頁 286 - Intel 產品 | 黑森爾電子
聯繫我們
SalesDept@heisener.com 86-755-83210559-802
登入/註冊
Language Translation

* Please refer to the English Version as our Official Version.

BOM
購物車 0

Intel 產品

記錄 9,824
頁  286/351
圖片
零件編號
製造商
描述
封裝
庫存
數量
EP1S30F780I8
Intel

IC FPGA STRATIX 780FBGA

  • Number of LABs/CLBs: 3247
  • Number of Logic Elements/Cells: 32470
  • Total RAM Bits: 3317184
  • Number of I/O: 597
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存6,288
EP20K100EQI240-3
Intel

IC FPGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: 183
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BQFP
庫存7,728
EP20K100EFC196-2
Intel

IC FPGA

  • Number of LABs/CLBs: 416
  • Number of Logic Elements/Cells: 4160
  • Total RAM Bits: 53248
  • Number of I/O: -
  • Number of Gates: 263000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 196-BGA
  • Supplier Device Package: 196-BGA
封裝: 196-BGA
庫存4,064
EP4SE530F43C2ES
Intel

IC FPGA 1120 I/O 1760FBGA

  • Number of LABs/CLBs: 21248
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 1120
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封裝: 1760-BBGA, FCBGA
庫存6,096
EP4SGX530KF43C2N
Intel

IC FPGA 880 I/O 1760FBGA

  • Number of LABs/CLBs: 21248
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 880
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封裝: 1760-BBGA, FCBGA
庫存7,120
5SGXMA7H2F35C2N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,768
5SGXEA4K3F40C2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,376
10AX090S4F45I3SG
Intel

IC FPGA 624 I/O 1932FCBGA

  • Number of LABs/CLBs: 339620
  • Number of Logic Elements/Cells: 900000
  • Total RAM Bits: 59234304
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存5,632
EP2AGX65DF25C4G
Intel

IC FPGA 252 I/O 572FBGA

  • Number of LABs/CLBs: 2530
  • Number of Logic Elements/Cells: 60214
  • Total RAM Bits: 5371904
  • Number of I/O: 252
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 572-BGA, FCBGA
  • Supplier Device Package: 572-FBGA, FC (25x25)
封裝: 572-BGA, FCBGA
庫存7,360
hot EP1C6Q240C7N
Intel

IC FPGA 185 I/O 240QFP

  • Number of LABs/CLBs: 598
  • Number of Logic Elements/Cells: 5980
  • Total RAM Bits: 92160
  • Number of I/O: 185
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存5,104
hot EP2C5Q208C8N
Intel

IC FPGA 142 I/O 208QFP

  • Number of LABs/CLBs: 288
  • Number of Logic Elements/Cells: 4608
  • Total RAM Bits: 119808
  • Number of I/O: 142
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存13,380
hot EPM7032STC44-7
Intel

IC CPLD 32MC 7.5NS 44TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 600
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
封裝: 44-TQFP
庫存8,052
EPM7128AETA100-10N
Intel

IC CPLD 128MC 10NS 100FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: -40°C ~ 130°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-FBGA (11x11)
封裝: 100-LBGA
庫存5,264
hot EPM7064AETC44-4
Intel

IC CPLD 64MC 4.5NS 44TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 4.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
封裝: 44-TQFP
庫存6,624
EPM7256AEFC100-7N
Intel

IC CPLD 256MC 7.5NS 100FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 5000
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-FBGA (11x11)
封裝: 100-LBGA
庫存6,304
EP3SL50F484C4G
Intel

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 2184192
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.86V ~ 1.15V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA, FCBGA
庫存6,608
MF28F010-25
Intel

IC FLASH 1MBIT PARALLEL

  • Memory Type: Non-Volatile
  • Memory Format: FLASH
  • Technology: FLASH
  • Memory Size: 1Mbit
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: 250ns
  • Access Time: 250 ns
  • Voltage - Supply: 4.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TC)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
NH82801CAM
Intel

ICH9

  • Protocol: -
  • Function: -
  • Interface: -
  • Standards: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
1SX110HN3F43E2VGS1
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 1100K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
Request a Quote
1SD280PT2F55I2VGS1
Intel

IC FPGA 816 I/O 2912FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 2753000
  • Total RAM Bits: 240123904
  • Number of I/O: 816
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA (55x55)
封裝: -
Request a Quote
5SGXMA5K1F40C2LG
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
EPM240T100C4TT
Intel

IC CPLD 192MC 6.1NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.1 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 240
  • Number of Macrocells: 192
  • Number of Gates: -
  • Number of I/O: 80
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: -
Request a Quote
1SX250HU3F50I2LG
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封裝: -
Request a Quote
AGIB022R31B2E2VB
Intel

IC FPGA AGILEX-I 3184BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封裝: -
Request a Quote
5SEE9F45C4G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 53248000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: -
Request a Quote
5SGSMD5H3F35I4WN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 39936000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
EP4SGX180FF35C3G
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
RB80526PY001256
Intel

MICROPROCESSOR, PENTIUM III, X86

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote