頁 18 - 記憶體 - FPGA 的配置 PROM | 積體電路 (IC) | 黑森爾電子
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記憶體 - FPGA 的配置 PROM

記錄 699
頁  18/25
圖片
零件編號
製造商
描述
封裝
庫存
數量
Memory Size
Voltage - Supply
Operating Temperature
Package / Case
Supplier Device Package
hot XC17S50AVOG8C
Xilinx Inc.

IC PROM SERIAL 50K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 500kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
封裝: 8-SOIC (0.154", 3.90mm Width)
庫存318,012
500kb
3 V ~ 3.6 V
0°C ~ 70°C
8-SOIC (0.154", 3.90mm Width)
8-TSOP
XC17128EPCG20C
Xilinx Inc.

IC PROM SERIAL 128K 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 128kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
封裝: 20-LCC (J-Lead)
庫存2,352
128kb
4.75 V ~ 5.25 V
0°C ~ 70°C
20-LCC (J-Lead)
20-PLCC (9x9)
hot XC17S200APDG8I
Xilinx Inc.

IC PROM SER 200K I-TEMP 8-DIP

  • Programmable Type: OTP
  • Memory Size: 2Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
封裝: 8-DIP (0.300", 7.62mm)
庫存6,336
2Mb
3 V ~ 3.6 V
-40°C ~ 85°C
8-DIP (0.300", 7.62mm)
8-PDIP
hot XC1736EPDG8C
Xilinx Inc.

IC PROM SERIAL CONFIG 36K 8-DIP

  • Programmable Type: OTP
  • Memory Size: 36kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
封裝: 8-DIP (0.300", 7.62mm)
庫存4,192
36kb
4.75 V ~ 5.25 V
0°C ~ 70°C
8-DIP (0.300", 7.62mm)
8-PDIP
AT17N040-10TQC
Microchip Technology

IC FPGA 4M CONFIG MEM 44TQFP

  • Programmable Type: Serial EEPROM
  • Memory Size: 4Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
封裝: 44-TQFP
庫存3,440
4Mb
3 V ~ 3.6 V
0°C ~ 70°C
44-TQFP
44-TQFP (10x10)
AT17F040-30VJI
Microchip Technology

IC FLASH CONFIG 4M 20PLCC

  • Programmable Type: FLASH
  • Memory Size: 4Mb
  • Voltage - Supply: 2.97 V ~ 3.63 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
封裝: 20-LCC (J-Lead)
庫存7,520
4Mb
2.97 V ~ 3.63 V
-40°C ~ 85°C
20-LCC (J-Lead)
20-PLCC (9x9)
AT17C010-10PC
Microchip Technology

IC SRL CONFIG EEPROM 1M 8DIP

  • Programmable Type: Serial EEPROM
  • Memory Size: 1Mb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
封裝: 8-DIP (0.300", 7.62mm)
庫存5,232
1Mb
4.75 V ~ 5.25 V
0°C ~ 70°C
8-DIP (0.300", 7.62mm)
8-PDIP
AT17LV010A-10QI
Microchip Technology

IC SRL CONFIG EEPROM 1M 32-TQFP

  • Programmable Type: Serial EEPROM
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 32-TQFP
  • Supplier Device Package: 32-TQFP (7x7)
封裝: 32-TQFP
庫存3,328
1Mb
3 V ~ 3.6 V, 4.5 V ~ 5.5 V
-40°C ~ 85°C
32-TQFP
32-TQFP (7x7)
XC18V256SO20I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 20-SOIC

  • Programmable Type: In System Programmable
  • Memory Size: 256Kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存5,488
256Kb
3 V ~ 3.6 V
-40°C ~ 85°C
20-SOIC (0.295", 7.50mm Width)
20-SOIC
hot XC17V01PC20C
Xilinx Inc.

IC PROM SER 1MBIT 3.3V 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
封裝: 20-LCC (J-Lead)
庫存5,184
1Mb
3 V ~ 3.6 V
0°C ~ 70°C
20-LCC (J-Lead)
20-PLCC (9x9)
XC17S30ASO20I
Xilinx Inc.

IC PROM SER 30000 I-TEMP 20-SOIC

  • Programmable Type: OTP
  • Memory Size: 300kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存2,272
300kb
3 V ~ 3.6 V
-40°C ~ 85°C
20-SOIC (0.295", 7.50mm Width)
20-SOIC
XC17S200AVQ44I
Xilinx Inc.

IC PROM SER 200000 I-TEMP 44VQFP

  • Programmable Type: OTP
  • Memory Size: 2Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
封裝: 44-TQFP
庫存5,488
2Mb
3 V ~ 3.6 V
-40°C ~ 85°C
44-TQFP
44-VQFP (10x10)
hot XC17S15AVO8C
Xilinx Inc.

IC PROM SER 5K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 150kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
封裝: 8-SOIC (0.154", 3.90mm Width)
庫存127,392
150kb
3 V ~ 3.6 V
0°C ~ 70°C
8-SOIC (0.154", 3.90mm Width)
8-TSOP
hot XC17S100ASO20C
Xilinx Inc.

IC PROM SER 100000 C-TEMP 20SOIC

  • Programmable Type: OTP
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存6,192
1Mb
3 V ~ 3.6 V
0°C ~ 70°C
20-SOIC (0.295", 7.50mm Width)
20-SOIC
hot XC1765EPD8I
Xilinx Inc.

IC PROM SER I-TEMP 3.3V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 65kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
封裝: 8-DIP (0.300", 7.62mm)
庫存13,800
65kb
4.5 V ~ 5.5 V
-40°C ~ 85°C
8-DIP (0.300", 7.62mm)
8-PDIP
hot XC17512LPD8I
Xilinx Inc.

IC PROM SER I-TEMP 512K 8-DIP

  • Programmable Type: OTP
  • Memory Size: 512kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
封裝: 8-DIP (0.300", 7.62mm)
庫存6,976
512kb
3 V ~ 3.6 V
-40°C ~ 85°C
8-DIP (0.300", 7.62mm)
8-PDIP
hot XC1736EPC20C
Xilinx Inc.

IC PROM SER C-TEMP 36K 20-PLCC

  • Programmable Type: OTP
  • Memory Size: 36kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
封裝: 20-LCC (J-Lead)
庫存116,232
36kb
4.75 V ~ 5.25 V
0°C ~ 70°C
20-LCC (J-Lead)
20-PLCC (9x9)
AT17LV128-10SC
Microchip Technology

IC SRL CONFIG EEPROM 128K 20SOIC

  • Programmable Type: Serial EEPROM
  • Memory Size: 128kb
  • Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存3,264
128kb
3 V ~ 3.6 V, 4.75 V ~ 5.25 V
0°C ~ 70°C
20-SOIC (0.295", 7.50mm Width)
20-SOIC
AT17C512-10JI
Microchip Technology

IC SER CONFIG PROM 512K 20PLCC

  • Programmable Type: Serial EEPROM
  • Memory Size: 512kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
封裝: 20-LCC (J-Lead)
庫存2,304
512kb
4.5 V ~ 5.5 V
-40°C ~ 85°C
20-LCC (J-Lead)
20-PLCC (9x9)
XQ17V16VQ44N
Xilinx Inc.

IC PROM SERIAL 16MB 44-VQFN

  • Programmable Type: OTP
  • Memory Size: 16Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
封裝: 44-TQFP
庫存2,880
16Mb
3 V ~ 3.6 V
-55°C ~ 125°C (TJ)
44-TQFP
44-VQFP (10x10)
XC18V02PCG44C0100
Xilinx Inc.

XC18V02PCG44C0100

  • Programmable Type: In System Programmable
  • Memory Size: 2Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存7,280
2Mb
3 V ~ 3.6 V
0°C ~ 70°C
44-LCC (J-Lead)
44-PLCC (16.59x16.59)
XC18V01SO20C0100
Xilinx Inc.

RE-PROGRAMMABLE 1MB PROM

  • Programmable Type: In System Programmable
  • Memory Size: 1Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存4,832
1Mb
3 V ~ 3.6 V
0°C ~ 70°C
20-SOIC (0.295", 7.50mm Width)
20-SOIC
AT17F040A-30QC
Microchip Technology

IC FLASH CONFIG 4M 32TQFP

  • Programmable Type: FLASH
  • Memory Size: 4Mb
  • Voltage - Supply: 2.97 V ~ 3.63 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 32-TQFP
  • Supplier Device Package: 32-TQFP (7x7)
封裝: 32-TQFP
庫存4,352
4Mb
2.97 V ~ 3.63 V
0°C ~ 70°C
32-TQFP
32-TQFP (7x7)
AT18F040-30XU
Microchip Technology

IC FLASH CONFIG 4MBIT 20-TSSOP

  • Programmable Type: FLASH
  • Memory Size: 4Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
封裝: 20-TSSOP (0.173", 4.40mm Width)
庫存4,400
4Mb
3 V ~ 3.6 V
-40°C ~ 85°C
20-TSSOP (0.173", 4.40mm Width)
20-TSSOP
AT17F16-30CU
Microchip Technology

IC FLASH CONFIG 16M 8LAP

  • Programmable Type: FLASH
  • Memory Size: 16Mb
  • Voltage - Supply: 2.97 V ~ 3.63 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-TDFN
  • Supplier Device Package: 8-LAP (6x6)
封裝: 8-TDFN
庫存6,420
16Mb
2.97 V ~ 3.63 V
-40°C ~ 85°C
8-TDFN
8-LAP (6x6)
EPCS4SI8NAA
Intel

IC CONFIG DEVICE

  • Programmable Type: In System Programmable
  • Memory Size: 4MB
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
封裝: 8-SOIC (0.154", 3.90mm Width)
庫存4,656
4MB
2.7 V ~ 3.6 V
-40°C ~ 85°C
8-SOIC (0.154", 3.90mm Width)
8-SOIC
hot EPC16UI88N
Intel

IC CONFIG DEVICE 88UBGA

  • Programmable Type: In System Programmable
  • Memory Size: 16Mb
  • Voltage - Supply: ± 2.25 V ~ 6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 88-LFBGA
  • Supplier Device Package: 88-UBGA (11x8)
封裝: 88-LFBGA
庫存6,480
16Mb
± 2.25 V ~ 6 V
-40°C ~ 85°C
88-LFBGA
88-UBGA (11x8)
XC17S150XLPD8C
AMD

CONFIG MEMORY, 1M BITS, SERIAL

  • Programmable Type: -
  • Memory Size: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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