圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
TLC 4T 512GX8 FBGA QDP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
UMCP 4.125T
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
EMMC 1T
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 96GBIT 64 556/841 TFBGA 8
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 96Gbit | - | 2.133 GHz | - | - | - | -25°C ~ 85°C | Surface Mount | 556-TFBGA | 556-WFBGA (12.4x12.4) |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4 PLASTIC MI
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
DDR4 16G 1GX16 FBGA
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 16Gbit | POD | 1.6 GHz | 15ns | 19 ns | 1.14V ~ 1.26V | -40°C ~ 125°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x13) |
||
Micron Technology Inc. |
TLC 4T 512GX8 FBGA QDP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 512G X8 DIE
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 512G DIE 64GX8
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 64GBIT 32 315/315 TFBGA 4
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | Parallel | 3.2 GHz | - | - | 1.05V | -40°C ~ 105°C | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Micron Technology Inc. |
LPDDR4 16GBIT 16 200/264 TFBGA 1
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Micron Technology Inc. |
LPDDR4 0 WFBGA
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR5 PLASTIC MI
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 16GBIT PARALLEL 78FBGA
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 16Gbit | Parallel | 1.33 GHz | - | 27 ns | 1.14V ~ 1.26V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (7.5x11) |
||
Micron Technology Inc. |
UFS 8T
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 32GBIT 2.133GHZ 200WFBGA
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | - | 2.133 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Micron Technology Inc. |
LPDDR5 64GBIT 64 561/570 TFBGA 4
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 8T 1TX8 FBGA 8DP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 4T 512GX8 FBGA QDP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 4T 512GX8 LBGA 8DP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 4GIBT LPPDR
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 96GBIT 64 561/570 TFBGA 8
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 32G 512MX64 FBGA QDP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SRAM 8MBIT PARALLEL 165FBGA
|
封裝: - |
Request a Quote |
|
SRAM | SRAM - Standard | 8Mbit | Parallel | 133 MHz | - | 4 ns | 3.135V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC FLASH 128GBIT MMC
|
封裝: - |
庫存3,279 |
|
FLASH | FLASH - NAND | 128Gbit | MMC | - | - | - | - | -40°C ~ 105°C (TA) | - | - | - |
||
Micron Technology Inc. |
MOBILE DDR 2G DIE 128MX16 T89M
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128GBIT MMC
|
封裝: - |
Request a Quote |
|
FLASH | FLASH - NAND | 128Gbit | MMC | - | - | - | - | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC DRAM 32GBIT 2.133GHZ 200WFBGA
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | - | 2.133 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |