圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
NOR
|
封裝: - |
庫存7,520 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 8KBIT 25NS 52PLCC
|
封裝: 52-LCC (J-Lead) |
庫存7,936 |
|
SRAM | SRAM - Dual Port, Asynchronous | 8Kb (1K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 6GBIT 137VFBGA
|
封裝: 137-VFBGA |
庫存5,840 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 4Gb (512M x 8)(NAND), 2Gb (64M x 32)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 137-VFBGA | 137-VFBGA (13x10.5) |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8TSSOP
|
封裝: 8-TSSOP (0.173", 4.40mm Width) |
庫存4,752 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 333MHZ 60FBGA
|
封裝: 60-TFBGA |
庫存4,320 |
|
DRAM | SDRAM - DDR2 | 1Gb (256M x 4) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (8x10) |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 35NS 32DIP
|
封裝: 32-DIP (0.600", 15.24mm) |
庫存4,000 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-PDIP |
||
ON Semiconductor |
IC FLASH 1MBIT 90NS 32DIP
|
封裝: 32-DIP (0.600", 15.24mm) |
庫存3,808 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 90ns | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 20NS 28SOJ
|
封裝: 28-BSOJ (0.300", 7.62mm Width) |
庫存5,072 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Winbond Electronics |
IC FLASH 4MBIT 40MHZ 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存6,432 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC FLASH 128MBIT 70NS 56TSOP
|
封裝: 56-TFSOP (0.724", 18.40mm Width) |
庫存5,648 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 166MHZ 256CABGA
|
封裝: 256-LBGA |
庫存3,712 |
|
SRAM | SRAM - Dual Port, Synchronous | 9Mb (256K x 36) | Parallel | 166MHz | - | 3.6ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 35NS 100TQFP
|
封裝: 100-LQFP |
庫存6,128 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 36KBIT 25NS 52PLCC
|
封裝: 52-LCC (J-Lead) |
庫存5,808 |
|
SRAM | SRAM - Dual Port, Asynchronous | 36Kb (4K x 9) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54BGA
|
封裝: 54-TFBGA |
庫存7,840 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 66TSOP
|
封裝: 66-TSSOP (0.400", 10.16mm Width) |
庫存2,160 |
|
DRAM | SDRAM - DDR | 256Mb (32M x 8) | Parallel | 166MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
SII Semiconductor Corporation |
IC EEPROM 2KBIT 5MHZ 8TSSOP
|
封裝: 8-TSSOP (0.173", 4.40mm Width) |
庫存3,248 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 5MHz | 4ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 400MHZ 134TFBGA
|
封裝: 134-TFBGA |
庫存6,852 |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 1Gb (64M x 16) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 134-TFBGA | 134-TFBGA (10x11.5) |
||
ON Semiconductor |
IC EEPROM 64KBIT 20MHZ 8DIP
|
封裝: 8-DIP (0.300", 7.62mm) |
庫存283,716 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 512M PARALLEL 200MHZ
|
封裝: 60-TFBGA |
庫存5,680 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (13x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 18M PARALLEL 165TFBGA
|
封裝: 165-TBGA |
庫存6,848 |
|
SRAM | SRAM - Synchronous | 18Mb (1M x 18) | Parallel | 200MHz | - | 3.1ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-TFBGA (13x15) |
||
Micron Technology Inc. |
SLC 1G DIE 128MX8
|
封裝: - |
庫存3,744 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
SERIAL NOR SLC 128MX8 TBGA DDP
|
封裝: 24-TBGA |
庫存5,184 |
|
FLASH | FLASH | 1Gb (128M x 8) | Xccela Bus | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 24-TBGA | 24-TPBGA |
||
Micron Technology Inc. |
IC DRAM 8G PARALLEL 1.6GHZ
|
封裝: - |
庫存4,416 |
|
DRAM | SDRAM - DDR4 | 8Gb (1G x 8) | Parallel | 1.6GHz | - | - | 1.14 V ~ 1.26 V | 0°C ~ 95°C (TC) | - | - | - |
||
Flexxon Pte Ltd |
IC FLASH 512GBIT EMMC 153FBGA
|
封裝: - |
庫存15 |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8WSON
|
封裝: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI | 104 MHz | 50µs, 3ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC EPROM 256KBIT PAR 28CERDIP
|
封裝: - |
Request a Quote |
|
EPROM | EPROM - UV | 256Kbit | Parallel | - | - | 200 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CerDip |
||
Winbond Electronics |
IC DRAM 2GBIT PAR 78VFBGA
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 1.066 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Infineon Technologies |
INFINEON
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |