圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN FPC TOP 8POS 1.00MM R/A
|
封裝: - |
庫存29,832 |
|
Through Hole, Right Angle | Contacts, Top | 8 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA66), Nylon 6/6 | Polyester | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC 32POS 0.50MM R/A
|
封裝: - |
庫存8,730 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 32 | 0.020" (0.50mm) | Solder | 0.30mm | 0.039" (1.00mm) | Flip Lock, Backlock | Straight, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
||
Molex, LLC |
CONN FFC VERT 30POS 0.50MM SMD
|
封裝: - |
庫存9,408 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.159" (4.04mm) | Flip Lock | Straight, Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA9T), Nylon 9T, Glass Filled | - | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC/FPC BOTTOM 64P .5MM R/A
|
封裝: - |
庫存8,208 |
|
Surface Mount, Right Angle | Contacts, Bottom | 64 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 10POS 0.50MM R/A
|
封裝: - |
庫存5,580 |
|
Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.044" (1.10mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 33POS 0.50MM R/A
|
封裝: - |
庫存16,884 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.020" (0.50mm) | Solder | 0.30mm | 0.092" (2.33mm) | Flip Lock | Straight | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 18POS 1.00MM SMD
|
封裝: - |
庫存19,992 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 18 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 12POS 0.50MM R/A
|
封裝: - |
庫存2,034 |
|
Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.051" (1.30mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA9T), Nylon 9T, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 21POS 1.00MM R/A
|
封裝: - |
庫存14,070 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 25POS 1.00MM R/A
|
封裝: - |
庫存21,504 |
|
Surface Mount, Right Angle | Contacts, Bottom | 25 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 40POS 0.50MM SMD
|
封裝: - |
庫存2,034 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 40 | 0.020" (0.50mm) | Solder | 0.30mm | 0.159" (4.04mm) | Flip Lock | Straight, Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA9T), Nylon 9T, Glass Filled | - | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 28POS 0.50MM R/A
|
封裝: - |
庫存18,492 |
|
Surface Mount, Right Angle | Contacts, Bottom | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 16POS 1.00MM SMD
|
封裝: - |
庫存13,164 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 16 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 17POS 0.25MM R/A
|
封裝: - |
庫存6,192 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.010" (0.25mm) | Solder | 0.20mm | 0.039" (1.00mm) | Flip Lock | Tapered | Copper Alloy | Gold | Plastic, Glass Filled | Plastic, Glass Filled | - | 50V | -20°C ~ 85°C | UL94 V-0, UL94 HB |
||
Molex, LLC |
CONN FFC VERT 32POS 0.50MM SMD
|
封裝: - |
庫存3,258 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 32 | 0.020" (0.50mm) | Solder | 0.30mm | 0.159" (4.04mm) | Flip Lock | Straight, Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA9T), Nylon 9T, Glass Filled | - | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC TOP 18POS 1MM R/A
|
封裝: - |
庫存19,536 |
|
Surface Mount, Right Angle | Contacts, Top | 18 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC TOP 18POS 1MM R/A
|
封裝: - |
庫存13,116 |
|
Surface Mount, Right Angle | Contacts, Top | 18 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -30°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 22POS 1.00MM R/A
|
封裝: - |
庫存14,238 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 31POS 0.30MM R/A
|
封裝: - |
庫存4,860 |
|
Surface Mount, Right Angle | Contacts, Bottom | 31 | 0.012" (0.30mm) | Solder | 0.20mm | 0.037" (0.95mm) | Flip Lock | Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
||
Molex, LLC |
CONN FPC 17POS 0.30MM R/A
|
封裝: - |
庫存5,148 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 17 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock, Backlock | Notched or Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | - | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 12POS 0.50MM SMD
|
封裝: - |
庫存6,030 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Straight, Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC TOP 15POS 1MM R/A
|
封裝: - |
庫存13,116 |
|
Surface Mount, Right Angle | Contacts, Top | 15 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 17POS 0.50MM R/A
|
封裝: - |
庫存13,080 |
|
Surface Mount, Right Angle | Contacts, Top | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | - |
||
Molex, LLC |
CONN FPC BOTTOM 14POS 1.00MM R/A
|
封裝: - |
庫存12,090 |
|
Surface Mount, Right Angle | Contacts, Bottom | 14 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 10POS 0.50MM R/A
|
封裝: - |
庫存8,928 |
|
Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC TOP 14POS 1MM R/A
|
封裝: - |
庫存12,402 |
|
Surface Mount, Right Angle | Contacts, Top | 14 | 0.039" (1.00mm) | Solder | 0.30mm | 0.106" (2.70mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 20POS 0.50MM R/A
|
封裝: - |
庫存18,528 |
|
Surface Mount, Right Angle | Contacts, Top | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 25POS 0.30MM R/A
|
封裝: - |
庫存4,716 |
|
Surface Mount, Right Angle | Contacts, Top | 25 | 0.012" (0.30mm) | Solder | 0.20mm | 0.044" (1.10mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Polymer | Polymer | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |