圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC XPHASE W/FAULT DET 20L-MLPQ
|
封裝: 20-VFQFN Exposed Pad |
庫存37,896 |
|
10mA | 8.4 V ~ 14 V | 0°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-MLPQ (4x4) |
||
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48
|
封裝: - |
庫存7,904 |
|
7mA | 3.5 V ~ 28 V | -40°C ~ 125°C | - | - | - |
||
ON Semiconductor |
IC LDO ANA MULTIPLE OUTPUT 20DFN
|
封裝: 20-VFDFN Exposed Pad |
庫存3,872 |
|
34µA | 7 V ~ 18 V | -40°C ~ 150°C | Surface Mount | 20-VFDFN Exposed Pad | 20-DFN (6x5) |
||
Intersil |
IC REG/CTRLR ACPI DUAL DDR 28QFN
|
封裝: 28-VQFN Exposed Pad |
庫存4,896 |
|
7mA | - | 0°C ~ 70°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Linear Technology |
IC PROGRAMMER VOLT SMBUS 16SSOP
|
封裝: 16-SSOP (0.154", 3.90mm Width) |
庫存2,960 |
|
350µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-SSOP |
||
Texas Instruments |
IC PWR MGMT E INK 48VQFN
|
封裝: - |
庫存5,648 |
|
5.5mA | 3 V ~ 6 V | -10°C ~ 85°C | - | - | - |
||
NXP |
IC SYSTEM BASIS CHIP 32LQFP
|
封裝: 32-LQFP |
庫存5,456 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 125°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
封裝: - |
庫存3,760 |
|
- | - | - | - | - | - |
||
ams |
IC PMU CHARGER 17WLP
|
封裝: 17-UFBGA, WLCSP |
庫存14,652 |
|
26µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 17-UFBGA, WLCSP | 17-WLCSP (2.17x1.85) |
||
Texas Instruments |
IC PMU 2CH CONV/LDO 32QFN
|
封裝: 32-WFQFN Exposed Pad |
庫存12,948 |
|
- | 2.3 V ~ 5.6 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-QFN (4x4) |
||
Texas Instruments |
IC LOAD SHARE CTRLR ADV 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存39,360 |
|
2.5mA | 4.375 V ~ 14.25 V | -40°C ~ 105°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC HEATER CONTROLLER 16SOIC
|
封裝: - |
庫存5,376 |
|
- | - | - | - | - | - |
||
Renesas Electronics America |
IC PMIC XSCALE REG 20-QFN
|
封裝: 20-VFQFN Exposed Pad |
庫存6,864 |
|
380µA | 2.76 V ~ 5.5 V | -25°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) |
||
Diodes Incorporated |
IRON CONTROLLER DIP-8
|
封裝: - |
庫存5,808 |
|
400µA | 4.5 V ~ 5.5 V | -10°C ~ 85°C (TA) | - | - | - |
||
Dialog Semiconductor GmbH |
CMIC, 1 HZ INTERRUPT GENERATOR
|
封裝: 8-WFDFN Exposed Pad |
庫存25,074 |
|
30µA | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x2) |
||
IDT, Integrated Device Technology Inc |
IC TRANSMITTER 48VFQFPN
|
封裝: - |
庫存2,944 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS
|
封裝: 52-UFBGA, WLCSP |
庫存7,104 |
|
3mA | 1.62V ~ 1.98V, 4.5V ~ 5.5V | 0°C ~ 85°C (TA) | Surface Mount | 52-UFBGA, WLCSP | 52-WLCSP (2.64x3.94) |
||
Texas Instruments |
PROTOTYPE
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
MIXED SIGNAL POWER MANAGEMENT
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
封裝: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
STMicroelectronics |
DISCRETE
|
封裝: - |
庫存14,982 |
|
- | - | - | Surface Mount | 90-BGA, FCBGA | 90-FCBGA (4.3x3.9) |
||
Analog Devices Inc./Maxim Integrated |
DCDC & HOST-CHARGE EMULATOR WITH
|
封裝: - |
Request a Quote |
|
28mA | 4.5V ~ 28V | -40°C ~ 125°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
NXP |
AUTO SBC
|
封裝: - |
Request a Quote |
|
30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
封裝: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Diodes Incorporated |
USB POWER SWITCH W-QFN3040-20 T&
|
封裝: - |
庫存17,892 |
|
160µA | 4.5V ~ 6.5V | -40°C ~ 85°C (TA) | Surface Mount | 20-WFQFN Exposed Pad | W-QFN3040-20 Type A1 |
||
Analog Devices Inc./Maxim Integrated |
IC INTEGRATED CIRCUIT
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
IC
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
IC PMIC MOBILE MULTI-CORE
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - |