圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, T
|
封裝: - |
庫存4,914 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 14 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, T
|
封裝: - |
庫存5,130 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 12 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, T
|
封裝: - |
庫存3,402 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, TH
|
封裝: - |
庫存4,986 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, TH
|
封裝: - |
庫存3,294 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, TH
|
封裝: - |
庫存5,904 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, T
|
封裝: - |
庫存3,526 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 24 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, T
|
封裝: - |
庫存7,074 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 22 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 20 CIRCUITS, T
|
封裝: - |
庫存4,644 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 20 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, T
|
封裝: - |
庫存7,668 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 18 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, T
|
封裝: - |
庫存6,624 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 16 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, T
|
封裝: - |
庫存2,592 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 14 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, T
|
封裝: - |
庫存3,546 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 12 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, T
|
封裝: - |
庫存4,950 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, TH
|
封裝: - |
庫存3,744 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, TH
|
封裝: - |
庫存8,658 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, TH
|
封裝: - |
庫存5,004 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.063" (1.60mm) | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, T
|
封裝: - |
庫存8,982 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 24 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, T
|
封裝: - |
庫存6,840 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 22 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 20 CIRCUITS, T
|
封裝: - |
庫存3,816 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 20 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, T
|
封裝: - |
庫存4,014 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 18 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, T
|
封裝: - |
庫存6,156 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 16 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, T
|
封裝: - |
庫存8,244 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 14 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, T
|
封裝: - |
庫存8,874 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 12 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, T
|
封裝: - |
庫存4,680 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, TH
|
封裝: - |
庫存3,780 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, TH
|
封裝: - |
庫存3,384 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, TH
|
封裝: - |
庫存3,384 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Latch Holder | - | 0.118" (3.00mm) | - | 0.279" (7.10mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |