PCA85176T-Q900-1Y

NXP

40 X 4 AUTOMOTIVE LCD DRIVER FOR

Display Type: LCD
Configuration: 40 Segment
Interface: I2C
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Current - Supply: 3.5 µA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

封裝: -

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SPC5606BAVLU6

NXP

NXP 32-BIT MCU, POWER ARCH CORE

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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SAF4000EL-101S53AK

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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PDTA114TE-115-NXP

NXP

TRANS PREBIAS PNP 50V 0.1A

Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Resistor - Base (R1) (Ohms): -
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
Frequency - Transition: -
Power - Max: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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A2V07H525-04NR6

NXP

RF MOSFET LDMOS 48V OM1230-4

Transistor Type: LDMOS
Frequency: 595MHz ~ 851MHz
Gain: 17.5dB
Voltage - Test: 48 V
Current Rating: 10µA
Noise Figure: -
Current - Test: 700 mA
Power - Output: 120W
Voltage - Rated: 105 V
Package / Case: OM-1230-4L
Supplier Device Package: OM-1230-4L

封裝: -

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S9S12GN48J0CLH

NXP

S12 CORE,48K FLASH

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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