Intel 產品

EP20K200EFC23-1XGA

Intel

IC FPGA

• Number of LABs/CLBs: 832
• Number of Logic Elements/Cells: 8320
• Total RAM Bits: 106496
• Number of I/O: 376
• Number of Gates: 526000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

10AX115R3F40I2SGES

Intel

IC FPGA 342 I/O 1517FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 342
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

EPF8636ALC84-4N

Intel

IC FPGA 68 I/O 84PLCC

• Number of LABs/CLBs: 63
• Number of Logic Elements/Cells: 504
• Total RAM Bits: -
• Number of I/O: 68
• Number of Gates: 6000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.21x29.21)

封裝: 84-LCC (J-Lead)

EP2A15F672C9N

Intel

IC FPGA 492 I/O 672FBGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 425984
• Number of I/O: 492
• Number of Gates: 1900000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

EP20K30ETC144-2N

Intel

IC FPGA 92 I/O 144TQFP

• Number of LABs/CLBs: 120
• Number of Logic Elements/Cells: 1200
• Total RAM Bits: 24576
• Number of I/O: 92
• Number of Gates: 113000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

EP1M120F484C7N

Intel

IC FPGA 303 I/O 484FBGA

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4800
• Total RAM Bits: 49152
• Number of I/O: 303
• Number of Gates: 120000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA, FCBGA

EP1S40F1020C5

Intel

IC FPGA 773 I/O 1020FBGA

• Number of LABs/CLBs: 4125
• Number of Logic Elements/Cells: 41250
• Total RAM Bits: 3423744
• Number of I/O: 773
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

5SGXEABN1F45C2N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

10AX090N2F40E1SG

Intel

IC FPGA 600 I/O 1517FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

5SGXMABK3H40C4N

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

封裝: 1517-BBGA, FCBGA

5AGXMB5G4F35C5G

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 19811
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 23625728
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

EP2S60F484C4N

Intel

IC FPGA 334 I/O 484FBGA

• Number of LABs/CLBs: 3022
• Number of Logic Elements/Cells: 60440
• Total RAM Bits: 2544192
• Number of I/O: 334
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

EP3SE50F484C4N

Intel

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 1900
• Number of Logic Elements/Cells: 47500
• Total RAM Bits: 5760000
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA, FCBGA

EP3C80U484I7N

Intel

IC FPGA 295 I/O 484UBGA

• Number of LABs/CLBs: 5079
• Number of Logic Elements/Cells: 81264
• Total RAM Bits: 2810880
• Number of I/O: 295
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

EP3C80U484C6

Intel

IC FPGA 295 I/O 484UBGA

• Number of LABs/CLBs: 5079
• Number of Logic Elements/Cells: 81264
• Total RAM Bits: 2810880
• Number of I/O: 295
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

EP4CE15F23C9LN

Intel

IC FPGA 343 I/O 484FBGA

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 343
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

EPM7256AEFC100-10N

Intel

IC CPLD 256MC 10NS 100FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LBGA
• Supplier Device Package: 100-FBGA (11x11)

封裝: 100-LBGA

5AGXMB1G4F40C4G

Intel

IC FPGA 704 I/O 1517FBGA

• Number of LABs/CLBs: 14151
• Number of Logic Elements/Cells: 300000
• Total RAM Bits: 17358848
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

AGIC040R39A2E2V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 4.047M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

封裝: -

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1SG040HH3F35E3VG

Intel

IC FPGA STRATIX10GX 1152FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 378000
• Total RAM Bits: 31457280
• Number of I/O: 374
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXMA7K3F40C2LNCV

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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5SGSMD5H3F35I3G

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 39936000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGSMD3E2H29I3LG

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 89000
• Number of Logic Elements/Cells: 236000
• Total RAM Bits: 13312000
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

封裝: -

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5AGTFD7H3F35I3G

Intel

IC FPGA 342 I/O 1152FBGA

• Number of LABs/CLBs: 23773
• Number of Logic Elements/Cells: 504000
• Total RAM Bits: 27695104
• Number of I/O: 342
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA, FC (35x35)

封裝: -

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AGFA027R24C2I1VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

封裝: -

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1ST280EU3F50E3XG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5ASXBB3D4F31I5G

Intel

IC SOC CORTEX-A9 800MHZ 896FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: FPGA - 350K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

封裝: -

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RJ80530KZ933512

Intel

IC MPU 2 933MHZ PBGA479

• Core Processor: Intel® Pentium® III Processor
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 933MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.15V
• Operating Temperature: 100°C (TC)
• Security Features: -
• Package / Case: 479-BGA
• Supplier Device Package: 479-PBGA (35x35)

封裝: -

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