NXP 產品

MRF6P27160HR6

NXP

FET RF 68V 2.66GHZ NI-1230

• Transistor Type: LDMOS
• Frequency: 2.66GHz
• Gain: 14.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.8A
• Power - Output: 35W
• Voltage - Rated: 68V
• Package / Case: NI-1230
• Supplier Device Package: NI-1230

封裝: NI-1230

MRF5S9101MR1

NXP

FET RF 68V 960MHZ TO2704

• Transistor Type: LDMOS
• Frequency: 960MHz
• Gain: 17.5dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 700mA
• Power - Output: 100W
• Voltage - Rated: 68V
• Package / Case: TO-270AB
• Supplier Device Package: TO-270 WB-4

封裝: TO-270AB

BZX284-C56,115

NXP

DIODE ZENER 56V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 56V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 120 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 39.2V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

封裝: SOD-110

ASL1002LTKJ

NXP

IC LED DRIVER AUTO 8HVSON

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

CBT3384DK,118

NXP

IC BUS SWITCH 10BIT 24SSOP

• Type: Bus Switch
• Circuit: 5 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 24-SSOP

封裝: 24-SSOP (0.154", 3.90mm Width)

74LVC2952APW,112

NXP

IC REGISTERED TXRX 8BIT 24TSSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

N74F543D,602

NXP

IC TRANSCVR TRI-ST 8BIT 24SOIC

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

TDA19971AHN/C1K

NXP

IC HDMI RECEIVER SGL 72HVQFN

• Type: Receiver
• Applications: TV
• Mounting Type: Surface Mount
• Package / Case: 72-VFQFN Exposed Pad
• Supplier Device Package: 72-HVQFN (10x10)

封裝: 72-VFQFN Exposed Pad

SC16C654BIBS,551

NXP

IC UART QUAD W/FIFO 48-HVQFN

• Features: -
• Number of Channels: 4, QUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (6x6)

封裝: 48-VFQFN Exposed Pad

TJA1028T/3V3/10,11

NXP

IC LIN TRANSCEIVER 8-SO

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: 200mV
• Data Rate: -
• Voltage - Supply: 5.5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

CBTV24DD12ETY

NXP

IC MUX 12 X 2:1 9 OHM 48TFBGA

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 12
• On-State Resistance (Max): 9 Ohm
• Channel-to-Channel Matching (ΔRon): 400 mOhm
• Voltage - Supply, Single (V+): 1.62 V ~ 3.63 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): -
• -3db Bandwidth: 7.4GHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): -
• Current - Leakage (IS(off)) (Max): -
• Crosstalk: -
• Operating Temperature: -10°C ~ 85°C (TA)
• Package / Case: 48-TFBGA
• Supplier Device Package: 48-TFBGA (3x8)

封裝: 48-TFBGA

MPC8568EVTAUJJ

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

封裝: 1023-BBGA, FCBGA

MPC8555VTAQF

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

MPC8349EZUAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

封裝: 672-LBGA

P89CV51RB2FBC,557

NXP

IC MCU 8BIT 16KB FLASH 44TQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

封裝: 44-TQFP

S912XEP100J5MAL

NXP

IC MCU 16BIT 1MB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

MC9S08QE96CLD

NXP

IC MCU 8BIT 96KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

S9S12HY48J0CLL

NXP

IC MCU 16BIT 48KB FLASH 100LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

SL2S1402FUD,003

NXP

IC I-CODE ILT UNCASED WAFER

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 15693, ISO 18000-3
• Interface: -
• Voltage - Supply: 1.5 V ~ 1.7 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Die
• Supplier Device Package: Wafer

封裝: Die

PCF7945PTTM1AC1800

NXP

IC MCU RISC 28TSSOP

• Frequency: -
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -

封裝: -

MKW01Z128CHN

NXP

IC RF TXRX+MCU ISM<1GHZ 60-VFLGA

• Type: TxRx + MCU
• RF Family/Standard: General ISM < 1GHz
• Protocol: -
• Modulation: FSK, GFSK, GMSK, MSK, OOK
• Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
• Data Rate (Max): 600kbps
• Power - Output: 17dBm
• Sensitivity: -120dBm
• Memory Size: 128kB Flash, 16kB RAM
• Serial Interfaces: I2C, SPI, UART
• GPIO: 6
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 16mA ~ 17mA
• Current - Transmitting: 16mA ~ 95mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-VFLGA Exposed Pad

封裝: 60-VFLGA Exposed Pad

MC32PF1550A1EP

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

封裝: 40-VFQFN Exposed Pad

S9S12XS256J0CALR

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

MKL15Z128VLK4R

NXP

KINETIS KL15: 48MHZ CORTEX-M0+ U

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus, SPI, TSI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-FQFP (12x12)

封裝: 80-LQFP

SE050A1HQ1/Z01SGZ

NXP

ECC AES DES QFN20

• Type: IoT Secure Element
• Applications: Industry 4.0
• Mounting Type: Surface Mount
• Package / Case: 20-XFQFN Exposed Pad
• Supplier Device Package: 20-HX2QFN (3x3)

封裝: 20-XFQFN Exposed Pad

FD32K144HRT0VMHT

NXP

S32K144, 100 MAPBGA

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

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MC33FS8405G0ES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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SC29263VK

NXP

IC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

Request a Quote