圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP W/DSP LQFP-176-2
|
封裝: 176-LQFP |
庫存5,552 |
|
JTAG, PCM, SCI/SPI | 4 | - | - | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | PG-LQFP-176 |
||
Exar Corporation |
IC LIU SH T1/E1/J1 OCTAL 225BGA
|
封裝: 225-BGA |
庫存4,848 |
|
LIU | 8 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Maxim Integrated |
IC TXRX SGL DS3/E3 400BGA
|
封裝: 400-BBGA |
庫存4,736 |
|
DS3, E3 | 1 | 3.135 V ~ 3.465 V | 273mA | - | -40°C ~ 85°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
封裝: 256-LBGA Exposed Pad |
庫存8,880 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC TXRX T1 QUAD 5V 256BGA
|
封裝: 256-BGA |
庫存4,816 |
|
T1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Microchip Technology |
IC MONO FEATURE PHONE EMI 44SSOP
|
封裝: 44-SOP (0.291", 7.40mm Width) |
庫存49,644 |
|
- | 1 | 3.1 V ~ 3.5 V | - | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
封裝: 256-LBGA Exposed Pad |
庫存3,888 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC SLIC 3.3V 48LQFP
|
封裝: 48-LQFP |
庫存6,256 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-TQFP (7x7) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 60QFN
|
封裝: 60-WFQFN Exposed Pad |
庫存5,264 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Silicon Labs |
IC PROSLIC FXS DC-DC CTLR 47LGA
|
封裝: 60-WFQFN Exposed Pad |
庫存2,100 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Silicon Labs |
IC PROSLIC FXS DC-DC CTLR 42QFN
|
封裝: 42-WFQFN Exposed Pad |
庫存7,984 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-DFN
|
封裝: 28-VDFN Exposed Pad |
庫存6,752 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
Inphi Corporation |
IC ETH AGGREGATOR 4PORT 1024-BGA
|
封裝: 1024-BGA |
庫存3,328 |
|
Interlaken | - | - | - | - | - | Surface Mount | 1024-BGA | 1024-BGA (33x33) |
||
Microsemi Solutions Sdn Bhd. |
25-PORT L2 SWITCH W/12 GE CUPHY
|
封裝: - |
庫存4,992 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Microsemi Corporation |
IC TRANSCODER QUAD ADPCM 28SOIC
|
封裝: 28-SOIC (0.295", 7.50mm Width) |
庫存7,712 |
|
- | 4 | 4.5 V ~ 5.5 V | 5mA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC
|
封裝: - |
庫存3,744 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SWITCH FABRIC
|
封裝: - |
庫存6,720 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 48TQFP
|
封裝: - |
庫存5,232 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH HV 48LQFP
|
封裝: - |
庫存3,632 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
IC DIGITAL SWITCH 12K CH 272BGA
|
封裝: 272-BBGA |
庫存7,808 |
|
- | - | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
OCTAL T1/E1 SHORT HAUL LIU
|
封裝: - |
Request a Quote |
|
E1, T1 | 8 | 3.13V ~ 3.47V | 65mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Infineon Technologies |
TSLIC-E TWIN SUBSCRIBER LINE INT
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
Q-SMINTIX 2B1Q SECOND GEN. MODUL
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
VINETIC VOICE OVER IP PROCESSOR
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
PROXY (HYBRID TO ADTRAN) VP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETH SWITCH 16GE 10GE
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |