頁 290 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
EP20K200CF672C9	Intel	IC FPGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: - Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存2,848
EP20K100CF144C9	Intel	IC FPGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 93 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存3,488
EP20K100QC208-3	Intel	IC FPGA 159 I/O 208QFP Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 159 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,224
5SGSMD6K2F40I2N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 54553600 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,952
EP4SE530F43I4	Intel	IC FPGA 1120 I/O 1760FBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 1120 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存3,184
EP2SGX130GF1508C4	Intel	IC FPGA 734 I/O 1508FBGA Number of LABs/CLBs: 6627 Number of Logic Elements/Cells: 132540 Total RAM Bits: 6747840 Number of I/O: 734 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	封裝: 1508-BBGA, FCBGA	庫存2,512
5SGXEA5N2F40C3N	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,536
EP2S130F1508C5N	Intel	IC FPGA 1126 I/O 1508FBGA Number of LABs/CLBs: 6627 Number of Logic Elements/Cells: 132540 Total RAM Bits: 6747840 Number of I/O: 1126 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	封裝: 1508-BBGA, FCBGA	庫存8,448
EP2S60F672C5N	Intel	IC FPGA 492 I/O 672FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 492 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存6,448
5AGTMC3D3F27I5N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 7362 Number of Logic Elements/Cells: 156000 Total RAM Bits: 11746304 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存7,840
EP3SL50F484C4LN	Intel	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 1900 Number of Logic Elements/Cells: 47500 Total RAM Bits: 2184192 Number of I/O: 296 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存2,480
EP4CE55F29C7N	Intel	IC FPGA 374 I/O 780FBGA Number of LABs/CLBs: 3491 Number of Logic Elements/Cells: 55856 Total RAM Bits: 2396160 Number of I/O: 374 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BGA	庫存7,840
EP1C20F324I7	Intel	IC FPGA 233 I/O 324FBGA Number of LABs/CLBs: 2006 Number of Logic Elements/Cells: 20060 Total RAM Bits: 294912 Number of I/O: 233 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	封裝: 324-BGA	庫存6,304
EPM7064AEFC100-10N	Intel	IC CPLD 64MC 10NS 100FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LBGA Supplier Device Package: 100-FBGA (11x11)	封裝: 100-LBGA	庫存6,496
EPM7064AEFC100-10	Intel	IC CPLD 64MC 10NS 100FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LBGA Supplier Device Package: 100-FBGA (11x11)	封裝: 100-LBGA	庫存6,688
5SGXMA5N1F40I2WN	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
BD3450-S-LGZY	Intel	INTELCHIPSETS 3450 CHIPSET SERVE Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
FA82438MX	Intel	INTEL 430MX PCISET - 82438MX (MT Type: - Circuit: - Independent Circuits: - Current - Output High, Low: - Voltage Supply Source: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5AGZME3E3H29C4G	Intel	IC FPGA 342 I/O 780HBGA Number of LABs/CLBs: 16980 Number of Logic Elements/Cells: 360000 Total RAM Bits: 23946240 Number of I/O: 342 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: -	Request a Quote
EP82562G	Intel	INTERFACE CIRCUIT, PDSO48 Protocol: - Function: - Interface: - Standards: - Voltage - Supply: - Current - Supply: - Operating Temperature: - Package / Case: 48-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 48-SSOP	封裝: -	Request a Quote
1SX250HU1F50E2VG	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
AGIB022R31A1E2VB	Intel	IC FPGA AGILEX-I 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
RK80546KF1071M	Intel	XEON PROCESSOR 64-BIT Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5AGZME5H3F35I4G	Intel	IC FPGA 534 I/O 1152FBGA Number of LABs/CLBs: 18870 Number of Logic Elements/Cells: 400000 Total RAM Bits: 34322432 Number of I/O: 534 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
1SG250HU2F50I2VG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
5SGXMA5K1F35C1G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
5ASXBB3D4F31C5G	Intel	IC SOC CORTEX-A9 800MHZ 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封裝: -	Request a Quote
5SGXEA4K3F35I4G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote

EP20K200CF672C9

Intel

IC FPGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: -
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存2,848

EP20K100CF144C9

Intel

IC FPGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 93
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存3,488

EP20K100QC208-3

Intel

IC FPGA 159 I/O 208QFP

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 159
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,224

5SGSMD6K2F40I2N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 54553600
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,952

EP4SE530F43I4

Intel

IC FPGA 1120 I/O 1760FBGA

Number of LABs/CLBs: 21248
Number of Logic Elements/Cells: 531200
Total RAM Bits: 28033024
Number of I/O: 1120
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存3,184

EP2SGX130GF1508C4

Intel

IC FPGA 734 I/O 1508FBGA

Number of LABs/CLBs: 6627
Number of Logic Elements/Cells: 132540
Total RAM Bits: 6747840
Number of I/O: 734
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1508-BBGA, FCBGA
Supplier Device Package: 1508-FBGA (30x30)

封裝: 1508-BBGA, FCBGA

庫存2,512

5SGXEA5N2F40C3N

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 53105664
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,536

EP2S130F1508C5N

Intel

IC FPGA 1126 I/O 1508FBGA

Number of LABs/CLBs: 6627
Number of Logic Elements/Cells: 132540
Total RAM Bits: 6747840
Number of I/O: 1126
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1508-BBGA, FCBGA
Supplier Device Package: 1508-FBGA (30x30)

封裝: 1508-BBGA, FCBGA

庫存8,448

EP2S60F672C5N

Intel

IC FPGA 492 I/O 672FBGA

Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 492
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存6,448

5AGTMC3D3F27I5N

Intel

IC FPGA 336 I/O 672FBGA

Number of LABs/CLBs: 7362
Number of Logic Elements/Cells: 156000
Total RAM Bits: 11746304
Number of I/O: 336
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存7,840

EP3SL50F484C4LN

Intel

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 2184192
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存2,480

EP4CE55F29C7N

Intel

IC FPGA 374 I/O 780FBGA

Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 374
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BGA

庫存7,840

EP1C20F324I7

Intel

IC FPGA 233 I/O 324FBGA

Number of LABs/CLBs: 2006
Number of Logic Elements/Cells: 20060
Total RAM Bits: 294912
Number of I/O: 233
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)

封裝: 324-BGA

庫存6,304

EPM7064AEFC100-10N

Intel

IC CPLD 64MC 10NS 100FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Supplier Device Package: 100-FBGA (11x11)

封裝: 100-LBGA

庫存6,496

EPM7064AEFC100-10

Intel

IC CPLD 64MC 10NS 100FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Supplier Device Package: 100-FBGA (11x11)

封裝: 100-LBGA

庫存6,688

5SGXMA5N1F40I2WN

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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BD3450-S-LGZY

Intel

INTELCHIPSETS 3450 CHIPSET SERVE

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

FA82438MX

Intel

INTEL 430MX PCISET - 82438MX (MT

Type: -
Circuit: -
Independent Circuits: -
Current - Output High, Low: -
Voltage Supply Source: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

5AGZME3E3H29C4G

Intel

IC FPGA 342 I/O 780HBGA

Number of LABs/CLBs: 16980
Number of Logic Elements/Cells: 360000
Total RAM Bits: 23946240
Number of I/O: 342
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: -

Request a Quote

EP82562G

Intel

INTERFACE CIRCUIT, PDSO48

Protocol: -
Function: -
Interface: -
Standards: -
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 48-SSOP

封裝: -

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1SX250HU1F50E2VG

Intel

IC FPGA STRATIX 10 2397FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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AGIB022R31A1E2VB

Intel

IC FPGA AGILEX-I 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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RK80546KF1071M

Intel

XEON PROCESSOR 64-BIT

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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5AGZME5H3F35I4G

Intel

IC FPGA 534 I/O 1152FBGA

Number of LABs/CLBs: 18870
Number of Logic Elements/Cells: 400000
Total RAM Bits: 34322432
Number of I/O: 534
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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1SG250HU2F50I2VG

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5SGXMA5K1F35C1G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5ASXBB3D4F31C5G

Intel

IC SOC CORTEX-A9 800MHZ 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: -

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5SGXEA4K3F35I4G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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