圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN FFC FPC 12POS 0.50MM R/A
|
封裝: - |
庫存8,100 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight or Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 10POS 0.50MM R/A
|
封裝: - |
庫存2,106 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight or Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 8POS 0.50MM R/A
|
封裝: - |
庫存4,590 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight or Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 6POS 0.50MM R/A
|
封裝: - |
庫存7,794 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight or Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 4POS 0.50MM R/A
|
封裝: - |
庫存6,732 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 4 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight or Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 36POS 1.25MM PCB
|
封裝: - |
庫存8,424 |
|
Through Hole | Contacts, Vertical, 1 Sided | 36 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN 2.54MM .100 R/A FLAT CAB
|
封裝: - |
庫存3,924 |
|
- | - | - | 0.100" (2.54mm) | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Molex, LLC |
CONN FFC 2.54MM
|
封裝: - |
庫存6,282 |
|
- | - | - | 0.100" (2.54mm) | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Molex, LLC |
CONN FFC 2.54MM
|
封裝: - |
庫存6,372 |
|
- | - | - | 0.100" (2.54mm) | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Molex, LLC |
CONN FPC TOP 4POS 1.00MM R/A
|
封裝: - |
庫存4,932 |
|
Surface Mount, Right Angle | Contacts, Top | 4 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 60POS 0.50MM R/A
|
封裝: - |
庫存5,526 |
|
Surface Mount, Right Angle | Contacts, Bottom | 60 | 0.020" (0.50mm) | Solder | 0.30mm | 0.051" (1.30mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 21POS 0.30MM R/A
|
封裝: - |
庫存3,132 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.20mm | 0.077" (1.95mm) | Flip Lock | Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 30POS 0.50MM R/A
|
封裝: - |
庫存2,412 |
|
Surface Mount, Right Angle | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 24POS 0.50MM R/A
|
封裝: - |
庫存6,012 |
|
Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight or Tapered | Phosphor Bronze | Gold | - | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 16POS 0.50MM R/A
|
封裝: - |
庫存3,454 |
|
Surface Mount, Right Angle | Contacts, Bottom | 16 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 14POS 0.50MM R/A
|
封裝: - |
庫存5,508 |
|
Surface Mount, Right Angle | Contacts, Bottom | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 12POS 0.50MM R/A
|
封裝: - |
庫存6,210 |
|
Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 10POS 0.50MM R/A
|
封裝: - |
庫存2,880 |
|
Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 13POS 0.50MM R/A
|
封裝: - |
庫存3,312 |
|
Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 27POS 0.50MM R/A
|
封裝: - |
庫存3,834 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 27 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 10POS 0.50MM R/A
|
封裝: - |
庫存4,698 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | - | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 30POS 1.00MM R/A
|
封裝: - |
庫存4,662 |
|
Surface Mount, Right Angle | Contacts, Top | 30 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 6POS 1.00MM R/A
|
封裝: - |
庫存4,464 |
|
Surface Mount, Right Angle | Contacts, Top | 6 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 9POS 0.50MM R/A
|
封裝: - |
庫存5,850 |
|
Surface Mount, Right Angle | Contacts, Bottom | 9 | 0.020" (0.50mm) | Solder | 0.30mm | 0.095" (2.41mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 56POS 0.50MM R/A
|
封裝: - |
庫存7,776 |
|
Surface Mount, Right Angle | Contacts, Bottom | 56 | 0.020" (0.50mm) | Solder | 0.30mm | 0.059" (1.50mm) | Flip Lock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polybutylene Terephthalate (PBT), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 22POS 0.50MM R/A
|
封裝: - |
庫存8,334 |
|
Surface Mount, Right Angle | Contacts, Top | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 21POS 0.50MM R/A
|
封裝: - |
庫存7,074 |
|
Surface Mount, Right Angle | Contacts, Top | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 19POS 0.50MM R/A
|
封裝: - |
庫存4,374 |
|
Surface Mount, Right Angle | Contacts, Top | 19 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |