頁 56 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
5CSEBA6U19C6N	Intel	IC FPGA 66 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存4,016
EP20K100FC324-1X	Intel	IC FPGA 252 I/O 324FBGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 252 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	封裝: 324-BGA	庫存6,528
EPF6016ATC100-3	Intel	IC FPGA 81 I/O 100TQFP Number of LABs/CLBs: 132 Number of Logic Elements/Cells: 1320 Total RAM Bits: - Number of I/O: 81 Number of Gates: 16000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-TQFP	庫存6,228
10AX048K2F35E2LG	Intel	1152-PIN FBGA Number of LABs/CLBs: 183590 Number of Logic Elements/Cells: 480000 Total RAM Bits: 5664768 Number of I/O: 396 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,008
EP3SE80F1152I4LN	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 3200 Number of Logic Elements/Cells: 80000 Total RAM Bits: 6843392 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,504
5SGXEB6R2F40C2N	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,184
EP2AGX125DF25C4N	Intel	IC FPGA 260 I/O 572FBGA Number of LABs/CLBs: 4964 Number of Logic Elements/Cells: 118143 Total RAM Bits: 8315904 Number of I/O: 260 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 572-BGA, FCBGA Supplier Device Package: 572-FBGA, FC (25x25)	封裝: 572-BGA, FCBGA	庫存5,936
5AGXFA7H4F35C5N	Intel	IC FPGA 544 I/O 1152FBGA Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Total RAM Bits: 15470592 Number of I/O: 544 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA Exposed Pad	庫存8,700
10CX220YF780E5G	Intel	780-PIN FBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 284 Number of Gates: - Voltage - Supply: 0.9V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存5,856
5CGTFD5C5F27I7N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BGA	庫存4,912
EPM240T100I5	Intel	IC CPLD 192MC 4.7NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 4.7ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 240 Number of Macrocells: 192 Number of Gates: - Number of I/O: 80 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-TQFP	庫存5,056
EP4SGX110FF35I3G	Intel	IC FPGA 372 I/O 1152FBGA Number of LABs/CLBs: 4224 Number of Logic Elements/Cells: 105600 Total RAM Bits: 9793536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,288
GWIXP460BADT	Intel	IC MPU INTEL 533MHZ PBGA544 Core Processor: Intel® IXP45X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: Mll (3), SMII (3) SATA: - USB: USB 1.1 (1), USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Package / Case: 544-BBGA Supplier Device Package: 544-PBGA (35x35)	封裝: -	Request a Quote
5SGSMD3H3F35I3LG	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
FWIXP420BC	Intel	IC MPU 400MHZ 492BGA Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100Mbps (2) SATA: - USB: USB 1.1 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35x35)	封裝: -	Request a Quote
5SGXMA3E3H29C2LG	Intel	IC FPGA 600 I/O 780HBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: -	Request a Quote
N82077SL	Intel	FLOPPY DISK DRIVE, 0.125MBPS Protocol: - Function: Controller Interface: - Standards: - Voltage - Supply: 4.5V ~ 5.5V Current - Supply: 50mA Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC	封裝: -	Request a Quote
LF80538GF0282M	Intel	IC MPU T1300 1.66GHZ 478PPGA Core Processor: Intel® Core™ Solo Processor T1300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.66GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.1625V, 1.3V Operating Temperature: 0°C ~ 100°C (TJ) Security Features: - Package / Case: 478-PGA Supplier Device Package: 478-PPGA (35x35)	封裝: -	Request a Quote
1SG280HN1F43E2LGS3	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5ASXBB3D6F35C6G	Intel	IC SOC CORTEX-A9 700MHZ 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35x35)	封裝: -	Request a Quote
1SG280HU1F50I2LG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
5SGXMA7N1F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
1SG250HU2F50E2LG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
5SGXMA3K2F35C2G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
RJ80530KZ001512	Intel	IC MPU 2 1GHZ PBGA479 Core Processor: Intel® Pentium® III Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.15V Operating Temperature: 100°C (TC) Security Features: - Package / Case: 479-BGA Supplier Device Package: 479-PBGA (35x35)	封裝: -	Request a Quote
AGFB023R31C3E3E	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
AGFC023R25A2E3V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
1SX110HN3F43E2VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 1100K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote

5CSEBA6U19C6N

Intel

IC FPGA 66 I/O 484UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存4,016

EP20K100FC324-1X

Intel

IC FPGA 252 I/O 324FBGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 252
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)

封裝: 324-BGA

庫存6,528

EPF6016ATC100-3

Intel

IC FPGA 81 I/O 100TQFP

Number of LABs/CLBs: 132
Number of Logic Elements/Cells: 1320
Total RAM Bits: -
Number of I/O: 81
Number of Gates: 16000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

庫存6,228

10AX048K2F35E2LG

Intel

1152-PIN FBGA

Number of LABs/CLBs: 183590
Number of Logic Elements/Cells: 480000
Total RAM Bits: 5664768
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,008

EP3SE80F1152I4LN

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: 3200
Number of Logic Elements/Cells: 80000
Total RAM Bits: 6843392
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,504

5SGXEB6R2F40C2N

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,184

EP2AGX125DF25C4N

Intel

IC FPGA 260 I/O 572FBGA

Number of LABs/CLBs: 4964
Number of Logic Elements/Cells: 118143
Total RAM Bits: 8315904
Number of I/O: 260
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 572-BGA, FCBGA
Supplier Device Package: 572-FBGA, FC (25x25)

封裝: 572-BGA, FCBGA

庫存5,936

5AGXFA7H4F35C5N

Intel

IC FPGA 544 I/O 1152FBGA

Number of LABs/CLBs: 11460
Number of Logic Elements/Cells: 242000
Total RAM Bits: 15470592
Number of I/O: 544
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA Exposed Pad
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA Exposed Pad

庫存8,700

10CX220YF780E5G

Intel

780-PIN FBGA

Number of LABs/CLBs: 80330
Number of Logic Elements/Cells: 220000
Total RAM Bits: 13752320
Number of I/O: 284
Number of Gates: -
Voltage - Supply: 0.9V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存5,856

5CGTFD5C5F27I7N

Intel

IC FPGA 336 I/O 672FBGA

Number of LABs/CLBs: 29080
Number of Logic Elements/Cells: 77000
Total RAM Bits: 5001216
Number of I/O: 336
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BGA

庫存4,912

EPM240T100I5

Intel

IC CPLD 192MC 4.7NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 4.7ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 240
Number of Macrocells: 192
Number of Gates: -
Number of I/O: 80
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

庫存5,056

EP4SGX110FF35I3G

Intel

IC FPGA 372 I/O 1152FBGA

Number of LABs/CLBs: 4224
Number of Logic Elements/Cells: 105600
Total RAM Bits: 9793536
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,288

GWIXP460BADT

Intel

IC MPU INTEL 533MHZ PBGA544

Core Processor: Intel® IXP45X
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: Mll (3), SMII (3)
SATA: -
USB: USB 1.1 (1), USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
Package / Case: 544-BBGA
Supplier Device Package: 544-PBGA (35x35)

封裝: -

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5SGSMD3H3F35I3LG

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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FWIXP420BC

Intel

IC MPU 400MHZ 492BGA

Core Processor: Xscale
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100Mbps (2)
SATA: -
USB: USB 1.1 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 492-BBGA
Supplier Device Package: 492-BGA (35x35)

封裝: -

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5SGXMA3E3H29C2LG

Intel

IC FPGA 600 I/O 780HBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: -

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N82077SL

Intel

FLOPPY DISK DRIVE, 0.125MBPS

Protocol: -
Function: Controller
Interface: -
Standards: -
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 50mA
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC

封裝: -

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LF80538GF0282M

Intel

IC MPU T1300 1.66GHZ 478PPGA

Core Processor: Intel® Core™ Solo Processor T1300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.66GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.1625V, 1.3V
Operating Temperature: 0°C ~ 100°C (TJ)
Security Features: -
Package / Case: 478-PGA
Supplier Device Package: 478-PPGA (35x35)

封裝: -

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1SG280HN1F43E2LGS3

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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5ASXBB3D6F35C6G

Intel

IC SOC CORTEX-A9 700MHZ 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA, FC (35x35)

封裝: -

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1SG280HU1F50I2LG

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5SGXMA7N1F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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1SG250HU2F50E2LG

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5SGXMA3K2F35C2G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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RJ80530KZ001512

Intel

IC MPU 2 1GHZ PBGA479

Core Processor: Intel® Pentium® III Processor
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.15V
Operating Temperature: 100°C (TC)
Security Features: -
Package / Case: 479-BGA
Supplier Device Package: 479-PBGA (35x35)

封裝: -

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AGFB023R31C3E3E

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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AGFC023R25A2E3V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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1SX110HN3F43E2VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 1100K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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