Intel 產品

EPC1PC8CC

Intel

IC CONFIG DEVICE

• Programmable Type: OTP
• Memory Size: 1Mb
• Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

EPF8636AQC208-2

Intel

IC FPGA 136 I/O 208QFP

• Number of LABs/CLBs: 63
• Number of Logic Elements/Cells: 504
• Total RAM Bits: -
• Number of I/O: 136
• Number of Gates: 6000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

EP20K100EBC356-1X

Intel

IC FPGA 246 I/O 356BGA

• Number of LABs/CLBs: 416
• Number of Logic Elements/Cells: 4160
• Total RAM Bits: 53248
• Number of I/O: 246
• Number of Gates: 263000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

封裝: 356-LBGA

EP1S30F1020C5N

Intel

IC FPGA 726 I/O 1020FBGA

• Number of LABs/CLBs: 3247
• Number of Logic Elements/Cells: 32470
• Total RAM Bits: 3317184
• Number of I/O: 726
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

EP1K10FI256-2N

Intel

IC FPGA 136 I/O 256FBGA

• Number of LABs/CLBs: 72
• Number of Logic Elements/Cells: 576
• Total RAM Bits: 12288
• Number of I/O: 136
• Number of Gates: 56000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BBGA

EP1C6Q240C6

Intel

IC FPGA 185 I/O 240QFP

• Number of LABs/CLBs: 598
• Number of Logic Elements/Cells: 5980
• Total RAM Bits: 92160
• Number of I/O: 185
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

5SGSMD6N2F45I2N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 54553600
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

5SGXEB5R3F43I3L

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 48927744
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

EP3SL200H780C4N

Intel

IC FPGA 488 I/O 780HBGA

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 200000
• Total RAM Bits: 10901504
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

封裝: 780-BBGA, FCBGA

EP3SE110F780C3N

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 4300
• Number of Logic Elements/Cells: 107500
• Total RAM Bits: 8936448
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

10AX090H4F34E3SG

Intel

IC FPGA 504 I/O 1152FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 504
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

10AX048E3F29E2SG

Intel

780-PIN FBGA

• Number of LABs/CLBs: 183590
• Number of Logic Elements/Cells: 480000
• Total RAM Bits: 5664768
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

10AX032E2F29I1HG

Intel

IC FPGA 360 I/O 780FBGA

• Number of LABs/CLBs: 119900
• Number of Logic Elements/Cells: 320000
• Total RAM Bits: 21040128
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

5CGXFC4F6M11C7N

Intel

IC FPGA 129 I/O 301MBGA

• Number of LABs/CLBs: 18868
• Number of Logic Elements/Cells: 50000
• Total RAM Bits: 2862080
• Number of I/O: 129
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 301-TFBGA
• Supplier Device Package: 301-MBGA (11x11)

封裝: 301-TFBGA

EPM7064BFC49-3

Intel

IC CPLD 64MC 3.5NS 49FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 3.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 41
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

EPM570GT100C3N

Intel

IC CPLD 440MC 5.4NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.4ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 570
• Number of Macrocells: 440
• Number of Gates: -
• Number of I/O: 76
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

5M240ZM100C5N

Intel

IC CPLD 192MC 7.5NS 100MBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 240
• Number of Macrocells: 192
• Number of Gates: -
• Number of I/O: 79
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-MBGA (6x6)

封裝: 100-TFBGA

EP2AGX260FF35C5G

Intel

IC FPGA 612 I/O 1152FBGA

• Number of LABs/CLBs: 10260
• Number of Logic Elements/Cells: 244188
• Total RAM Bits: 12038144
• Number of I/O: 612
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

5SGXEB5R3F40C2G

Intel

IC FPGA 432 I/O 1517FCBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-FBGA (40x40)
• Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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5SGXEB5R3F43C4G

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: -

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EWIXP460BAD

Intel

IC MPU INTEL 533MHZ PBGA544

• Core Processor: Intel® IXP45X
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: Mll (3), SMII (3)
• SATA: -
• USB: USB 1.1 (1), USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: 3DES, AES, DES, MD5, RNG, SHA1
• Package / Case: 544-BBGA
• Supplier Device Package: 544-PBGA (35x35)

封裝: -

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AGFB023R25A2E3V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

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AGIB022R31B2I3E

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

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5SGXMA3K2F35I2LG

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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RB80526RX566128

Intel

IC MPU 1 566MHZ 370PPGA

• Core Processor: Intel® Celeron®
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 566MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.7V, 1.75V
• Operating Temperature: 90°C (TC)
• Security Features: -
• Package / Case: 370-PGA
• Supplier Device Package: 370-PPGA (49x49)

封裝: -

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1SX110HN2F43E2VGS1

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 1100K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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5SEE9H40I3G

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

封裝: -

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5SGSED8N2F45I3G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 262400
• Number of Logic Elements/Cells: 695000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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