頁 325 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
TS87C51RA24	Intel	IC MCU 8BIT 8KB OTP 44MQFP Core Processor: MCS 51 Core Size: 8-Bit Speed: 24MHz Connectivity: SIO Peripherals: WDT Number of I/O: 32 Program Memory Size: 8KB (8K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: -	封裝: 44-QFP	庫存7,440
S80C51RA24	Intel	IC MCU 8BIT ROMLESS 44MQFP Core Processor: MCS 51 Core Size: 8-Bit Speed: 24MHz Connectivity: SIO Peripherals: WDT Number of I/O: 32 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: -	封裝: 44-QFP	庫存6,624
1SX250LH2F55I1VG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,224
1SX250LH3F55I2LG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存3,696
5CSEBA4U19A7N	Intel	IC FPGA 161 I/O 484FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存2,880
10M25DAF256I6G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 1563 Number of Logic Elements/Cells: 25000 Total RAM Bits: 691200 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存3,344
EP20K30EFC256-3	Intel	IC FPGA Number of LABs/CLBs: 120 Number of Logic Elements/Cells: 1200 Total RAM Bits: 24576 Number of I/O: - Number of Gates: 113000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存4,304
EPF10K50VBC356-2	Intel	IC FPGA 274 I/O 356BGA Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 20480 Number of I/O: 274 Number of Gates: 116000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	封裝: 356-LBGA	庫存5,584
EP20K200EBC356-2N	Intel	IC FPGA 271 I/O 356BGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 271 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 356-LBGA Supplier Device Package: 356-BGA (35x35)	封裝: 356-LBGA	庫存2,480
EPF10K100ARI240-3N	Intel	IC FPGA 189 I/O 240RQFP Number of LABs/CLBs: 624 Number of Logic Elements/Cells: 4992 Total RAM Bits: 24576 Number of I/O: 189 Number of Gates: 158000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-RQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存4,048
EP1S30F1020C7	Intel	IC FPGA 726 I/O 1020FBGA Number of LABs/CLBs: 3247 Number of Logic Elements/Cells: 32470 Total RAM Bits: 3317184 Number of I/O: 726 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存4,320
5SGXEA7N1F40I2N	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,520
5SEE9H40I3N	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 64210944 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封裝: 1517-BBGA, FCBGA	庫存2,752
5SGSED6K3F40C2LN	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 54553600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存6,912
EP4SE230F29I3N	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 9120 Number of Logic Elements/Cells: 228000 Total RAM Bits: 17544192 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存3,216
EP4CE75F23C6N	Intel	IC FPGA 292 I/O 484FBGA Number of LABs/CLBs: 4713 Number of Logic Elements/Cells: 75408 Total RAM Bits: 2810880 Number of I/O: 292 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存3,968
5CGTFD5C5M13C7N	Intel	IC FPGA 175 I/O 383MBGA Number of LABs/CLBs: 29080 Number of Logic Elements/Cells: 77000 Total RAM Bits: 5001216 Number of I/O: 175 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 383-TFBGA Supplier Device Package: 383-MBGA (13x13)	封裝: 383-TFBGA	庫存6,800
10M50DAF672C8G	Intel	IC FPGA 500 I/O 672FBGA Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 500 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BGA	庫存4,880
EPM7256EQC160-15	Intel	IC CPLD 256MC 15NS 160QFP Programmable Type: EE PLD Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 132 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存4,128
EPM7128SQC100-15N	Intel	IC CPLD 128MC 15NS 100QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	封裝: 100-BQFP	庫存11,496
AGFB008R24D1I3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封裝: -	Request a Quote
SB80C188XL25	Intel	IC MPU I186 25MHZ 80SQFP Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 25MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 80-QFP Supplier Device Package: 80-SQFP	封裝: -	Request a Quote
AGFD019R24C2I1V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封裝: -	Request a Quote
KC80526LY700128	Intel	RISC MPU, 32-BIT, 700MHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGSMD3E1H29I2G	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: -	Request a Quote
10M16DAF484A7G	Intel	IC FPGA 320 I/O 484FBGA Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 16000 Total RAM Bits: 562176 Number of I/O: 320 Number of Gates: - Voltage - Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: -	庫存249
5SGXEA5N3F45I4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
5SGXMB5R2F40I3G	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 41984000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote

TS87C51RA24

Intel

IC MCU 8BIT 8KB OTP 44MQFP

Core Processor: MCS 51
Core Size: 8-Bit
Speed: 24MHz
Connectivity: SIO
Peripherals: WDT
Number of I/O: 32
Program Memory Size: 8KB (8K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: -

封裝: 44-QFP

庫存7,440

S80C51RA24

Intel

IC MCU 8BIT ROMLESS 44MQFP

Core Processor: MCS 51
Core Size: 8-Bit
Speed: 24MHz
Connectivity: SIO
Peripherals: WDT
Number of I/O: 32
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: -

封裝: 44-QFP

庫存6,624

1SX250LH2F55I1VG

Intel

2912-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,224

1SX250LH3F55I2LG

Intel

2912-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,696

5CSEBA4U19A7N

Intel

IC FPGA 161 I/O 484FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 40K Logic Elements
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存2,880

10M25DAF256I6G

Intel

IC FPGA 178 I/O 256FBGA

Number of LABs/CLBs: 1563
Number of Logic Elements/Cells: 25000
Total RAM Bits: 691200
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存3,344

EP20K30EFC256-3

Intel

IC FPGA

Number of LABs/CLBs: 120
Number of Logic Elements/Cells: 1200
Total RAM Bits: 24576
Number of I/O: -
Number of Gates: 113000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存4,304

EPF10K50VBC356-2

Intel

IC FPGA 274 I/O 356BGA

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 20480
Number of I/O: 274
Number of Gates: 116000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 356-LBGA
Supplier Device Package: 356-BGA (35x35)

封裝: 356-LBGA

庫存5,584

EP20K200EBC356-2N

Intel

IC FPGA 271 I/O 356BGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 271
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 356-LBGA
Supplier Device Package: 356-BGA (35x35)

封裝: 356-LBGA

庫存2,480

EPF10K100ARI240-3N

Intel

IC FPGA 189 I/O 240RQFP

Number of LABs/CLBs: 624
Number of Logic Elements/Cells: 4992
Total RAM Bits: 24576
Number of I/O: 189
Number of Gates: 158000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-RQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存4,048

EP1S30F1020C7

Intel

IC FPGA 726 I/O 1020FBGA

Number of LABs/CLBs: 3247
Number of Logic Elements/Cells: 32470
Total RAM Bits: 3317184
Number of I/O: 726
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存4,320

5SGXEA7N1F40I2N

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,520

5SEE9H40I3N

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 64210944
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封裝: 1517-BBGA, FCBGA

庫存2,752

5SGSED6K3F40C2LN

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 54553600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存6,912

EP4SE230F29I3N

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 9120
Number of Logic Elements/Cells: 228000
Total RAM Bits: 17544192
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存3,216

EP4CE75F23C6N

Intel

IC FPGA 292 I/O 484FBGA

Number of LABs/CLBs: 4713
Number of Logic Elements/Cells: 75408
Total RAM Bits: 2810880
Number of I/O: 292
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存3,968

5CGTFD5C5M13C7N

Intel

IC FPGA 175 I/O 383MBGA

Number of LABs/CLBs: 29080
Number of Logic Elements/Cells: 77000
Total RAM Bits: 5001216
Number of I/O: 175
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 383-TFBGA
Supplier Device Package: 383-MBGA (13x13)

封裝: 383-TFBGA

庫存6,800

10M50DAF672C8G

Intel

IC FPGA 500 I/O 672FBGA

Number of LABs/CLBs: 3125
Number of Logic Elements/Cells: 50000
Total RAM Bits: 1677312
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BGA

庫存4,880

EPM7256EQC160-15

Intel

IC CPLD 256MC 15NS 160QFP

Programmable Type: EE PLD
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 132
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存4,128

EPM7128SQC100-15N

Intel

IC CPLD 128MC 15NS 100QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

封裝: 100-BQFP

庫存11,496

AGFB008R24D1I3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 764K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封裝: -

Request a Quote

SB80C188XL25

Intel

IC MPU I186 25MHZ 80SQFP

Core Processor: 80C186
Number of Cores/Bus Width: 1 Core, 16-Bit
Speed: 25MHz
Co-Processors/DSP: -
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 80-QFP
Supplier Device Package: 80-SQFP

封裝: -

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AGFD019R24C2I1V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封裝: -

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KC80526LY700128

Intel

RISC MPU, 32-BIT, 700MHZ

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

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5SGSMD3E1H29I2G

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

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10M16DAF484A7G

Intel

IC FPGA 320 I/O 484FBGA

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 16000
Total RAM Bits: 562176
Number of I/O: 320
Number of Gates: -
Voltage - Supply: 1.15V ~ 1.25V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: -

庫存249

5SGXEA5N3F45I4G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

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5SGXMB5R2F40I3G

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 41984000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-FBGA (40x40)
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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