頁 270 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  270/351
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hot EP20K200CQ240C7
Intel

IC FPGA 168 I/O 240QFP

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 168
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存6,156
10M08DCF256I7G
Intel

IC FPGA 178 I/O 256FBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 178
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-LBGA
庫存3,952
hot EP1C4F400C6
Intel

IC FPGA 301 I/O 400FBGA

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 4000
  • Total RAM Bits: 78336
  • Number of I/O: 301
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
封裝: 400-BGA
庫存5,392
hot EP2C8F256C6N
Intel

IC FPGA 182 I/O 256FBGA

  • Number of LABs/CLBs: 516
  • Number of Logic Elements/Cells: 8256
  • Total RAM Bits: 165888
  • Number of I/O: 182
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-LBGA
庫存7,200
5SGXEABN2F45I2LN
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存2,944
EP4SGX290HF35C3
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: 291200
  • Total RAM Bits: 17661952
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存4,784
hot EP2S130F1020I4N
Intel

IC FPGA 742 I/O 1020FBGA

  • Number of LABs/CLBs: 6627
  • Number of Logic Elements/Cells: 132540
  • Total RAM Bits: 6747840
  • Number of I/O: 742
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封裝: 1020-BBGA
庫存4,736
10AX115R2F40E2SG
Intel

IC FPGA 342 I/O 1517FCBGA

  • Number of LABs/CLBs: 427200
  • Number of Logic Elements/Cells: 1150000
  • Total RAM Bits: 68857856
  • Number of I/O: 342
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存7,728
EP4SGX230HF35C3
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 9120
  • Number of Logic Elements/Cells: 228000
  • Total RAM Bits: 17544192
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,536
5SGXMA3H2F35I2N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,296
5SGXMA5N2F40C2LN
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存4,272
5AGXBB5D6F40C6N
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 19811
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 23625728
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA
庫存6,608
hot EP2S30F672C3
Intel

IC FPGA 500 I/O 672FBGA

  • Number of LABs/CLBs: 1694
  • Number of Logic Elements/Cells: 33880
  • Total RAM Bits: 1369728
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存5,632
EP4CGX30CF23C6
Intel

IC FPGA 290 I/O 484FBGA

  • Number of LABs/CLBs: 1840
  • Number of Logic Elements/Cells: 29440
  • Total RAM Bits: 1105920
  • Number of I/O: 290
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存3,040
EPM3064ATC100-10NA
Intel

IC CPLD 64MC 10NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 66
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: 100-TQFP
庫存7,632
hot EPM7064SLC44-10N
Intel

IC CPLD 64MC 10NS 44PLCC

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存4,144
EPM1270GT144C4N
Intel

IC CPLD 980MC 6.2NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存7,424
EP3SL50F484C3G
Intel

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 2184192
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.86V ~ 1.15V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA, FCBGA
庫存7,264
MU82645DES
Intel

REALSENSE VISION PROCESSOR D4

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存7,280
5SGXMB5R2F43I3G
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 41984000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
封裝: -
Request a Quote
AGFA008R24C2E2V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 764K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5962-9453202MYA
Intel

IC MPU 80860 33MHZ 196CQFP

  • Core Processor: 80860
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 33MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5V
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Security Features: -
  • Package / Case: 196-BCQFP Exposed Pad and Tie Bar
  • Supplier Device Package: 196-CQFP (33.91x33.91)
封裝: -
Request a Quote
RG82848P
Intel

MEMORY CONTROLLER, CMOS, PBGA932

  • Controller Type: Dynamic RAM (DRAM)
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: 932-BGA, FCBGA
  • Supplier Device Package: 932-FCBGA (37.5x37.5)
封裝: -
Request a Quote
EPM240T100I5NAJ
Intel

IC CPLD 192MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 240
  • Number of Macrocells: 192
  • Number of Gates: -
  • Number of I/O: 80
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封裝: -
Request a Quote
EP4SGX290NF45C3G
Intel

IC FPGA 920 I/O 1932FCBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXEA4K2F35C2LG
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
1SG085HN3F43E2LG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 106250
  • Number of Logic Elements/Cells: 850000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封裝: -
Request a Quote
AGFC019R31C2I2V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封裝: -
Request a Quote