頁 94 - 專用型 IC | 積體電路 (IC) | 黑森爾電子
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專用型 IC

記錄 2,935
頁  94/105
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零件編號
製造商
描述
封裝
庫存
數量
Applications
Mounting Type
Package / Case
Supplier Device Package
TDA3653B/N2,112
NXP

IC VERT DEFLECT 9-SIL

  • Type: -
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 9-SIP Exposed Tab
  • Supplier Device Package: 9-SIL MPF
封裝: 9-SIP Exposed Tab
庫存7,024
-
Surface Mount
9-SIP Exposed Tab
9-SIL MPF
TDA8351/N6,112
NXP

IC DC COUPLED V-DEFL 9-SIL

  • Type: -
  • Applications: -
  • Mounting Type: Through Hole
  • Package / Case: 9-SIP
  • Supplier Device Package: 9-SIL
封裝: 9-SIP
庫存7,872
-
Through Hole
9-SIP
9-SIL
TSI578A-10GILV
IDT, Integrated Device Technology Inc

IC SWITCH RIO

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存7,456
-
-
-
-
80HCPS1616CHMG
IDT, Integrated Device Technology Inc

IC RIO SWITCH GEN2 400FCBGA

  • Type: Serial RapidIO? Switch
  • Applications: Wireless Infrastructure
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA, FCBGA
  • Supplier Device Package: 400-FBGA (21x21)
封裝: 400-BBGA, FCBGA
庫存6,192
Wireless Infrastructure
Surface Mount
400-BBGA, FCBGA
400-FBGA (21x21)
XCMECH-FF1136
Xilinx Inc.

FF1136 MECHANICAL SAMPLE

  • Type: Mechanical Sample
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存6,816
-
-
-
-
AD9963BCPZRL
Analog Devices Inc.

IC DAC DUAL 16BIT 72LFCSP

  • Type: Broadband Front-End
  • Applications: Wireless Networking
  • Mounting Type: Surface Mount
  • Package / Case: 72-VFQFN Exposed Pad, CSP
  • Supplier Device Package: 72-LFCSP-VQ (10x10)
封裝: 72-VFQFN Exposed Pad, CSP
庫存4,336
Wireless Networking
Surface Mount
72-VFQFN Exposed Pad, CSP
72-LFCSP-VQ (10x10)
CAP016DG-TL
Power Integrations

IC CAPZERO 1000V 2000NF 8-SOIC

  • Type: Capacitor Discharge
  • Applications: Converter, ACDC
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
封裝: 8-SOIC (0.154", 3.90mm Width)
庫存3,344
Converter, ACDC
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SO
MCP2036T-I/SL
Microchip Technology

IC KEYLESS ENTRY AFE 14-SOIC

  • Type: Sensor Interface
  • Applications: Analog I/O
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SOIC
封裝: 14-SOIC (0.154", 3.90mm Width)
庫存4,672
Analog I/O
Surface Mount
14-SOIC (0.154", 3.90mm Width)
14-SOIC
hot MAX4840EXT+T
Maxim Integrated

IC CTLR OVP 5.8V SC70-6

  • Type: Overvoltage Protection Controller
  • Applications: Cell Phones, Digital Cameras, Media Players
  • Mounting Type: Surface Mount
  • Package / Case: 6-TSSOP, SC-88, SOT-363
  • Supplier Device Package: SC-70-6
封裝: 6-TSSOP, SC-88, SOT-363
庫存1,025,772
Cell Phones, Digital Cameras, Media Players
Surface Mount
6-TSSOP, SC-88, SOT-363
SC-70-6
DS2411P+T&R
Maxim Integrated

IC SILICON SERIAL NUMBER 6TSOC

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 6-LSOJ (0.148", 3.76mm Width)
  • Supplier Device Package: 6-TSOC
封裝: 6-LSOJ (0.148", 3.76mm Width)
庫存6,000
PCB, Network Node, Equipment Identification/Registration
Surface Mount
6-LSOJ (0.148", 3.76mm Width)
6-TSOC
DLP230GPAFQP
Texas Instruments

IC DLP CTLR DLP2010

  • Type: Digital Micromirror Device (DMD)
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: -
  • Supplier Device Package: 54-CLGA (16.8x5.92)
封裝: -
庫存5,600
-
Surface Mount
-
54-CLGA (16.8x5.92)
MAX4944ELA+TGC7
Maxim Integrated

INTEGRATED CIRCUIT

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存6,080
-
-
-
-
BCM75835NCKFEBA03G
Broadcom Limited

SOC SET TOP BOX IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存4,784
-
-
-
-
BCM75831ZZKFEB03G
Broadcom Limited

SOC SET TOP BOX IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存2,928
-
-
-
-
ST2100TR
STMicroelectronics

IC BROADBAND FRONT-END 373TFBGA

  • Type: Broadband Front-End
  • Applications: Power Line Communications
  • Mounting Type: Surface Mount
  • Package / Case: 373-TFBGA
  • Supplier Device Package: 373-TFBGA (12x12)
封裝: 373-TFBGA
庫存7,920
Power Line Communications
Surface Mount
373-TFBGA
373-TFBGA (12x12)
LTC4331IUFD#PBF
Linear Technology

I2C SLAVE EXTEND OVER DIFFERENTI

  • Type: Differential Link
  • Applications: Industrial, Lighting
  • Mounting Type: Surface Mount
  • Package / Case: 20-WFQFN Exposed Pad
  • Supplier Device Package: 20-QFN (5x4)
封裝: 20-WFQFN Exposed Pad
庫存2,848
Industrial, Lighting
Surface Mount
20-WFQFN Exposed Pad
20-QFN (5x4)
DS28E83Q+T
Maxim Integrated

1-WIRE 5K RAD SECURE AUTHENTICAT

  • Type: Authentication Chip
  • Applications: Medical
  • Mounting Type: Surface Mount
  • Package / Case: 6-WDFN Exposed Pad
  • Supplier Device Package: 6-TDFN-EP (3x3)
封裝: 6-WDFN Exposed Pad
庫存5,520
Medical
Surface Mount
6-WDFN Exposed Pad
6-TDFN-EP (3x3)
ATECC608B-MAVDA-S
Microchip Technology

IC AUTHENTICATION CHIP 8UDFN

  • Type: Authentication Chip
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 8-UFDFN Exposed Pad
  • Supplier Device Package: 8-UDFN (2x3)
封裝: -
庫存24,828
-
Surface Mount
8-UFDFN Exposed Pad
8-UDFN (2x3)
090-03240-003
Microchip Technology

IC EMBEDDED ATOMIC CLK

  • Type: Embedded Atomic Clocks
  • Applications: -
  • Mounting Type: Through Hole
  • Package / Case: 12-DIP Module, 9 Leads
  • Supplier Device Package: -
封裝: -
Request a Quote
-
Through Hole
12-DIP Module, 9 Leads
-
DLP800REA0FYV
Texas Instruments

IC DIG MICROMIRROR DEV 350CPGA

  • Type: Digital Micromirror Device (DMD)
  • Applications: -
  • Mounting Type: Through Hole
  • Package / Case: 350-BFCPGA
  • Supplier Device Package: 350-CPGA (35x32.2)
封裝: -
Request a Quote
-
Through Hole
350-BFCPGA
350-CPGA (35x32.2)
MAX22516AWO-T
Analog Devices Inc./Maxim Integrated

IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
KSZ8999I-GL
Microchip Technology

IC

  • Type: 10/100 Integrated Switch
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: -
Request a Quote
-
Surface Mount
208-BFQFP
208-PQFP (28x28)
DS3650B
Analog Devices Inc./Maxim Integrated

IC DEEPCOVER 16CSBGA

  • Type: DeepCover
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 16-LBGA, CSPBGA
  • Supplier Device Package: 16-CSBGA (4x4)
封裝: -
Request a Quote
-
Surface Mount
16-LBGA, CSPBGA
16-CSBGA (4x4)
VT225FCR-ADJ
Analog Devices Inc./Maxim Integrated

VT225FCR-ADJ

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
HFA3824IV96
Harris Corporation

IC SPREAD SPECT PROC 48TQFP

  • Type: Direct Sequence Spread Spectrum Baseband Processor
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP (7x7)
封裝: -
Request a Quote
-
Surface Mount
48-TQFP
48-TQFP (7x7)
LS7084N
LSI/CSI

IC CLOCK CONVERTER 8DIP

  • Type: Clock Converter
  • Applications: Interface
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-DIP
封裝: -
Request a Quote
Interface
Through Hole
8-DIP (0.300", 7.62mm)
8-DIP
ATECC608C-SSHCZ-T
Microchip Technology

ECC/ECDH, SWI, SOIC T/R

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-
HD6473847RFV
Renesas Electronics Corporation

HD6473847 - H8/300L SLP MICROCON

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
-
-
-
-