頁 13 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
IRF640,127	NXP	MOSFET N-CH 200V 16A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 200V Current - Continuous Drain (Id) @ 25°C: 16A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 63nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1850pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 136W (Tc) Rds On (Max) @ Id, Vgs: 180 mOhm @ 8A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存7,536
BUK9E04-30B,127	NXP	MOSFET N-CH 30V 75A I2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 56nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 6526pF @ 25V Vgs (Max): ±15V FET Feature: - Power Dissipation (Max): 254W (Tc) Rds On (Max) @ Id, Vgs: 3 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I2PAK Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA	封裝: TO-262-3 Long Leads, I2Pak, TO-262AA	庫存2,368
LD6805K/14H,115	NXP	IC REG LIN 1.4V 150MA DFN1010C-4 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.4V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: DFN1010C-4	封裝: 4-UDFN Exposed Pad	庫存2,032
MC34702EK	NXP	IC POWER SUPPLY MCU 3A 32-SOIC Applications: Power Supplies Current - Supply: 60mA Voltage - Supply: 2.8 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	封裝: 32-SOIC (0.295", 7.50mm Width)	庫存34,560
MC10XS6225EK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: - Output Configuration: High Side Output Type: - Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 3.8A, 9A Rds On (Typ): 10 mOhm, 25 mOhm Input Type: - Features: Status Flag Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	庫存7,904
74HC4511N,652	NXP	IC LATCH/DECODER/DRIVER 16-DIP Display Type: LED, LCD Configuration: 7 Segment Interface: BCD Digits or Characters: - Current - Supply: - Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存3,312
PCF85116-3P/01,112	NXP	IC EEPROM 16KBIT 400KHZ 8DIP Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 16Kb (2K x 8) Memory Interface: I2C Clock Frequency: 400kHz Write Cycle Time - Word, Page: - Access Time: - Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	封裝: 8-DIP (0.300", 7.62mm)	庫存3,264
74HCT160D,653	NXP	IC SYNC BCD DECADE COUNT 16SOIC Logic Type: Counter, Decade Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: Synchronous Count Rate: 66MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存7,712
74HCT4059D,112	NXP	IC PROG DIVIDE-BY-N COUNT 24SOIC Logic Type: Divide-by-N Direction: Down Number of Elements: 1 Number of Bits per Element: 16 Reset: Asynchronous Timing: Synchronous Count Rate: 36MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存4,320
MCZ33780EG	NXP	IC MASTER DUAL DBUS DIFF 16-SOIC Applications: - Interface: SPI Voltage - Supply: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC Mounting Type: Surface Mount	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存67,296
PCA6416APW,118	NXP	IC I/O EXPANDER I2C/SMB 24TSSOP Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存19,320
T4160NSE7QTB	NXP	IC SOC 64BIT 16X 1.67GHZ 1932BGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (13), 10 Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FCPBGA (45x45)	封裝: 1932-BBGA, FCBGA	庫存3,488
MPC8555EVTAPF	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存7,072
MPC8360VVALFHA	NXP	IC MPU MPC83XX 667MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存10,380
MPC8271VRTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存3,616
MPC8309VMADDCA	NXP	IC MPU MPC83XX 266MHZ 489BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 489-LFBGA Supplier Device Package: 489-PBGA (19x19)	封裝: 489-LFBGA	庫存6,656
LPC2921FBD100,551	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: ARM9? Core Size: 16/32-Bit Speed: 125MHz Connectivity: CAN, I2C, LIN, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Number of I/O: 60 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存5,536
MC9S12C64MFA	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 31 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存6,736
MC9S08AC8MFDE	NXP	IC MCU 8BIT 8KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封裝: 48-VFQFN Exposed Pad	庫存5,840
LPC11U35FHI33/501,	NXP	IC MCU 32BIT 64KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存20,484
M5475BFE	NXP	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5475 Co-Processor: - Speed: 266MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,848
TDA8270AHN/C1,557	NXP	IC TUNER DGTL CBL MODEM 40HVQFN Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: General Purpose Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: 40-VFQFN Exposed Pad	庫存5,526
TEF6621T/V1T,512	NXP	IC CAR RADIO SGL CHIP 32SOIC Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8.5V Operating Temperature: -20°C ~ 85°C Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	封裝: 32-SOIC (0.295", 7.50mm Width)	庫存7,650
SAF4000EL-101S23CK	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
FC32K142HRT0VLHT	NXP	S32K142 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
PCA9600DP-S911Z	NXP	IC REDRIVER I2C 1CH 8TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 1MHz Number of Channels: 2 Delay Time: 100ns Signal Conditioning: - Capacitance - Input: 10 pF Voltage - Supply: 2.5V ~ 15V Current - Supply: 5.5mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	封裝: -	Request a Quote
MRF24301HSR5	NXP	RF MOSFET LDMOS NI780 Transistor Type: LDMOS Frequency: 2.4GHz ~ 2.5GHz Gain: 13.5dB Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 300W Voltage - Rated: - Package / Case: NI-780S Supplier Device Package: NI-780S	封裝: -	Request a Quote
S9S12GA64J0MLFR	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote

IRF640,127

NXP

MOSFET N-CH 200V 16A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 200V
Current - Continuous Drain (Id) @ 25°C: 16A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 63nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1850pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 136W (Tc)
Rds On (Max) @ Id, Vgs: 180 mOhm @ 8A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存7,536

BUK9E04-30B,127

NXP

MOSFET N-CH 30V 75A I2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 56nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 6526pF @ 25V
Vgs (Max): ±15V
FET Feature: -
Power Dissipation (Max): 254W (Tc)
Rds On (Max) @ Id, Vgs: 3 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: I2PAK
Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

封裝: TO-262-3 Long Leads, I2Pak, TO-262AA

庫存2,368

LD6805K/14H,115

NXP

IC REG LIN 1.4V 150MA DFN1010C-4

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.4V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.25V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 35µA ~ 150µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-UDFN Exposed Pad
Supplier Device Package: DFN1010C-4

封裝: 4-UDFN Exposed Pad

庫存2,032

MC34702EK

NXP

IC POWER SUPPLY MCU 3A 32-SOIC

Applications: Power Supplies
Current - Supply: 60mA
Voltage - Supply: 2.8 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

封裝: 32-SOIC (0.295", 7.50mm Width)

庫存34,560

MC10XS6225EK

NXP

IC SWITCH HIGH SIDE 32SOIC

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: -
Output Configuration: High Side
Output Type: -
Interface: SPI
Voltage - Load: 7 V ~ 18 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): 3.8A, 9A
Rds On (Typ): 10 mOhm, 25 mOhm
Input Type: -
Features: Status Flag
Fault Protection: Open Load Detect, Over Temperature
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

庫存7,904

74HC4511N,652

NXP

IC LATCH/DECODER/DRIVER 16-DIP

Display Type: LED, LCD
Configuration: 7 Segment
Interface: BCD
Digits or Characters: -
Current - Supply: -
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存3,312

PCF85116-3P/01,112

NXP

IC EEPROM 16KBIT 400KHZ 8DIP

Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 16Kb (2K x 8)
Memory Interface: I2C
Clock Frequency: 400kHz
Write Cycle Time - Word, Page: -
Access Time: -
Voltage - Supply: 2.7 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

封裝: 8-DIP (0.300", 7.62mm)

庫存3,264

74HCT160D,653

NXP

IC SYNC BCD DECADE COUNT 16SOIC

Logic Type: Counter, Decade
Direction: Up
Number of Elements: 1
Number of Bits per Element: 4
Reset: Asynchronous
Timing: Synchronous
Count Rate: 66MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存7,712

74HCT4059D,112

NXP

IC PROG DIVIDE-BY-N COUNT 24SOIC

Logic Type: Divide-by-N
Direction: Down
Number of Elements: 1
Number of Bits per Element: 16
Reset: Asynchronous
Timing: Synchronous
Count Rate: 36MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存4,320

MCZ33780EG

NXP

IC MASTER DUAL DBUS DIFF 16-SOIC

Applications: -
Interface: SPI
Voltage - Supply: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC
Mounting Type: Surface Mount

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存67,296

PCA6416APW,118

NXP

IC I/O EXPANDER I2C/SMB 24TSSOP

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存19,320

T4160NSE7QTB

NXP

IC SOC 64BIT 16X 1.67GHZ 1932BGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 8 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (13), 10 Gbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FCPBGA (45x45)

封裝: 1932-BBGA, FCBGA

庫存3,488

MPC8555EVTAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 833MHz
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存7,072

MPC8360VVALFHA

NXP

IC MPU MPC83XX 667MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存10,380

MPC8271VRTIEA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存3,616

MPC8309VMADDCA

NXP

IC MPU MPC83XX 266MHZ 489BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 489-LFBGA
Supplier Device Package: 489-PBGA (19x19)

封裝: 489-LFBGA

庫存6,656

LPC2921FBD100,551

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: ARM9?
Core Size: 16/32-Bit
Speed: 125MHz
Connectivity: CAN, I2C, LIN, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存5,536

MC9S12C64MFA

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存6,736

MC9S08AC8MFDE

NXP

IC MCU 8BIT 8KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封裝: 48-VFQFN Exposed Pad

庫存5,840

LPC11U35FHI33/501,

NXP

IC MCU 32BIT 64KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 26
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存20,484

M5475BFE

NXP

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5475
Co-Processor: -
Speed: 266MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,848

TDA8270AHN/C1,557

NXP

IC TUNER DGTL CBL MODEM 40HVQFN

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: -
Applications: General Purpose
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: 40-VFQFN Exposed Pad

庫存5,526

TEF6621T/V1T,512

NXP

IC CAR RADIO SGL CHIP 32SOIC

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8.5V
Operating Temperature: -20°C ~ 85°C
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SO

封裝: 32-SOIC (0.295", 7.50mm Width)

庫存7,650

SAF4000EL-101S23CK

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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FC32K142HRT0VLHT

NXP

S32K142 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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PCA9600DP-S911Z

NXP

IC REDRIVER I2C 1CH 8TSSOP

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 1MHz
Number of Channels: 2
Delay Time: 100ns
Signal Conditioning: -
Capacitance - Input: 10 pF
Voltage - Supply: 2.5V ~ 15V
Current - Supply: 5.5mA
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

封裝: -

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MRF24301HSR5

NXP

RF MOSFET LDMOS NI780

Transistor Type: LDMOS
Frequency: 2.4GHz ~ 2.5GHz
Gain: 13.5dB
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 300W
Voltage - Rated: -
Package / Case: NI-780S
Supplier Device Package: NI-780S

封裝: -

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S9S12GA64J0MLFR

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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