頁 254 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
5ASXMB5G6F40C6N	Intel	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,448
EPF10K10TC144-4	Intel	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 72 Number of Logic Elements/Cells: 576 Total RAM Bits: 6144 Number of I/O: 102 Number of Gates: 31000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存6,528
EP1S60F1508C6	Intel	IC FPGA 1022 I/O 1508FBGA Number of LABs/CLBs: 5712 Number of Logic Elements/Cells: 57120 Total RAM Bits: 5215104 Number of I/O: 1022 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	封裝: 1508-BBGA, FCBGA	庫存7,856
10M08SAE144C8G	Intel	IC FPGA 101 I/O 144EQFP Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 101 Number of Gates: - Voltage - Supply: 2.85 V ~ 3.465 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存21,948
EP4SE820F43C4N	Intel	IC FPGA 1120 I/O 1760FBGA Number of LABs/CLBs: 32522 Number of Logic Elements/Cells: 813050 Total RAM Bits: 34093056 Number of I/O: 1120 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存2,896
EP4SGX180KF40C2	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: 7030 Number of Logic Elements/Cells: 175750 Total RAM Bits: 13954048 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,848
EP4SGX180KF40I3N	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: 7030 Number of Logic Elements/Cells: 175750 Total RAM Bits: 13954048 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,352
EP3SL150F1152I3	Intel	IC FPGA 744 I/O 1152FBGA Number of LABs/CLBs: 5700 Number of Logic Elements/Cells: 142500 Total RAM Bits: 6543360 Number of I/O: 744 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,752
5SGXEA3K3F40I3L	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,192
5SGXMA5K2F40C3N	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,872
EP3SL110F780I4LN	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 4300 Number of Logic Elements/Cells: 107500 Total RAM Bits: 4992000 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存3,856
5AGXBB1D4F40C4N	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA	庫存5,904
EP4CE22E22A7N	Intel	IC FPGA 79 I/O 144EQFP Number of LABs/CLBs: 1395 Number of Logic Elements/Cells: 22320 Total RAM Bits: 608256 Number of I/O: 79 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存5,984
10M25DAF484C7G	Intel	IC FPGA 360 I/O 484FBGA Number of LABs/CLBs: 1563 Number of Logic Elements/Cells: 25000 Total RAM Bits: 691200 Number of I/O: 360 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存4,672
10M16DCF484A7G	Intel	IC FPGA 320 I/O 484FBGA Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 16000 Total RAM Bits: 562176 Number of I/O: 320 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存6,128
EPM7064BFC100-7	Intel	IC CPLD 64MC 7.5NS 100FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.375 V ~ 2.625 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1250 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LBGA Supplier Device Package: 100-FBGA (11x11)	封裝: 100-LBGA	庫存5,424
EP4SE530H40C4G	Intel	IC FPGA 976 I/O 1517HBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGXEA4H3F35C2LG	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
AGFA008R24C2I3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGXMA9K1H40I2G	Intel	IC FPGA 696 I/O 1517HBGA Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Total RAM Bits: 53248000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-HBGA (45x45)	封裝: -	Request a Quote
1SX250HN3F43I3VG	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
1SX280HN3F43E2LGS3	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5SGXMA3K1F35C1G	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 19456000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
EP4SGX290KF40C2G	Intel	IC FPGA 744 I/O 1517FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
AGIB027R31A3I3V	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
1ST085EN2F43E2LG	Intel	IC FPGA 440 I/O 1760FBGA Number of LABs/CLBs: 106250 Number of Logic Elements/Cells: 850000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5AGZME5K2F40C3G	Intel	IC FPGA 674 I/O 1517FBGA Number of LABs/CLBs: 18870 Number of Logic Elements/Cells: 400000 Total RAM Bits: 34322432 Number of I/O: 674 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
EP4SGX530KH40C4G	Intel	IC FPGA 744 I/O 1517HBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

5ASXMB5G6F40C6N

Intel

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,448

EPF10K10TC144-4

Intel

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 72
Number of Logic Elements/Cells: 576
Total RAM Bits: 6144
Number of I/O: 102
Number of Gates: 31000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存6,528

EP1S60F1508C6

Intel

IC FPGA 1022 I/O 1508FBGA

Number of LABs/CLBs: 5712
Number of Logic Elements/Cells: 57120
Total RAM Bits: 5215104
Number of I/O: 1022
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1508-BBGA, FCBGA
Supplier Device Package: 1508-FBGA (30x30)

封裝: 1508-BBGA, FCBGA

庫存7,856

10M08SAE144C8G

Intel

IC FPGA 101 I/O 144EQFP

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 101
Number of Gates: -
Voltage - Supply: 2.85 V ~ 3.465 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存21,948

EP4SE820F43C4N

Intel

IC FPGA 1120 I/O 1760FBGA

Number of LABs/CLBs: 32522
Number of Logic Elements/Cells: 813050
Total RAM Bits: 34093056
Number of I/O: 1120
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存2,896

EP4SGX180KF40C2

Intel

IC FPGA 744 I/O 1517FBGA

Number of LABs/CLBs: 7030
Number of Logic Elements/Cells: 175750
Total RAM Bits: 13954048
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,848

EP4SGX180KF40I3N

Intel

IC FPGA 744 I/O 1517FBGA

Number of LABs/CLBs: 7030
Number of Logic Elements/Cells: 175750
Total RAM Bits: 13954048
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,352

EP3SL150F1152I3

Intel

IC FPGA 744 I/O 1152FBGA

Number of LABs/CLBs: 5700
Number of Logic Elements/Cells: 142500
Total RAM Bits: 6543360
Number of I/O: 744
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,752

5SGXEA3K3F40I3L

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 23704576
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,192

5SGXMA5K2F40C3N

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 53105664
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,872

EP3SL110F780I4LN

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 4992000
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存3,856

5AGXBB1D4F40C4N

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA

庫存5,904

EP4CE22E22A7N

Intel

IC FPGA 79 I/O 144EQFP

Number of LABs/CLBs: 1395
Number of Logic Elements/Cells: 22320
Total RAM Bits: 608256
Number of I/O: 79
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存5,984

10M25DAF484C7G

Intel

IC FPGA 360 I/O 484FBGA

Number of LABs/CLBs: 1563
Number of Logic Elements/Cells: 25000
Total RAM Bits: 691200
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存4,672

10M16DCF484A7G

Intel

IC FPGA 320 I/O 484FBGA

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 16000
Total RAM Bits: 562176
Number of I/O: 320
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存6,128

EPM7064BFC100-7

Intel

IC CPLD 64MC 7.5NS 100FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 2.375 V ~ 2.625 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1250
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Supplier Device Package: 100-FBGA (11x11)

封裝: 100-LBGA

庫存5,424

EP4SE530H40C4G

Intel

IC FPGA 976 I/O 1517HBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

5SGXEA4H3F35C2LG

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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AGFA008R24C2I3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 764K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

5SGXMA9K1H40I2G

Intel

IC FPGA 696 I/O 1517HBGA

Number of LABs/CLBs: 317000
Number of Logic Elements/Cells: 840000
Total RAM Bits: 53248000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-HBGA (45x45)

封裝: -

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1SX250HN3F43I3VG

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

Request a Quote

1SX280HN3F43E2LGS3

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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5SGXMA3K1F35C1G

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 19456000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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EP4SGX290KF40C2G

Intel

IC FPGA 744 I/O 1517FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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AGIB027R31A3I3V

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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1ST085EN2F43E2LG

Intel

IC FPGA 440 I/O 1760FBGA

Number of LABs/CLBs: 106250
Number of Logic Elements/Cells: 850000
Total RAM Bits: -
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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5AGZME5K2F40C3G

Intel

IC FPGA 674 I/O 1517FBGA

Number of LABs/CLBs: 18870
Number of Logic Elements/Cells: 400000
Total RAM Bits: 34322432
Number of I/O: 674
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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EP4SGX530KH40C4G

Intel

IC FPGA 744 I/O 1517HBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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