頁 173 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
1SX250LU3F50I1VG	Intel	2397-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2500K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存7,840
1SX280LN3F43E3VG	Intel	1760-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存4,352
5ASXFB3H6F40C6N	Intel	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存6,720
EP2A70B724C9	Intel	IC FPGA 540 I/O 724BGA Number of LABs/CLBs: 6720 Number of Logic Elements/Cells: 67200 Total RAM Bits: 1146880 Number of I/O: 540 Number of Gates: 5250000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 724-BBGA, FCBGA Supplier Device Package: 724-BGA (35x35)	封裝: 724-BBGA, FCBGA	庫存3,248
EP2SGX60CF484I4	Intel	IC FPGA 291 I/O 484FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 291 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存7,312
EPF10K30RC208-4N	Intel	IC FPGA 147 I/O 208RQFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 1728 Total RAM Bits: 12288 Number of I/O: 147 Number of Gates: 69000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-RQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存11,748
EP4SGX530KF43C2	Intel	IC FPGA 880 I/O 1760FBGA Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Total RAM Bits: 28033024 Number of I/O: 880 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA, FC (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存7,824
EP4S40G2F40I2	Intel	IC FPGA 654 I/O 1517FBGA Number of LABs/CLBs: 9120 Number of Logic Elements/Cells: 228000 Total RAM Bits: 17544192 Number of I/O: 654 Number of Gates: - Voltage - Supply: 0.92 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,920
10AX032E3F29E2SG	Intel	780-PIN FBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存2,992
EP1SGX25DF672C7	Intel	IC FPGA 455 I/O 672FBGA Number of LABs/CLBs: 2566 Number of Logic Elements/Cells: 25660 Total RAM Bits: 1944576 Number of I/O: 455 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存3,952
10M40SCE144A7G	Intel	IC FPGA 101 I/O 144EQFP Number of LABs/CLBs: 2500 Number of Logic Elements/Cells: 40000 Total RAM Bits: 1290240 Number of I/O: 101 Number of Gates: - Voltage - Supply: 2.85 V ~ 3.465 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-EQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存6,368
EP1C6F256C6	Intel	IC FPGA 185 I/O 256FBGA Number of LABs/CLBs: 598 Number of Logic Elements/Cells: 5980 Total RAM Bits: 92160 Number of I/O: 185 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存4,320
EPM7512AEBC256-12	Intel	IC CPLD 512MC 12NS 256BGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 10000 Number of I/O: 212 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-BGA (27x27)	封裝: 256-LBGA	庫存3,808
EP2AGX45DF29I3NAD	Intel	IC FPGA 364 I/O 780FBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 364 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存3,024
EP2AGX190EF29C4G	Intel	IC FPGA 372 I/O 780FBGA Number of LABs/CLBs: 7612 Number of Logic Elements/Cells: 181165 Total RAM Bits: 10177536 Number of I/O: 372 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存2,736
AGIB022R31A1I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
1SG110HN1F43E2VG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 137500 Number of Logic Elements/Cells: 1100000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5SGXMB6R2F40C2G	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
EP4SE820F43C4G	Intel	IC FPGA 1120 I/O 1760FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
AGFB027R31C2E2V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
WPIXP2350ACT	Intel	WESTPORT NETWORK PROCESSOR Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
TE28F008S3150	Intel	IC FLASH 8MBIT PARALLEL 40TSOP Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - NOR (SLC) Memory Size: 8Mbit Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: - Access Time: 150 ns Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 40-TFSOP (0.724", 18.40mm Width) Supplier Device Package: 40-TSOP	封裝: -	Request a Quote
N82C08-8	Intel	DRAM CONTROLLER, 1M X 8 PQCC68 Controller Type: Dynamic RAM (DRAM) Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC	封裝: -	Request a Quote
5SGXMA7K2F35I2WN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
1ST085EN3F43E3VG	Intel	IC FPGA 440 I/O 1760FBGA Number of LABs/CLBs: 106250 Number of Logic Elements/Cells: 850000 Total RAM Bits: - Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
5SGSMD6N2F45C2G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
5SGSED6N3F45C4G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 46080000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
5SGSMD4H2F35I3G	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Total RAM Bits: 19456000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote

1SX250LU3F50I1VG

Intel

2397-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,840

1SX280LN3F43E3VG

Intel

1760-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,352

5ASXFB3H6F40C6N

Intel

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存6,720

EP2A70B724C9

Intel

IC FPGA 540 I/O 724BGA

Number of LABs/CLBs: 6720
Number of Logic Elements/Cells: 67200
Total RAM Bits: 1146880
Number of I/O: 540
Number of Gates: 5250000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 724-BBGA, FCBGA
Supplier Device Package: 724-BGA (35x35)

封裝: 724-BBGA, FCBGA

庫存3,248

EP2SGX60CF484I4

Intel

IC FPGA 291 I/O 484FBGA

Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 291
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存7,312

EPF10K30RC208-4N

Intel

IC FPGA 147 I/O 208RQFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 1728
Total RAM Bits: 12288
Number of I/O: 147
Number of Gates: 69000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-RQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存11,748

EP4SGX530KF43C2

Intel

IC FPGA 880 I/O 1760FBGA

Number of LABs/CLBs: 21248
Number of Logic Elements/Cells: 531200
Total RAM Bits: 28033024
Number of I/O: 880
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存7,824

EP4S40G2F40I2

Intel

IC FPGA 654 I/O 1517FBGA

Number of LABs/CLBs: 9120
Number of Logic Elements/Cells: 228000
Total RAM Bits: 17544192
Number of I/O: 654
Number of Gates: -
Voltage - Supply: 0.92 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,920

10AX032E3F29E2SG

Intel

780-PIN FBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存2,992

EP1SGX25DF672C7

Intel

IC FPGA 455 I/O 672FBGA

Number of LABs/CLBs: 2566
Number of Logic Elements/Cells: 25660
Total RAM Bits: 1944576
Number of I/O: 455
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存3,952

10M40SCE144A7G

Intel

IC FPGA 101 I/O 144EQFP

Number of LABs/CLBs: 2500
Number of Logic Elements/Cells: 40000
Total RAM Bits: 1290240
Number of I/O: 101
Number of Gates: -
Voltage - Supply: 2.85 V ~ 3.465 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-EQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存6,368

EP1C6F256C6

Intel

IC FPGA 185 I/O 256FBGA

Number of LABs/CLBs: 598
Number of Logic Elements/Cells: 5980
Total RAM Bits: 92160
Number of I/O: 185
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存4,320

EPM7512AEBC256-12

Intel

IC CPLD 512MC 12NS 256BGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 12.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 10000
Number of I/O: 212
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-BGA (27x27)

封裝: 256-LBGA

庫存3,808

EP2AGX45DF29I3NAD

Intel

IC FPGA 364 I/O 780FBGA

Number of LABs/CLBs: 1805
Number of Logic Elements/Cells: 42959
Total RAM Bits: 3517440
Number of I/O: 364
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存3,024

EP2AGX190EF29C4G

Intel

IC FPGA 372 I/O 780FBGA

Number of LABs/CLBs: 7612
Number of Logic Elements/Cells: 181165
Total RAM Bits: 10177536
Number of I/O: 372
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存2,736

AGIB022R31A1I2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

Request a Quote

1SG110HN1F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 137500
Number of Logic Elements/Cells: 1100000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

Request a Quote

5SGXMB6R2F40C2G

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-FBGA (40x40)
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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EP4SE820F43C4G

Intel

IC FPGA 1120 I/O 1760FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

AGFB027R31C2E2V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

WPIXP2350ACT

Intel

WESTPORT NETWORK PROCESSOR

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

TE28F008S3150

Intel

IC FLASH 8MBIT PARALLEL 40TSOP

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NOR (SLC)
Memory Size: 8Mbit
Memory Interface: Parallel
Clock Frequency: -
Write Cycle Time - Word, Page: -
Access Time: 150 ns
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Supplier Device Package: 40-TSOP

封裝: -

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N82C08-8

Intel

DRAM CONTROLLER, 1M X 8 PQCC68

Controller Type: Dynamic RAM (DRAM)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC

封裝: -

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5SGXMA7K2F35I2WN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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1ST085EN3F43E3VG

Intel

IC FPGA 440 I/O 1760FBGA

Number of LABs/CLBs: 106250
Number of Logic Elements/Cells: 850000
Total RAM Bits: -
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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5SGSMD6N2F45C2G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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5SGSED6N3F45C4G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 46080000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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5SGSMD4H2F35I3G

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 135840
Number of Logic Elements/Cells: 360000
Total RAM Bits: 19456000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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