頁 226 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
10AS032E1F27E1SG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存4,176
10AS027E4F27E3LG	Intel	672-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存7,200
5CSEBA6U19C7N	Intel	IC FPGA 66 I/O 484UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存5,200
5CSEMA5U23I7N	Intel	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封裝: 672-FBGA	庫存2,720
10M40DAF256I6G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 2500 Number of Logic Elements/Cells: 40000 Total RAM Bits: 1290240 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存2,736
EP20K600EFC1020-1X	Intel	IC FPGA Number of LABs/CLBs: 2432 Number of Logic Elements/Cells: 24320 Total RAM Bits: 311296 Number of I/O: 508 Number of Gates: 1537000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: - Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存5,328
EP20K200EFI484-3	Intel	IC FPGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 376 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,344
EP3C16F256C6N	Intel	IC FPGA 168 I/O 256FBGA Number of LABs/CLBs: 963 Number of Logic Elements/Cells: 15408 Total RAM Bits: 516096 Number of I/O: 168 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存6,720
EP3SE260F1517C2N	Intel	IC FPGA 976 I/O 1517FBGA Number of LABs/CLBs: 10200 Number of Logic Elements/Cells: 255000 Total RAM Bits: 16672768 Number of I/O: 976 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,600
5SGXEB6R1F43C2L	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 61688832 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存4,656
10AX090S2F45I2LG	Intel	IC FPGA 624 I/O 1932FCBGA Number of LABs/CLBs: 339620 Number of Logic Elements/Cells: 900000 Total RAM Bits: 59234304 Number of I/O: 624 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存4,000
5SGXEA3K2F35C2N	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,100
EP2AGX95EF29C5G	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 3747 Number of Logic Elements/Cells: 89178 Total RAM Bits: 6839296 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存5,344
EP2AGX45CU17I5	Intel	IC FPGA 156 I/O 358UBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 156 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 358-LFBGA, FCBGA Supplier Device Package: 358-UBGA, FC (17x17)	封裝: 358-LFBGA, FCBGA	庫存2,864
10CL080ZF780I8G	Intel	780-PIN FBGA Number of LABs/CLBs: 5079 Number of Logic Elements/Cells: 81264 Total RAM Bits: 2810880 Number of I/O: 423 Number of Gates: - Voltage - Supply: 1.2V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BGA	庫存6,360
10M50DCF256C8G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存6,880
10CX220YU484E5G	Intel	484-PIN UBGA Number of LABs/CLBs: 80330 Number of Logic Elements/Cells: 220000 Total RAM Bits: 13752320 Number of I/O: 188 Number of Gates: - Voltage - Supply: 0.9V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-BFBGA, FCBGA	庫存5,184
5CGXBC7D7F27C8N	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BGA	庫存3,072
EP2AGX125EF35C4G	Intel	IC FPGA 452 I/O 1152FBGA Number of LABs/CLBs: 4964 Number of Logic Elements/Cells: 118143 Total RAM Bits: 8315904 Number of I/O: 452 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,160
FAGD16556100BA	Intel	TRANSPONDER CHIP SET 100PIN TQFP Type: - Circuit: - Independent Circuits: - Current - Output High, Low: - Voltage Supply Source: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGSMD8K3F40I4G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
FH8065301685598S-R1UB	Intel	FH8065301685598S - INTEL ATOM Z3 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
1SG250HN1F43E2VG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
1SX280LN2F43E2VGS2	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
RPIXP2800BA	Intel	IC MPU IXP2800 1GHZ 1356FCBGA Core Processor: Intel® IXP2800 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: - RAM Controllers: SRAM Graphics Acceleration: No Display & Interface Controllers: LVDS Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: 3DES, AES, SHA-1 Package / Case: 1356-BBGA, FCBGA Supplier Device Package: 1356-FCBGA (37.5x37.5)	封裝: -	Request a Quote
LE80536GE0302M	Intel	DOTHAN, PENTIUM M PROCESSOR, X86 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGXMA5N2F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
1SG085HN3F43I2LG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 106250 Number of Logic Elements/Cells: 850000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote

10AS032E1F27E1SG

Intel

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存4,176

10AS027E4F27E3LG

Intel

672-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,200

5CSEBA6U19C7N

Intel

IC FPGA 66 I/O 484UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存5,200

5CSEMA5U23I7N

Intel

IC FPGA 145 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封裝: 672-FBGA

庫存2,720

10M40DAF256I6G

Intel

IC FPGA 178 I/O 256FBGA

Number of LABs/CLBs: 2500
Number of Logic Elements/Cells: 40000
Total RAM Bits: 1290240
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存2,736

EP20K600EFC1020-1X

Intel

IC FPGA

Number of LABs/CLBs: 2432
Number of Logic Elements/Cells: 24320
Total RAM Bits: 311296
Number of I/O: 508
Number of Gates: 1537000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: -
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,328

EP20K200EFI484-3

Intel

IC FPGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 376
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,344

EP3C16F256C6N

Intel

IC FPGA 168 I/O 256FBGA

Number of LABs/CLBs: 963
Number of Logic Elements/Cells: 15408
Total RAM Bits: 516096
Number of I/O: 168
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存6,720

EP3SE260F1517C2N

Intel

IC FPGA 976 I/O 1517FBGA

Number of LABs/CLBs: 10200
Number of Logic Elements/Cells: 255000
Total RAM Bits: 16672768
Number of I/O: 976
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,600

5SGXEB6R1F43C2L

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 61688832
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存4,656

10AX090S2F45I2LG

Intel

IC FPGA 624 I/O 1932FCBGA

Number of LABs/CLBs: 339620
Number of Logic Elements/Cells: 900000
Total RAM Bits: 59234304
Number of I/O: 624
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存4,000

5SGXEA3K2F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 23704576
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,100

EP2AGX95EF29C5G

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 3747
Number of Logic Elements/Cells: 89178
Total RAM Bits: 6839296
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存5,344

EP2AGX45CU17I5

Intel

IC FPGA 156 I/O 358UBGA

Number of LABs/CLBs: 1805
Number of Logic Elements/Cells: 42959
Total RAM Bits: 3517440
Number of I/O: 156
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 358-LFBGA, FCBGA
Supplier Device Package: 358-UBGA, FC (17x17)

封裝: 358-LFBGA, FCBGA

庫存2,864

10CL080ZF780I8G

Intel

780-PIN FBGA

Number of LABs/CLBs: 5079
Number of Logic Elements/Cells: 81264
Total RAM Bits: 2810880
Number of I/O: 423
Number of Gates: -
Voltage - Supply: 1.2V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BGA

庫存6,360

10M50DCF256C8G

Intel

IC FPGA 178 I/O 256FBGA

Number of LABs/CLBs: 3125
Number of Logic Elements/Cells: 50000
Total RAM Bits: 1677312
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存6,880

10CX220YU484E5G

Intel

484-PIN UBGA

Number of LABs/CLBs: 80330
Number of Logic Elements/Cells: 220000
Total RAM Bits: 13752320
Number of I/O: 188
Number of Gates: -
Voltage - Supply: 0.9V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BFBGA, FCBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-BFBGA, FCBGA

庫存5,184

5CGXBC7D7F27C8N

Intel

IC FPGA 336 I/O 672FBGA

Number of LABs/CLBs: 56480
Number of Logic Elements/Cells: 149500
Total RAM Bits: 7880704
Number of I/O: 336
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BGA

庫存3,072

EP2AGX125EF35C4G

Intel

IC FPGA 452 I/O 1152FBGA

Number of LABs/CLBs: 4964
Number of Logic Elements/Cells: 118143
Total RAM Bits: 8315904
Number of I/O: 452
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,160

FAGD16556100BA

Intel

TRANSPONDER CHIP SET 100PIN TQFP

Type: -
Circuit: -
Independent Circuits: -
Current - Output High, Low: -
Voltage Supply Source: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

5SGSMD8K3F40I4G

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

Request a Quote

FH8065301685598S-R1UB

Intel

FH8065301685598S - INTEL ATOM Z3

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

1SG250HN1F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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1SX280LN2F43E2VGS2

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

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RPIXP2800BA

Intel

IC MPU IXP2800 1GHZ 1356FCBGA

Core Processor: Intel® IXP2800
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1GHz
Co-Processors/DSP: -
RAM Controllers: SRAM
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 85°C
Security Features: 3DES, AES, SHA-1
Package / Case: 1356-BBGA, FCBGA
Supplier Device Package: 1356-FCBGA (37.5x37.5)

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LE80536GE0302M

Intel

DOTHAN, PENTIUM M PROCESSOR, X86

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

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5SGXMA5N2F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

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1SG085HN3F43I2LG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 106250
Number of Logic Elements/Cells: 850000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

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