Intel 產品

EY1603TI-ADJ

Intel

IC REG LIN POS ADJ 14HTSSOP

• Output Configuration: Positive
• Output Type: Adjustable
• Number of Regulators: 1
• Voltage - Input (Max): 40V
• Voltage - Output (Min/Fixed): 1.223V
• Voltage - Output (Max): 12V
• Voltage Dropout (Max): 0.46V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): 24µA
• Current - Supply (Max): 125µA
• PSRR: 66dB (100Hz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
• Supplier Device Package: 14-HTSSOP

封裝: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad

EP20K600EBC652-1

Intel

IC FPGA 488 I/O 652BGA

• Number of LABs/CLBs: 2432
• Number of Logic Elements/Cells: 24320
• Total RAM Bits: 311296
• Number of I/O: 488
• Number of Gates: 1537000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 652-BBGA
• Supplier Device Package: 652-BGA (45x45)

封裝: 652-BBGA

EP20K160EQC208-2N

Intel

IC FPGA 143 I/O 208QFP

• Number of LABs/CLBs: 640
• Number of Logic Elements/Cells: 6400
• Total RAM Bits: 81920
• Number of I/O: 143
• Number of Gates: 404000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

EPF8452ATC100-4N

Intel

IC FPGA 68 I/O 100TQFP

• Number of LABs/CLBs: 42
• Number of Logic Elements/Cells: 336
• Total RAM Bits: -
• Number of I/O: 68
• Number of Gates: 4000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

EP4S100G3F45I1

Intel

IC FPGA 781 I/O 1932FBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: 291200
• Total RAM Bits: 17661952
• Number of I/O: 781
• Number of Gates: -
• Voltage - Supply: 0.92 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

EP4SGX530HH35C3

Intel

IC FPGA 564 I/O 1152HBGA

• Number of LABs/CLBs: 21248
• Number of Logic Elements/Cells: 531200
• Total RAM Bits: 28033024
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-HBGA, FC (42.5x42.5)

封裝: 1152-BBGA, FCBGA

5SGXMA7N2F45C2

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

5SGXEB5R3F43C2L

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 48927744
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

封裝: 1760-BBGA, FCBGA

10AX115N2F45E1SG

Intel

IC FPGA 768 I/O 1932FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

5SGXMA7K2F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

EP4SGX230HF35I3N

Intel

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: 9120
• Number of Logic Elements/Cells: 228000
• Total RAM Bits: 17544192
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

5SGSED6K3F40C3N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 54553600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

5SGXEA7N3F45C3N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

EP2S130F1020C5

Intel

IC FPGA 742 I/O 1020FBGA

• Number of LABs/CLBs: 6627
• Number of Logic Elements/Cells: 132540
• Total RAM Bits: 6747840
• Number of I/O: 742
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

封裝: 1020-BBGA

10AX032H1F35E1HG

Intel

IC FPGA 384 I/O 1152FCBGA

• Number of LABs/CLBs: 119900
• Number of Logic Elements/Cells: 320000
• Total RAM Bits: 21040128
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

EP3SE80F780C4

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 3200
• Number of Logic Elements/Cells: 80000
• Total RAM Bits: 6843392
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

EP2C50F672I8N

Intel

IC FPGA 450 I/O 672FBGA

• Number of LABs/CLBs: 3158
• Number of Logic Elements/Cells: 50528
• Total RAM Bits: 594432
• Number of I/O: 450
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BGA
• Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BGA

EP1C12F256C6

Intel

IC FPGA 185 I/O 256FBGA

• Number of LABs/CLBs: 1206
• Number of Logic Elements/Cells: 12060
• Total RAM Bits: 239616
• Number of I/O: 185
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

EPM240ZM100C7N

Intel

IC CPLD 192MC 7.5NS 100MBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 240
• Number of Macrocells: 192
• Number of Gates: -
• Number of I/O: 80
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-MBGA (6x6)

封裝: 100-TFBGA

5AGXMA3D4F27I3G

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 7362
• Number of Logic Elements/Cells: 156000
• Total RAM Bits: 11746304
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.12V ~ 1.18V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

AGFA008R16A2E3V

Intel

IC FPGA AGILEX-F 1546FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

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5SGSED6K1F40C2G

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 46080000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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AGIC035R39A2I3E

Intel

IC FPGA AGILEX-I 3948FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 3.54M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

封裝: -

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1SG210HU3F50E2VG

Intel

IC FPGA 704 I/O 2397BGA

• Number of LABs/CLBs: 262500
• Number of Logic Elements/Cells: 2100000
• Total RAM Bits: -
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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AGID023R31B2E2V

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

封裝: -

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5SGXMABK3H40C3G

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 53248000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

封裝: -

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1SG250HU3F50E3VG

Intel

IC FPGA 704 I/O 2397BGA

• Number of LABs/CLBs: 312500
• Number of Logic Elements/Cells: 2500000
• Total RAM Bits: -
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5SGXMA5H2F35I3WN

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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