圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LIU E1/T1/J1 160LBGA
|
封裝: 160-LBGA |
庫存2,432 |
|
E1, HDLC, J1, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 160-LBGA | P-LBGA-160 |
||
Microsemi Corporation |
IC DGTL SWITCH FLEX 344BGA
|
封裝: 344-BBGA |
庫存28,200 |
|
- | 1 | 3 V ~ 3.6 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 344-BBGA | 344-PBGA (27x27) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 32QFN
|
封裝: 32-VQFN Exposed Pad |
庫存6,784 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
封裝: 128-LQFP |
庫存3,056 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 410mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
封裝: 256-LBGA Exposed Pad |
庫存6,976 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC LINEFEED INTRFC SI321X 16SOIC
|
封裝: 16-SOIC (0.154", 3.90mm Width) Exposed Pad |
庫存18,444 |
|
PCM, Serial, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 800mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) Exposed Pad | 16-SOIC |
||
Silicon Labs |
IC PROSLIC W/DC-DC CONV 38TSSOP
|
封裝: 38-TFSOP (0.173", 4.40mm Width) |
庫存192,852 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 100-BGA
|
封裝: 100-LFBGA, CSPBGA |
庫存7,072 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Exar Corporation |
IC LIU SH E1 OCTAL 225BGA
|
封裝: - |
庫存6,064 |
|
LIU | 8 | 3.14 V ~ 3.47 V | - | - | - | - | - | - |
||
Exar Corporation |
IC TI/E1/J1 FRAMER/LIU 329FBGA
|
封裝: 329-FBGA |
庫存10,152 |
|
- | 8 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 329-FBGA | 329-FPBGA (17x17) |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
封裝: 16-SOIC (0.295", 7.50mm Width) |
庫存2,656 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
封裝: 28-SOIC (0.295", 7.50mm Width) |
庫存2,336 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
SINGLE-CHIP SONET/SDH TRANSPORT
|
封裝: - |
庫存3,424 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
DUAL 10G (R)-XAUI PHY WITH PREMI
|
封裝: - |
庫存3,696 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
6-PORT GE SWITCH WITH CUPHY
|
封裝: - |
庫存2,272 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE
|
封裝: - |
庫存6,784 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 64TQFP
|
封裝: - |
庫存3,312 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC SOLAC FXS+FXO 1CH 48LQFP
|
封裝: - |
庫存5,472 |
|
4-Wire Serial | 2 | - | - | - | - | Surface Mount | - | 48-LQFP |
||
Microchip Technology |
2CH ADSL2+ LINE DRIVER 12V QFN16
|
封裝: - |
庫存22,530 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
TSLIC-E TWIN SUBSCRIBER LINE INT
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
FRAMER E3/T3
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
FLEXISLIC SLIC
|
封裝: - |
Request a Quote |
|
2-Wire | 1 | 4.75V ~ 5.25V | 2.8mA | 290 mW | 0°C ~ 70°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | PG-DSO-24-8 |
||
Broadcom Limited |
24GE + 4XGE L2+ MANAGED SWITCH
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
MUNICH256 MULTI CHANNEL NETWORK
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
POWERLINE COMMUNICATION AFETRANS
|
封裝: - |
Request a Quote |
|
3-Wire, Serial | 1 | 3V ~ 3.6V | 220mA | 2 W | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Broadcom Limited |
16X1G SWITCH
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISDN HIGH VOLTAGE POWER CONTROLL
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |