頁 319 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
10AS057K2F40I1SG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,448
EPXA10F1020C3	Intel	IC EXCALIBUR ARM 1020FBGA Core Type: 32-Bit ARM9 Speed: 166MHz Interface: EBI/EMI, UART/USART Program SRAM Bytes: 256K FPGA SRAM: - EEPROM Size: - Data SRAM Bytes: 128K FPGA Core Cells: 38400 FPGA Gates: 1M FPGA Registers: - Voltage - Supply: 1.8V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封裝: 1020-BBGA	庫存5,808
EP20K100CQ208C9	Intel	IC FPGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 159 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存7,216
EP2AGX95EF35I3	Intel	IC FPGA 452 I/O 1152FBGA Number of LABs/CLBs: 3747 Number of Logic Elements/Cells: 89178 Total RAM Bits: 6839296 Number of I/O: 452 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,896
EPF8820AQC160-4	Intel	IC FPGA 120 I/O 160QFP Number of LABs/CLBs: 84 Number of Logic Elements/Cells: 672 Total RAM Bits: - Number of I/O: 120 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存5,120
EPF10K10TI144-4N	Intel	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 72 Number of Logic Elements/Cells: 576 Total RAM Bits: 6144 Number of I/O: 102 Number of Gates: 31000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存14,040
5SGXEA7N2F40I2LN	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,168
5SGSMD8K2F40C3N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 60968960 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,600
5SGXEA7N3F40I3L	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存6,688
5SGXMB5R3F40I4N	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 48927744 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,632
10AX057N2F40I2SG	Intel	IC FPGA 588 I/O 1517FCBGA Number of LABs/CLBs: 217080 Number of Logic Elements/Cells: 570000 Total RAM Bits: 42082304 Number of I/O: 588 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,656
EP3SE80F780I4	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 3200 Number of Logic Elements/Cells: 80000 Total RAM Bits: 6843392 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存7,984
5AGXBA7D6F31C6N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Total RAM Bits: 15470592 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存7,808
10CX220YU484E6G	Intel	484-PIN UBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 188 Number of Gates: - Voltage - Supply: 0.9V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-BFBGA, FCBGA	庫存4,544
EP1C4F324C6	Intel	IC FPGA 249 I/O 324FBGA Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 4000 Total RAM Bits: 78336 Number of I/O: 249 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	封裝: 324-BGA	庫存5,552
EP4CE15M9C7N	Intel	IC FPGA 165 I/O 256MBGA Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 165 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-TFBGA Supplier Device Package: 256-MBGA (9x9)	封裝: 256-TFBGA	庫存4,480
EPM7256SRI208-10N	Intel	IC CPLD 256MC 10NS 208RQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 164 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存5,312
EPM3256ATI144-10N	Intel	IC CPLD 256MC 10NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 5000 Number of I/O: 116 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存27,060
AGIB027R29A2E2VB	Intel	IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封裝: -	Request a Quote
AGFB019R24C3E3V	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封裝: -	Request a Quote
1SG280LN3F43I3XGAS	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5SGXMABN2F45I2G	Intel	IC FPGA 840 I/O 1932FCBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 53248000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
EP3SL200F1152I4G	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
EP4SGX230FF35C2XG	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGXMA7K3F35C4WN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
AGFB027R31C2I1VAA	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
1SX250LU3F50I3XG	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
5SGXMA4K2F35C2WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote

10AS057K2F40I1SG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,448

EPXA10F1020C3

Intel

IC EXCALIBUR ARM 1020FBGA

Core Type: 32-Bit ARM9
Speed: 166MHz
Interface: EBI/EMI, UART/USART
Program SRAM Bytes: 256K
FPGA SRAM: -
EEPROM Size: -
Data SRAM Bytes: 128K
FPGA Core Cells: 38400
FPGA Gates: 1M
FPGA Registers: -
Voltage - Supply: 1.8V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

庫存5,808

EP20K100CQ208C9

Intel

IC FPGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 159
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存7,216

EP2AGX95EF35I3

Intel

IC FPGA 452 I/O 1152FBGA

Number of LABs/CLBs: 3747
Number of Logic Elements/Cells: 89178
Total RAM Bits: 6839296
Number of I/O: 452
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,896

EPF8820AQC160-4

Intel

IC FPGA 120 I/O 160QFP

Number of LABs/CLBs: 84
Number of Logic Elements/Cells: 672
Total RAM Bits: -
Number of I/O: 120
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存5,120

EPF10K10TI144-4N

Intel

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 72
Number of Logic Elements/Cells: 576
Total RAM Bits: 6144
Number of I/O: 102
Number of Gates: 31000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存14,040

5SGXEA7N2F40I2LN

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,168

5SGSMD8K2F40C3N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 60968960
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,600

5SGXEA7N3F40I3L

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存6,688

5SGXMB5R3F40I4N

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 48927744
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,632

10AX057N2F40I2SG

Intel

IC FPGA 588 I/O 1517FCBGA

Number of LABs/CLBs: 217080
Number of Logic Elements/Cells: 570000
Total RAM Bits: 42082304
Number of I/O: 588
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,656

EP3SE80F780I4

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 3200
Number of Logic Elements/Cells: 80000
Total RAM Bits: 6843392
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存7,984

5AGXBA7D6F31C6N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 11460
Number of Logic Elements/Cells: 242000
Total RAM Bits: 15470592
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存7,808

10CX220YU484E6G

Intel

484-PIN UBGA

Number of LABs/CLBs: 80330
Number of Logic Elements/Cells: 220000
Total RAM Bits: 13752320
Number of I/O: 188
Number of Gates: -
Voltage - Supply: 0.9V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BFBGA, FCBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-BFBGA, FCBGA

庫存4,544

EP1C4F324C6

Intel

IC FPGA 249 I/O 324FBGA

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 4000
Total RAM Bits: 78336
Number of I/O: 249
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)

封裝: 324-BGA

庫存5,552

EP4CE15M9C7N

Intel

IC FPGA 165 I/O 256MBGA

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 165
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-TFBGA
Supplier Device Package: 256-MBGA (9x9)

封裝: 256-TFBGA

庫存4,480

EPM7256SRI208-10N

Intel

IC CPLD 256MC 10NS 208RQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 164
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存5,312

EPM3256ATI144-10N

Intel

IC CPLD 256MC 10NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 5000
Number of I/O: 116
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存27,060

AGIB027R29A2E2VB

Intel

IC FPGA AGILEX-I 2957BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封裝: -

Request a Quote

AGFB019R24C3E3V

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封裝: -

Request a Quote

1SG280LN3F43I3XGAS

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

Request a Quote

5SGXMABN2F45I2G

Intel

IC FPGA 840 I/O 1932FCBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 53248000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

Request a Quote

EP3SL200F1152I4G

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

EP4SGX230FF35C2XG

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

5SGXMA7K3F35C4WN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

Request a Quote

AGFB027R31C2I1VAA

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

1SX250LU3F50I3XG

Intel

IC FPGA STRATIX 10 2397FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

Request a Quote

5SGXMA4K2F35C2WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

Request a Quote