頁 149 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  149/351
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10AS066K3F35I2SGES
Intel

IC SOC FPGA 396 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存7,808
EPF10K50VQC240-3AA
Intel

IC FPGA

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 20480
  • Number of I/O: 189
  • Number of Gates: 116000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BQFP
庫存4,912
hot EP3C16E144I7N
Intel

IC FPGA 84 I/O 144EQFP

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 84
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-EQFP (20x20)
封裝: 144-LQFP Exposed Pad
庫存7,164
EP1K30QC208-1
Intel

IC FPGA 147 I/O 208QFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 147
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存3,232
5SGXMB6R2F40C2N
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 61688832
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存6,848
5SGXEA7N2F45C2N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存7,472
5SGXEA7K2F35C2
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,608
5SGXMBBR3H43C4N
Intel

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
封裝: 1760-BBGA, FCBGA
庫存6,960
5SGXEA5H3F35C2N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存3,808
10AX066K1F35I1HG
Intel

IC FPGA 396 I/O 1152FCBGA

  • Number of LABs/CLBs: 250540
  • Number of Logic Elements/Cells: 660000
  • Total RAM Bits: 49610752
  • Number of I/O: 492
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,960
10AX057N2F40E2LG
Intel

IC FPGA 588 I/O 1517FCBGA

  • Number of LABs/CLBs: 217080
  • Number of Logic Elements/Cells: 570000
  • Total RAM Bits: 42082304
  • Number of I/O: 588
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存2,704
5SGXMABK2H40I2N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封裝: 1517-BBGA, FCBGA
庫存3,584
EP3CLS150F484C7
Intel

IC FPGA 210 I/O 484FBGA

  • Number of LABs/CLBs: 9428
  • Number of Logic Elements/Cells: 150848
  • Total RAM Bits: 6137856
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存4,304
5CGXFC4F6M11C6N
Intel

IC FPGA 129 I/O 301MBGA

  • Number of LABs/CLBs: 18868
  • Number of Logic Elements/Cells: 50000
  • Total RAM Bits: 2862080
  • Number of I/O: 129
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 301-TFBGA
  • Supplier Device Package: 301-MBGA (11x11)
封裝: 301-TFBGA
庫存3,344
EP3C16U256C8
Intel

IC FPGA 168 I/O 256UBGA

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 168
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LFBGA
  • Supplier Device Package: 256-UBGA (14x14)
封裝: 256-LFBGA
庫存5,584
EPM1270T144C4
Intel

IC CPLD 980MC 6.2NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存5,456
hot EPM1270F256C3N
Intel

IC CPLD 980MC 6.2NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存6,648
5AGXBA5D6F35C6G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 8962
  • Number of Logic Elements/Cells: 190000
  • Total RAM Bits: 13284352
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存6,192
A5EC065BB23AE5SR0
Intel

IC

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
AGIA035R39A1I2VB
Intel

IC FPGA AGILEX-I 3948FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 3.54M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
封裝: -
Request a Quote
5SGSMD4K2F40C1WN
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 19456000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
5SGXEA4K3F40C3G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
EP3SE260H780I3G
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
AGFA019R24C3I3E
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
10M16SLY180I8G
Intel

IC FPGA 125 I/O MAX10 180WLCSP

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 16000
  • Total RAM Bits: 562176
  • Number of I/O: 125
  • Number of Gates: -
  • Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 180-UFBGA, WLCSP
  • Supplier Device Package: 180-YBGA (6.08x5.09)
封裝: -
庫存5,790
5SGSMD3H2F35C1G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 13312000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
AGFC023R25A2I2V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
1SG280HH3F55I3XG
Intel

IC FPGA 1160 I/O 2912BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 1160
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封裝: -
Request a Quote