頁 910 - Microchip Technology 產品

零件編號	製造商	描述	封裝	庫存
DSC1123CI5-409.3750T	Microchip Technology	OSC MEMS 409.3750MHZ CMOS SMD Type: MEMS (Silicon) Frequency: 409.375MHz Function: Enable/Disable Output: LVDS Voltage - Supply: 2.25 V ~ 3.6 V Frequency Stability: ±10ppm Operating Temperature: -40°C ~ 85°C Current - Supply (Max): 32mA Ratings: AEC-Q100 Mounting Type: Surface Mount Package / Case: 6-SMD, No Lead Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Height - Seated (Max): 0.035" (0.90mm)	封裝: 6-SMD, No Lead	庫存2,358
DSC1001CI1-133.3333T	Microchip Technology	OSC MEMS 133.3333MHZ CMOS SMD Type: MEMS (Silicon) Frequency: 133.3333MHz Function: Standby (Power Down) Output: CMOS Voltage - Supply: 1.8 V ~ 3.3 V Frequency Stability: ±50ppm Operating Temperature: -40°C ~ 85°C Current - Supply (Max): 8.7mA Ratings: AEC-Q100 Mounting Type: Surface Mount Package / Case: 4-SMD, No Lead Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Height - Seated (Max): 0.035" (0.90mm)	封裝: 4-SMD, No Lead	庫存4,824
DSC1103CI1-100.0000	Microchip Technology	OSC MEMS 100.000MHZ LVDS SMD Type: MEMS (Silicon) Frequency: 100MHz Function: Standby (Power Down) Output: LVDS Voltage - Supply: 2.25 V ~ 3.6 V Frequency Stability: ±50ppm Operating Temperature: -40°C ~ 85°C Current - Supply (Max): 32mA Ratings: AEC-Q100 Mounting Type: Surface Mount Package / Case: 6-SMD, No Lead Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Height - Seated (Max): 0.035" (0.90mm)	封裝: 6-SMD, No Lead	庫存3,618
MIC94355-4YMT-TR	Microchip Technology	IC REG LINEAR 1.2V 500MA 6TDFN Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 3.6V Voltage - Output (Min/Fixed): 1.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.2V @ 500mA Current - Output: 500mA Current - Quiescent (Iq): - Current - Supply (Max): 250µA PSRR: 85dB ~ 50dB (100Hz ~ 5MHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 6-UFDFN Exposed Pad Supplier Device Package: 6-TDFN (1.6x1.6)	封裝: 6-UFDFN Exposed Pad	庫存6,752
AT45DB011-JC	Microchip Technology	IC FLASH 1MBIT 13MHZ 32PLCC Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 1Mb (264 Bytes x 512 pages) Memory Interface: SPI Clock Frequency: 15MHz Write Cycle Time - Word, Page: 15ms Access Time: - Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C (TC) Mounting Type: Surface Mount Package / Case: 32-LCC (J-Lead) Supplier Device Package: 32-PLCC	封裝: 32-LCC (J-Lead)	庫存6,640
24VL025T/SN	Microchip Technology	IC EEPROM 2KBIT 400KHZ 8SOIC Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 2Kb (256 x 8) Memory Interface: I2C Clock Frequency: 400kHz Write Cycle Time - Word, Page: 5ms Access Time: 900ns Voltage - Supply: 1.5 V ~ 3.6 V Operating Temperature: -20°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存7,088
PIC16C662T-10/L	Microchip Technology	IC MCU 8BIT 7KB OTP 44PLCC Core Processor: PIC Core Size: 8-Bit Speed: 10MHz Connectivity: - Peripherals: Brown-out Detect/Reset, LED, POR, WDT Number of I/O: 33 Program Memory Size: 7KB (4K x 14) Program Memory Type: OTP EEPROM Size: - RAM Size: 176 x 8 Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存7,520
DSPIC33FJ128GP206A-E/PT	Microchip Technology	IC MCU 16BIT 128KB FLASH 64TQFP Core Processor: dsPIC Core Size: 16-Bit Speed: 40 MIPs Connectivity: I2C, IrDA, LIN, SPI, UART/USART Peripherals: AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10x10)	封裝: 64-TQFP	庫存5,904
PIC16F1946-E/PT	Microchip Technology	IC MCU 8BIT 14KB FLASH 64TQFP Core Processor: PIC Core Size: 8-Bit Speed: 32MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 14KB (8K x 14) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 17x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10x10)	封裝: 64-TQFP	庫存6,464
PIC16F527T-I/ML	Microchip Technology	IC MCU 8BIT 1.5KB FLASH 20QFN Core Processor: PIC Core Size: 8-Bit Speed: 20MHz Connectivity: - Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 17 Program Memory Size: 1.5KB (1K x 12) Program Memory Type: FLASH EEPROM Size: 64 x 8 RAM Size: 68 x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-VFQFN Exposed Pad Supplier Device Package: 20-QFN (4x4)	封裝: 20-VFQFN Exposed Pad	庫存2,368
PIC18LF55K42-I/MV	Microchip Technology	32KB FLASH, 2KB RAM, 256B EEPROM Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,056
PIC24HJ12GP202-I/SP	Microchip Technology	IC MCU 16BIT 12KB FLASH 28SDIP Core Processor: PIC Core Size: 16-Bit Speed: 40 MIPs Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 21 Program Memory Size: 12KB (4K x 24) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-DIP (0.300", 7.62mm) Supplier Device Package: 28-SPDIP	封裝: 28-DIP (0.300", 7.62mm)	庫存7,328
PIC16C57C-04/P	Microchip Technology	IC MCU 8BIT 3KB OTP 28DIP Core Processor: PIC Core Size: 8-Bit Speed: 4MHz Connectivity: - Peripherals: POR, WDT Number of I/O: 20 Program Memory Size: 3KB (2K x 12) Program Memory Type: OTP EEPROM Size: - RAM Size: 72 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-PDIP	封裝: 28-DIP (0.600", 15.24mm)	庫存8,280
U2102B-MFP	Microchip Technology	IC TIMER MULTI IGBT/MOSF 16-SOIC PLL: No Main Purpose: Power Management, IGBT,MOSFET Input: - Output: - Number of Circuits: 1 Ratio - Input:Output: 2:1 Differential - Input:Output: No/No Frequency - Max: 50Hz Voltage - Supply: - Operating Temperature: -10°C ~ 100°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存5,056
MCP48CVB02-E/MG	Microchip Technology	IC DAC 8BIT 16QFN Number of Bits: 8 Number of D/A Converters: 2 Settling Time: 16µs Output Type: - Differential Output: No Data Interface: I²C Reference Type: External, Internal Voltage - Supply, Analog: - Voltage - Supply, Digital: - INL/DNL (LSB): ±0.1, ±0.1 Architecture: - Operating Temperature: -40°C ~ 125°C Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-QFN (3x3) Mounting Type: Surface Mount	封裝: 16-VFQFN Exposed Pad	庫存23,052
PIC32MZ2048EFH100-I/GJX	Microchip Technology	32 BIT MCU FPU 2MB FLASH 512KB R Core Processor: MIPS32® M-Class Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 78 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-TFBGA Supplier Device Package: 100-TFBGA (7x7)	封裝: 100-TFBGA	庫存7,552
DSPIC33CK128MC102-I-M6	Microchip Technology	IC MCU 16BIT 128KB FLASH 28UQFN Core Processor: dsPIC Core Size: 16-Bit Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 28-UFQFN Exposed Pad Supplier Device Package: 28-UQFN (4x4)	封裝: -	Request a Quote
CDLL5537C	Microchip Technology	VOLTAGE REGULATOR Voltage - Zener (Nom) (Vz): 17 V Tolerance: ±2% Power - Max: 500 mW Impedance (Max) (Zzt): 100 Ohms Current - Reverse Leakage @ Vr: 10 nA @ 15.3 V Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Operating Temperature: -65°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: DO-213AA Supplier Device Package: DO-213AA	封裝: -	Request a Quote
PIC24FJ64GL303-E-M5	Microchip Technology	IC MCU 16BIT 64KB FLASH 36UQFN Core Processor: PIC Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Number of I/O: 29 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Data Converters: A/D 11x10/12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 36-UFQFN Exposed Pad Supplier Device Package: 36-UQFN (5x5)	封裝: -	Request a Quote
GA301	Microchip Technology	SCR Voltage - Off State: 100 V Voltage - Gate Trigger (Vgt) (Max): 750 mV Current - Gate Trigger (Igt) (Max): 200 µA Voltage - On State (Vtm) (Max): 1.5 V Current - On State (It (AV)) (Max): 100 A Current - On State (It (RMS)) (Max): - Current - Hold (Ih) (Max): 5 mA Current - Off State (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): - SCR Type: Standard Recovery Operating Temperature: 0°C ~ 125°C Mounting Type: Through Hole Package / Case: TO-206AA, TO-18-3 Metal Can Supplier Device Package: TO-18	封裝: -	Request a Quote
SST25PF040CT-40E-MF18GVAO	Microchip Technology	IC FLASH 4MBIT SPI 40MHZ 8WDFN Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH Memory Size: 4Mbit Memory Interface: SPI Clock Frequency: 40 MHz Write Cycle Time - Word, Page: 5ms Access Time: - Voltage - Supply: 2.3V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 8-WDFN Exposed Pad Supplier Device Package: 8-WDFN (5x6)	封裝: -	Request a Quote
JANTXV2N2369AU-TR	Microchip Technology	DUAL SMALL-SIGNAL BJT Transistor Type: NPN Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): 15 V Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA Current - Collector Cutoff (Max): 400nA DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V Power - Max: 500 mW Frequency - Transition: - Operating Temperature: -65°C ~ 200°C (TJ) Mounting Type: Surface Mount Package / Case: 6-SMD, No Lead Supplier Device Package: U	封裝: -	Request a Quote
JANS2N3737UB-TR	Microchip Technology	TRANS NPN 40V 1.5A UB Transistor Type: NPN Current - Collector (Ic) (Max): 1.5 A Voltage - Collector Emitter Breakdown (Max): 40 V Vce Saturation (Max) @ Ib, Ic: 900mV @ 100mA, 1A Current - Collector Cutoff (Max): 10µA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 1.5V Power - Max: 500 mW Frequency - Transition: - Operating Temperature: -65°C ~ 200°C (TJ) Mounting Type: Surface Mount Package / Case: 4-SMD, No Lead Supplier Device Package: UB	封裝: -	Request a Quote
2N5066	Microchip Technology	SMALL-SIGNAL BJT Transistor Type: NPN Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 20 V Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): 1nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 5 @ 1mA, 6V Power - Max: 400 mW Frequency - Transition: - Operating Temperature: -65°C ~ 200°C (TJ) Mounting Type: Through Hole Package / Case: TO-46-3 Lens Top Metal Can Supplier Device Package: TO-46	封裝: -	Request a Quote
D8100	Microchip Technology	POWER SCHOTTKY Diode Type: - Voltage - DC Reverse (Vr) (Max): - Current - Average Rectified (Io): - Voltage - Forward (Vf) (Max) @ If: - Speed: - Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: - Capacitance @ Vr, F: - Mounting Type: - Package / Case: - Supplier Device Package: - Operating Temperature - Junction: -	封裝: -	Request a Quote
JANS1N4129CUR-1	Microchip Technology	ZENER DIODE Voltage - Zener (Nom) (Vz): 62 V Tolerance: ±2% Power - Max: 500 mW Impedance (Max) (Zzt): 500 Ohms Current - Reverse Leakage @ Vr: 10 nA @ 47.1 V Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Operating Temperature: -65°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: DO-213AA (Glass) Supplier Device Package: DO-213AA	封裝: -	Request a Quote
JANS1N5614	Microchip Technology	DIODE GEN PURP 200V 1A A AXIAL Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 200 V Current - Average Rectified (Io): 1A Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 2 µs Current - Reverse Leakage @ Vr: 500 nA @ 200 V Capacitance @ Vr, F: - Mounting Type: Through Hole Package / Case: A, Axial Supplier Device Package: A, Axial Operating Temperature - Junction: -65°C ~ 200°C	封裝: -	Request a Quote
1N6677-1E3-TR	Microchip Technology	DIODE SCHOTTKY 40V 200MA DO35 Diode Type: Schottky Voltage - DC Reverse (Vr) (Max): 40 V Current - Average Rectified (Io): 200mA Voltage - Forward (Vf) (Max) @ If: 500 mV @ 200 mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: 5 µA @ 40 V Capacitance @ Vr, F: 50pF @ 0V, 1MHz Mounting Type: Through Hole Package / Case: DO-204AH, DO-35, Axial Supplier Device Package: DO-204AH (DO-35) Operating Temperature - Junction: -65°C ~ 125°C	封裝: -	Request a Quote

DSC1123CI5-409.3750T

Microchip Technology

OSC MEMS 409.3750MHZ CMOS SMD

Type: MEMS (Silicon)
Frequency: 409.375MHz
Function: Enable/Disable
Output: LVDS
Voltage - Supply: 2.25 V ~ 3.6 V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Current - Supply (Max): 32mA
Ratings: AEC-Q100
Mounting Type: Surface Mount
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max): 0.035" (0.90mm)

封裝: 6-SMD, No Lead

庫存2,358

DSC1001CI1-133.3333T

Microchip Technology

OSC MEMS 133.3333MHZ CMOS SMD

Type: MEMS (Silicon)
Frequency: 133.3333MHz
Function: Standby (Power Down)
Output: CMOS
Voltage - Supply: 1.8 V ~ 3.3 V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Current - Supply (Max): 8.7mA
Ratings: AEC-Q100
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max): 0.035" (0.90mm)

封裝: 4-SMD, No Lead

庫存4,824

DSC1103CI1-100.0000

Microchip Technology

OSC MEMS 100.000MHZ LVDS SMD

Type: MEMS (Silicon)
Frequency: 100MHz
Function: Standby (Power Down)
Output: LVDS
Voltage - Supply: 2.25 V ~ 3.6 V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Current - Supply (Max): 32mA
Ratings: AEC-Q100
Mounting Type: Surface Mount
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max): 0.035" (0.90mm)

封裝: 6-SMD, No Lead

庫存3,618

MIC94355-4YMT-TR

Microchip Technology

IC REG LINEAR 1.2V 500MA 6TDFN

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 3.6V
Voltage - Output (Min/Fixed): 1.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.2V @ 500mA
Current - Output: 500mA
Current - Quiescent (Iq): -
Current - Supply (Max): 250µA
PSRR: 85dB ~ 50dB (100Hz ~ 5MHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 6-UFDFN Exposed Pad
Supplier Device Package: 6-TDFN (1.6x1.6)

封裝: 6-UFDFN Exposed Pad

庫存6,752

AT45DB011-JC

Microchip Technology

IC FLASH 1MBIT 13MHZ 32PLCC

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH
Memory Size: 1Mb (264 Bytes x 512 pages)
Memory Interface: SPI
Clock Frequency: 15MHz
Write Cycle Time - Word, Page: 15ms
Access Time: -
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C (TC)
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Supplier Device Package: 32-PLCC

封裝: 32-LCC (J-Lead)

庫存6,640

24VL025T/SN

Microchip Technology

IC EEPROM 2KBIT 400KHZ 8SOIC

Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 2Kb (256 x 8)
Memory Interface: I2C
Clock Frequency: 400kHz
Write Cycle Time - Word, Page: 5ms
Access Time: 900ns
Voltage - Supply: 1.5 V ~ 3.6 V
Operating Temperature: -20°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存7,088

PIC16C662T-10/L

Microchip Technology

IC MCU 8BIT 7KB OTP 44PLCC

Core Processor: PIC
Core Size: 8-Bit
Speed: 10MHz
Connectivity: -
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Number of I/O: 33
Program Memory Size: 7KB (4K x 14)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 176 x 8
Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存7,520

DSPIC33FJ128GP206A-E/PT

Microchip Technology

IC MCU 16BIT 128KB FLASH 64TQFP

Core Processor: dsPIC
Core Size: 16-Bit
Speed: 40 MIPs
Connectivity: I2C, IrDA, LIN, SPI, UART/USART
Peripherals: AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 53
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 18x10b/12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-TQFP
Supplier Device Package: 64-TQFP (10x10)

封裝: 64-TQFP

庫存5,904

PIC16F1946-E/PT

Microchip Technology

IC MCU 8BIT 14KB FLASH 64TQFP

Core Processor: PIC
Core Size: 8-Bit
Speed: 32MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 14KB (8K x 14)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: A/D 17x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-TQFP
Supplier Device Package: 64-TQFP (10x10)

封裝: 64-TQFP

庫存6,464

PIC16F527T-I/ML

Microchip Technology

IC MCU 8BIT 1.5KB FLASH 20QFN

Core Processor: PIC
Core Size: 8-Bit
Speed: 20MHz
Connectivity: -
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 17
Program Memory Size: 1.5KB (1K x 12)
Program Memory Type: FLASH
EEPROM Size: 64 x 8
RAM Size: 68 x 8
Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-QFN (4x4)

封裝: 20-VFQFN Exposed Pad

庫存2,368

PIC18LF55K42-I/MV

Microchip Technology

32KB FLASH, 2KB RAM, 256B EEPROM

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,056

PIC24HJ12GP202-I/SP

Microchip Technology

IC MCU 16BIT 12KB FLASH 28SDIP

Core Processor: PIC
Core Size: 16-Bit
Speed: 40 MIPs
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 21
Program Memory Size: 12KB (4K x 24)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x10b/12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-DIP (0.300", 7.62mm)
Supplier Device Package: 28-SPDIP

封裝: 28-DIP (0.300", 7.62mm)

庫存7,328

PIC16C57C-04/P

Microchip Technology

IC MCU 8BIT 3KB OTP 28DIP

Core Processor: PIC
Core Size: 8-Bit
Speed: 4MHz
Connectivity: -
Peripherals: POR, WDT
Number of I/O: 20
Program Memory Size: 3KB (2K x 12)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 72 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 28-DIP (0.600", 15.24mm)
Supplier Device Package: 28-PDIP

封裝: 28-DIP (0.600", 15.24mm)

庫存8,280

U2102B-MFP

Microchip Technology

IC TIMER MULTI IGBT/MOSF 16-SOIC

PLL: No
Main Purpose: Power Management, IGBT,MOSFET
Input: -
Output: -
Number of Circuits: 1
Ratio - Input:Output: 2:1
Differential - Input:Output: No/No
Frequency - Max: 50Hz
Voltage - Supply: -
Operating Temperature: -10°C ~ 100°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存5,056

MCP48CVB02-E/MG

Microchip Technology

IC DAC 8BIT 16QFN

Number of Bits: 8
Number of D/A Converters: 2
Settling Time: 16µs
Output Type: -
Differential Output: No
Data Interface: I²C
Reference Type: External, Internal
Voltage - Supply, Analog: -
Voltage - Supply, Digital: -
INL/DNL (LSB): ±0.1, ±0.1
Architecture: -
Operating Temperature: -40°C ~ 125°C
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-QFN (3x3)
Mounting Type: Surface Mount

封裝: 16-VFQFN Exposed Pad

庫存23,052

PIC32MZ2048EFH100-I/GJX

Microchip Technology

32 BIT MCU FPU 2MB FLASH 512KB R

Core Processor: MIPS32® M-Class
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 78
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (7x7)

封裝: 100-TFBGA

庫存7,552

DSPIC33CK128MC102-I-M6

Microchip Technology

IC MCU 16BIT 128KB FLASH 28UQFN

Core Processor: dsPIC
Core Size: 16-Bit
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 28-UFQFN Exposed Pad
Supplier Device Package: 28-UQFN (4x4)

封裝: -

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CDLL5537C

Microchip Technology

VOLTAGE REGULATOR

Voltage - Zener (Nom) (Vz): 17 V
Tolerance: ±2%
Power - Max: 500 mW
Impedance (Max) (Zzt): 100 Ohms
Current - Reverse Leakage @ Vr: 10 nA @ 15.3 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA
Supplier Device Package: DO-213AA

封裝: -

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PIC24FJ64GL303-E-M5

Microchip Technology

IC MCU 16BIT 64KB FLASH 36UQFN

Core Processor: PIC
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Number of I/O: 29
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Data Converters: A/D 11x10/12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 36-UFQFN Exposed Pad
Supplier Device Package: 36-UQFN (5x5)

封裝: -

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GA301

Microchip Technology

SCR

Voltage - Off State: 100 V
Voltage - Gate Trigger (Vgt) (Max): 750 mV
Current - Gate Trigger (Igt) (Max): 200 µA
Voltage - On State (Vtm) (Max): 1.5 V
Current - On State (It (AV)) (Max): 100 A
Current - On State (It (RMS)) (Max): -
Current - Hold (Ih) (Max): 5 mA
Current - Off State (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): -
SCR Type: Standard Recovery
Operating Temperature: 0°C ~ 125°C
Mounting Type: Through Hole
Package / Case: TO-206AA, TO-18-3 Metal Can
Supplier Device Package: TO-18

封裝: -

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SST25PF040CT-40E-MF18GVAO

Microchip Technology

IC FLASH 4MBIT SPI 40MHZ 8WDFN

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH
Memory Size: 4Mbit
Memory Interface: SPI
Clock Frequency: 40 MHz
Write Cycle Time - Word, Page: 5ms
Access Time: -
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Supplier Device Package: 8-WDFN (5x6)

封裝: -

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JANTXV2N2369AU-TR

Microchip Technology

DUAL SMALL-SIGNAL BJT

Transistor Type: NPN
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): 15 V
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Power - Max: 500 mW
Frequency - Transition: -
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 6-SMD, No Lead
Supplier Device Package: U

封裝: -

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JANS2N3737UB-TR

Microchip Technology

TRANS NPN 40V 1.5A UB

Transistor Type: NPN
Current - Collector (Ic) (Max): 1.5 A
Voltage - Collector Emitter Breakdown (Max): 40 V
Vce Saturation (Max) @ Ib, Ic: 900mV @ 100mA, 1A
Current - Collector Cutoff (Max): 10µA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1A, 1.5V
Power - Max: 500 mW
Frequency - Transition: -
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 4-SMD, No Lead
Supplier Device Package: UB

封裝: -

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2N5066

Microchip Technology

SMALL-SIGNAL BJT

Transistor Type: NPN
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 20 V
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): 1nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 5 @ 1mA, 6V
Power - Max: 400 mW
Frequency - Transition: -
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-46-3 Lens Top Metal Can
Supplier Device Package: TO-46

封裝: -

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D8100

Microchip Technology

POWER SCHOTTKY

Diode Type: -
Voltage - DC Reverse (Vr) (Max): -
Current - Average Rectified (Io): -
Voltage - Forward (Vf) (Max) @ If: -
Speed: -
Reverse Recovery Time (trr): -
Current - Reverse Leakage @ Vr: -
Capacitance @ Vr, F: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -
Operating Temperature - Junction: -

封裝: -

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JANS1N4129CUR-1

Microchip Technology

ZENER DIODE

Voltage - Zener (Nom) (Vz): 62 V
Tolerance: ±2%
Power - Max: 500 mW
Impedance (Max) (Zzt): 500 Ohms
Current - Reverse Leakage @ Vr: 10 nA @ 47.1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA (Glass)
Supplier Device Package: DO-213AA

封裝: -

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JANS1N5614

Microchip Technology

DIODE GEN PURP 200V 1A A AXIAL

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 200 V
Current - Average Rectified (Io): 1A
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Current - Reverse Leakage @ Vr: 500 nA @ 200 V
Capacitance @ Vr, F: -
Mounting Type: Through Hole
Package / Case: A, Axial
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 200°C

封裝: -

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1N6677-1E3-TR

Microchip Technology

DIODE SCHOTTKY 40V 200MA DO35

Diode Type: Schottky
Voltage - DC Reverse (Vr) (Max): 40 V
Current - Average Rectified (Io): 200mA
Voltage - Forward (Vf) (Max) @ If: 500 mV @ 200 mA
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): -
Current - Reverse Leakage @ Vr: 5 µA @ 40 V
Capacitance @ Vr, F: 50pF @ 0V, 1MHz
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 125°C

封裝: -

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