圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC INCA-IP PHONE LBGA-324
|
封裝: 324-LBGA |
庫存7,152 |
|
- | - | - | - | - | - | Surface Mount | 324-LBGA | PG-LBGA-324-3 |
||
Infineon Technologies |
IC CODEC FILTER 4CHAN MQFP-64
|
封裝: 64-QFP |
庫存7,264 |
|
IOM-2 PCM, SPI | 4 | 5V | 26mA | 130mW | - | Surface Mount | 64-QFP | P-64-MQFP |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
封裝: - |
庫存7,232 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Maxim Integrated |
IC FRAMER SINGLE DS3/E3 144CSBGA
|
封裝: 144-BGA, CSPBGA |
庫存3,136 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 60QFN
|
封裝: 60-WFQFN Exposed Pad |
庫存4,544 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176TQFP
|
封裝: 176-LQFP |
庫存5,840 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 SGL 44TQFP
|
封裝: 44-LQFP |
庫存2,100 |
|
LIU | 1 | 4.75 V ~ 5.25 V | 180mA | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP (10x10) |
||
IXYS Integrated Circuits Division |
IC MOD DAA FULLWAVE CID/LOOP PCB
|
封裝: 18-DIP Module (0.850", 21.59mm), 11 Leads |
庫存6,496 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Maxim Integrated |
IC TXRX T1/E1 QUAD 3.3V 256-BGA
|
封裝: 256-BGA |
庫存15,456 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-BGA
|
封裝: 100-LFBGA, CSPBGA |
庫存3,200 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 1-CHIP 100CSBGA
|
封裝: 100-LFBGA, CSPBGA |
庫存16,908 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Maxim Integrated |
IC TRANSCEIVER T1 IND 40-DIP
|
封裝: 40-DIP (0.600", 15.24mm) |
庫存18,000 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Microsemi Corporation |
IC TDM SWITCH 512CH 144LBGA
|
封裝: 144-LBGA |
庫存9,804 |
|
- | 1 | 3 V ~ 3.6 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Silicon Labs |
IC LINE-SIDE DAA 16SOIC
|
封裝: 16-SOIC (0.154", 3.90mm Width) |
庫存234,396 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
TEMAP 84FDL, LF BUMP
|
封裝: - |
庫存3,984 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
DUAL GIGABIT IEEE 1588 10NS R/Q/
|
封裝: 256-BGA |
庫存3,824 |
|
RMII | 2 | 1V, 2.5V | - | - | - | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 44PLCC
|
封裝: 44-LCC (J-Lead) |
庫存3,392 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Microchip Technology |
IC SLIC 2CH NGCCC 48QFN 7X7
|
封裝: 48-QFN |
庫存2,848 |
|
2-Wire | - | - | - | - | - | Surface Mount | 48-QFN | 48-QFN |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 64QFN
|
封裝: 64-QFN |
庫存6,704 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 64-QFN | 64-QFN |
||
Microchip Technology |
IC ABS VOICEPORT 2CH FXS 64QFN
|
封裝: 64-VFQFN Exposed Pad |
庫存4,176 |
|
PCM | 1 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Harris Corporation |
SLIC, PDSO28
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
MULTI CHANNEL NETWORK INTERFACE
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
TELCOM INTERFACE IC
|
封裝: - |
Request a Quote |
|
- | 2 | - | - | - | - | - | - | - |
||
Lantiq |
OCTALLIU-LONG AND SHORT HAUL LIN
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
DUAL T1/ E1 LINE INTERFACE
|
封裝: - |
Request a Quote |
|
E1, T1 | 2 | 4.75V ~ 5.25V | - | 310 mW | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.26x24.26) |
||
Sanyo |
DTMF RECEIVER
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
VDSL 35B + 11AX WIFI INTEGRATED
|
封裝: - |
Request a Quote |
|
ADSL, DSL, USB | 1 | - | - | - | - | - | - | - |
||
Microchip Technology |
6 PORT CARRIER ETHERNET SWITCH
|
封裝: - |
Request a Quote |
|
SPI, UART, 2-Wire | 7 | - | - | 1.5 W | -40°C ~ 125°C | Surface Mount | 284-QFP | 284-TQFP (24x24) |